TSI384-133ILV - PCIe to PCI-X Bridge 256-BGA | Renesas Electronics
Référence : TSI384-133ILV ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.5 | $9 750,00 |
| 1 000 | $17.8 | $17 800,00 |
TSI384-133ILV Présentation
A PCI-to-PCI bridge is a transparent or non-transparent protocol converter that maps transactions between two distinct PCI-family bus segments. PCI Express bridges sit in the broader hierarchy of: PCIe bridge -> PCIe-to-PCI bridge -> I/O bridge -> peripheral controller IC -> interface logic. Within Renesas' PCI/PCIe product family the Tsi384 is the higher-performance, higher-pin-count sibling of the smaller Tsi381 (144-ball BGA, 13x13 mm) for space-constrained designs.
Key features of the TSI384-133ILV include transparent, non-transparent, and opaque (semi-transparent) bridging modes, supporting multi-host systems and storage adapter applications requiring domain isolation. The bridge enables superior throughput with up to four PCIe lanes per the family datasheet and supports asymmetric upstream/downstream widths. Industrial temperature grade and RoHS-compliant terminations suit embedded, telecommunications, and industrial computing designs.
Architecture-wise the TSI384 combines a hardened PCIe PHY/transaction layer with a PCI/PCI-X controller core operating in conventional or PCI-X mode. The 256-ball PBGA provides the necessary power, ground, and high-speed signal routing headroom for x1 to x4 PCIe widths. Operating supply voltage is 1.2 V core plus I/O rails, supplied via multiple pins.
Typical applications include PCI-to-PCI bridging in industrial single-board computers, storage adapter cards requiring domain isolation, legacy I/O expansion for new PCIe-only processors, telecommunications line cards needing PCI/PCI-X peripherals, and embedded PCIe-to-PCI backplane designs.
When designing with this part note that it is reported by some distributors as obsolete or under last-time-buy; confirm lifecycle before starting a new design. Use the Renesas cross-reference document to evaluate the smaller-footprint Tsi381-66ILV for cost-sensitive designs.
This page synthesises distributor pricing, parametric comparison with cross-brand PCIe bridges, and practical design notes that complement the Renesas Tsi384 user manual referenced in the data sources.
Alternatives de remplacement direct pour TSI384-133ILV — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TSI384-133IL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TSI381-66ILV
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TSI384-133ILV Spécifications
| Fonction | PCI Express to PCI/PCI-X Bridge |
| Protocol | PCIe to PCI/PCI-X |
| PCIe Lanes Supported | x1 (up to x4 per family datasheet) |
| PCI/PCI-X Max Frequency | 133 MHz (PCI-X), 66 MHz (PCI) |
| Bridging Modes | Transparent, Non-transparent, Opaque (semi-transparent) |
| Tension d'alimentation de fonctionnement | 1.2 V (core) |
| Boîtier | 256-ball PBGA (17x17 mm) |
| Type de montage | Surface Mount (BGA) |
| Temperature Grade | Industrial |
| Statut RoHS | RoHS Compliant (V suffix) |
| Bus Width | 32-bit / 64-bit PCI |
| Application | PCI-to-PCI Bridge, I/O bridging |
| Packaging | Tray |
| Multi-host Support | Yes (via non-transparent bridging) |
| Family | Tsi384 series |
| Manufacturer | Renesas Electronics (formerly IDT) |
Guide de configuration des broches du TSI384-133ILV 256-ball pbga (17x17 mm)
Configuration des broches du TSI384-133ILV (boîtier 256-ball pbga (17x17 mm)). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour TSI384-133ILV.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
TSI384-133ILV convient pour 6 applications: Industrial Single-Board Computer PCI Expansion, Storage Adapter / RAID Controller Card, Telecommunications Line Card, PCI-X Backplane-to-PCIe Processor Adapter, Embedded Vision and Data Acquisition System, Legacy PCI-X I/O Card Modernization.
Industrial Single-Board Computer PCI Expansion
Industrial SBCs increasingly pair an x86 SoC with only PCIe native I/O. The TSI384-133ILV bridges PCIe to PCI-X 133 MHz, enabling legacy industrial cards (cPCI peripherals, motion controllers, data-acquisition cards) to remain in service on new PCIe-only boards. The 256-ball 17x17 mm PBGA provides industrial-grade thermal and mechanical tolerance; transparent mode maintains host enumeration through standard BIOS POST routines.
Recommandé
Storage Adapter / RAID Controller Card
PCI-X RAID and Fibre Channel adapter cards use the TSI384-133ILV in non-transparent mode so the host system and the adapter's embedded processor occupy distinct PCI address domains. This enables multi-initiator storage topologies and failover. The 133 MHz PCI-X bus supporting 32/64-bit widths delivers the bandwidth legacy RAID controllers expect; the 256-ball BGA accommodates four-lane PCIe uplink without signal-integrity compromise.
Recommandé
Telecommunications Line Card
Telecom ATCA/AdvancedTCA and proprietary line cards retain PCI-X for legacy DSP and framer connectivity even as backplanes migrate to PCIe fabric. The TSI384-133ILV performs opaque/semi-transparent bridging so individual line cards can elect transparent to host or isolated for hot-swap rebuild. The industrial temperature grade and 133 MHz PCI-X support meet telecom environmental and bandwidth requirements, while the 256-ball BGA fits typical line-card real-estate budgets.
Recommandé
PCI-X Backplane-to-PCIe Processor Adapter
When migrating a legacy PCI-X chassis to a modern PCIe-only processor board, the TSI384-133ILV is a drop-in bridge that preserves the backplane investment. The chip's transparent mode handles enumeration so the chassis's existing PCI-X peripherals appear native to the new host OS. The 256-ball 17x17 mm BGA compactly sits in the adapter card form factor, and the part's multi-host support enables dual-host failover configurations.
Recommandé
Embedded Vision and Data Acquisition System
Machine-vision and high-speed data-acquisition systems often attach legacy PCI-X frame grabbers and DSP cards to PCIe-only host processors. The TSI384-133ILV maintains 64-bit 133 MHz PCI-X bandwidth to those legacy endpoints while presenting a clean PCIe face to the modern host. Industrial temperature rating suits factory-floor deployments, and the bridge's wide PCIe flexibility lets the system designer trade lane count vs cable length.
Recommandé
Legacy PCI-X I/O Card Modernization
Designers modernizing embedded controller cards where firmware expects PCI-X peripherals can retain PCI-X endpoints by inserting a TSI384-133ILV between a PCIe host SoC and the legacy PCI-X bus. The chip's transparent mode requires no firmware change to the host OS, shortening retrofit cycles. 256-ball BGA package density and industrial temperature grade make it suitable for harsh-environment enclosures and aerospace mission-computing subsystems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TSI384-133ILV — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TSI384-133IL | TSI381-66ILV |
|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 256-PBGA (17x17 mm) | 256-PBGA (17x17 mm) - identical footprint | 144-PBGA (13x13 mm) - DIFFERENT footprint |
| PCIe Lanes | x1 (up to x4 per family) | x1 (up to x4 per family) | x1 per TSI381 family |
| PCI-X Max Frequency | 133 MHz | 133 MHz | 66 MHz (-53%) |
| PCI Max Frequency | 66 MHz | 66 MHz | 66 MHz |
| RoHS Compliant | Yes (V suffix) | No (non-V, lead terminals) | Yes (V suffix) |
| Non-transparent Bridging | Yes | Yes | Yes |
| Temperature Grade | Industrial | Industrial | Industrial |
Principaux différenciateurs
- Highest available PCI-X frequency in the Renesas Tsi38x family (vs TSI381-66ILV)
- RoHS-compliant terminal finish (V suffix) (vs TSI384-133IL)
- Non-transparent bridging for multi-host systems (vs TSI381-66ILV)
Notes de conception
The 256-ball PBGA dissipates measurable heat during sustained PCI-X 133 MHz traffic. Follow Renesas' Tsi384 Board Design Guidelines: use a 4-layer PCB with a continuous ground plane under the BGA, stitching vias around the perimeter, and thermal vias in the centre pad land pattern. Do not rely on the BGA balls alone for thermal conduction when ambient exceeds 70C.
PCIe traces must be length-matched to within 5 mil on a per-lane basis and routed with 85-ohm differential impedance. PCI-X 133 MHz traces require controlled-impedance routing (60 ohm single-ended, 100 ohm differential for PCI-X) and via stubs kept short. Use the Tsi384 Board Design Guidelines section in the user manual for trace width and spacing examples.
Decouple the TSI384-133ILV with 0.1 uF ceramic capacitors within 100 mil of every power pin plus a single 10 uF bulk capacitor per rail. The reference clock input (REFCLK+ / REFCLK-) requires a 100 ohm differential termination within the source impedance - the user manual provides the recommended termination topology. PCIe transmit pre-emphasis and receiver equalisation settings should be configured via software registers rather than left at defaults.
Do not assume the TSI384 is hot-swappable in opaque/non-transparent mode without external hot-swap controller logic; the bridge handles protocol conversion only. Verify the latest lifecycle status (some distributors report obsolete) before starting new designs. When migrating code between TSI384 and TSI381, re-validate the reduced PCI-X 66 MHz ceiling on the TSI381 - it is not a drop-in performance equivalent.
Informations de conformité
V suffix indicates RoHS-compliant terminal finish per the Renesas cross-reference document. REACH, halogen-free, and conflict minerals statements must be confirmed from the manufacturer's compliance declaration as they were not present in the provided distributor data.
