TSI384-133ILV - PCIe to PCI-X Bridge 256-BGA | Renesas Electronics
MPN： TSI384-133ILV ✗ 停產TSI384-133ILV 概覽
A PCI-to-PCI bridge is a transparent or non-transparent protocol converter that maps transactions between two distinct PCI-family bus segments. PCI Express bridges sit in the broader hierarchy of: PCIe bridge -> PCIe-to-PCI bridge -> I/O bridge -> peripheral controller IC -> interface logic. Within Renesas' PCI/PCIe product family the Tsi384 is the higher-performance, higher-pin-count sibling of the smaller Tsi381 (144-ball BGA, 13x13 mm) for space-constrained designs.
Key features of the TSI384-133ILV include transparent, non-transparent, and opaque (semi-transparent) bridging modes, supporting multi-host systems and storage adapter applications requiring domain isolation. The bridge enables superior throughput with up to four PCIe lanes per the family datasheet and supports asymmetric upstream/downstream widths. Industrial temperature grade and RoHS-compliant terminations suit embedded, telecommunications, and industrial computing designs.
Architecture-wise the TSI384 combines a hardened PCIe PHY/transaction layer with a PCI/PCI-X controller core operating in conventional or PCI-X mode. The 256-ball PBGA provides the necessary power, ground, and high-speed signal routing headroom for x1 to x4 PCIe widths. Operating supply voltage is 1.2 V core plus I/O rails, supplied via multiple pins.
Typical applications include PCI-to-PCI bridging in industrial single-board computers, storage adapter cards requiring domain isolation, legacy I/O expansion for new PCIe-only processors, telecommunications line cards needing PCI/PCI-X peripherals, and embedded PCIe-to-PCI backplane designs.
When designing with this part note that it is reported by some distributors as obsolete or under last-time-buy; confirm lifecycle before starting a new design. Use the Renesas cross-reference document to evaluate the smaller-footprint Tsi381-66ILV for cost-sensitive designs.
This page synthesises distributor pricing, parametric comparison with cross-brand PCIe bridges, and practical design notes that complement the Renesas Tsi384 user manual referenced in the data sources.
直接替換替代品，適用於 TSI384-133ILV — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
TSI384-133IL
✅ 直接替換📋 參考替代品（不在目錄中）
TSI381-66ILV
✅ 直接替換📋 參考替代品（不在目錄中）
TSI384-133ILV 規格
| 功能 | PCI Express to PCI/PCI-X Bridge |
| Protocol | PCIe to PCI/PCI-X |
| PCIe Lanes Supported | x1 (up to x4 per family datasheet) |
| PCI/PCI-X Max Frequency | 133 MHz (PCI-X), 66 MHz (PCI) |
| Bridging Modes | Transparent, Non-transparent, Opaque (semi-transparent) |
| 工作電源電壓 | 1.2 V (core) |
| 封裝 | 256-ball PBGA (17x17 mm) |
| 安裝類型 | Surface Mount (BGA) |
| Temperature Grade | Industrial |
| RoHS 狀態 | RoHS Compliant (V suffix) |
| Bus Width | 32-bit / 64-bit PCI |
| Application | PCI-to-PCI Bridge, I/O bridging |
| Packaging | Tray |
| Multi-host Support | Yes (via non-transparent bridging) |
| Family | Tsi384 series |
| Manufacturer | Renesas Electronics (formerly IDT) |
TSI384-133ILV 256-ball pbga (17x17 mm) 腳位配置指南
TSI384-133ILV（256-ball pbga (17x17 mm) 封裝）的腳位配置。 腳位編號、功能與連接圖定義於製造商資料手冊中。請參閱該手冊以取得確切的封裝尺寸與焊接指引。
無詳細腳位定義資料： TSI384-133ILV.
請參閱 資料表 以查看完整腳位配置。
典型應用
TSI384-133ILV 適用於 6 應用s: Industrial Single-Board Computer PCI Expansion, Storage Adapter / RAID Controller Card, Telecommunications Line Card, PCI-X Backplane-to-PCIe Processor Adapter, Embedded Vision and Data Acquisition System, Legacy PCI-X I/O Card Modernization.
Industrial Single-Board Computer PCI Expansion
Industrial SBCs increasingly pair an x86 SoC with only PCIe native I/O. The TSI384-133ILV bridges PCIe to PCI-X 133 MHz, enabling legacy industrial cards (cPCI peripherals, motion controllers, data-acquisition cards) to remain in service on new PCIe-only boards. The 256-ball 17x17 mm PBGA provides industrial-grade thermal and mechanical tolerance; transparent mode maintains host enumeration through standard BIOS POST routines.
推薦
Storage Adapter / RAID Controller Card
PCI-X RAID and Fibre Channel adapter cards use the TSI384-133ILV in non-transparent mode so the host system and the adapter's embedded processor occupy distinct PCI address domains. This enables multi-initiator storage topologies and failover. The 133 MHz PCI-X bus supporting 32/64-bit widths delivers the bandwidth legacy RAID controllers expect; the 256-ball BGA accommodates four-lane PCIe uplink without signal-integrity compromise.
推薦
Telecommunications Line Card
Telecom ATCA/AdvancedTCA and proprietary line cards retain PCI-X for legacy DSP and framer connectivity even as backplanes migrate to PCIe fabric. The TSI384-133ILV performs opaque/semi-transparent bridging so individual line cards can elect transparent to host or isolated for hot-swap rebuild. The industrial temperature grade and 133 MHz PCI-X support meet telecom environmental and bandwidth requirements, while the 256-ball BGA fits typical line-card real-estate budgets.
推薦
PCI-X Backplane-to-PCIe Processor Adapter
When migrating a legacy PCI-X chassis to a modern PCIe-only processor board, the TSI384-133ILV is a drop-in bridge that preserves the backplane investment. The chip's transparent mode handles enumeration so the chassis's existing PCI-X peripherals appear native to the new host OS. The 256-ball 17x17 mm BGA compactly sits in the adapter card form factor, and the part's multi-host support enables dual-host failover configurations.
推薦
Embedded Vision and Data Acquisition System
Machine-vision and high-speed data-acquisition systems often attach legacy PCI-X frame grabbers and DSP cards to PCIe-only host processors. The TSI384-133ILV maintains 64-bit 133 MHz PCI-X bandwidth to those legacy endpoints while presenting a clean PCIe face to the modern host. Industrial temperature rating suits factory-floor deployments, and the bridge's wide PCIe flexibility lets the system designer trade lane count vs cable length.
推薦
Legacy PCI-X I/O Card Modernization
Designers modernizing embedded controller cards where firmware expects PCI-X peripherals can retain PCI-X endpoints by inserting a TSI384-133ILV between a PCIe host SoC and the legacy PCI-X bus. The chip's transparent mode requires no firmware change to the host OS, shortening retrofit cycles. 256-ball BGA package density and industrial temperature grade make it suitable for harsh-environment enclosures and aerospace mission-computing subsystems.
推薦
推薦產品摘要
工程參考資料，適用於 TSI384-133ILV — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | TSI384-133IL | TSI381-66ILV |
|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | 256-PBGA (17x17 mm) | 256-PBGA (17x17 mm) - identical footprint | 144-PBGA (13x13 mm) - DIFFERENT footprint |
| PCIe Lanes | x1 (up to x4 per family) | x1 (up to x4 per family) | x1 per TSI381 family |
| PCI-X Max Frequency | 133 MHz | 133 MHz | 66 MHz (-53%) |
| PCI Max Frequency | 66 MHz | 66 MHz | 66 MHz |
| RoHS Compliant | Yes (V suffix) | No (non-V, lead terminals) | Yes (V suffix) |
| Non-transparent Bridging | Yes | Yes | Yes |
| Temperature Grade | Industrial | Industrial | Industrial |
主要差異化特點
- Highest available PCI-X frequency in the Renesas Tsi38x family (對比TSI381-66ILV)
- RoHS-compliant terminal finish (V suffix) (對比TSI384-133IL)
- Non-transparent bridging for multi-host systems (對比TSI381-66ILV)
設計說明
The 256-ball PBGA dissipates measurable heat during sustained PCI-X 133 MHz traffic. Follow Renesas' Tsi384 Board Design Guidelines: use a 4-layer PCB with a continuous ground plane under the BGA, stitching vias around the perimeter, and thermal vias in the centre pad land pattern. Do not rely on the BGA balls alone for thermal conduction when ambient exceeds 70C.
PCIe traces must be length-matched to within 5 mil on a per-lane basis and routed with 85-ohm differential impedance. PCI-X 133 MHz traces require controlled-impedance routing (60 ohm single-ended, 100 ohm differential for PCI-X) and via stubs kept short. Use the Tsi384 Board Design Guidelines section in the user manual for trace width and spacing examples.
Decouple the TSI384-133ILV with 0.1 uF ceramic capacitors within 100 mil of every power pin plus a single 10 uF bulk capacitor per rail. The reference clock input (REFCLK+ / REFCLK-) requires a 100 ohm differential termination within the source impedance - the user manual provides the recommended termination topology. PCIe transmit pre-emphasis and receiver equalisation settings should be configured via software registers rather than left at defaults.
Do not assume the TSI384 is hot-swappable in opaque/non-transparent mode without external hot-swap controller logic; the bridge handles protocol conversion only. Verify the latest lifecycle status (some distributors report obsolete) before starting new designs. When migrating code between TSI384 and TSI381, re-validate the reduced PCI-X 66 MHz ceiling on the TSI381 - it is not a drop-in performance equivalent.
合規資訊
V suffix indicates RoHS-compliant terminal finish per the Renesas cross-reference document. REACH, halogen-free, and conflict minerals statements must be confirmed from the manufacturer's compliance declaration as they were not present in the provided distributor data.
