TUSB7340IRKMT - USB 3.0 4-Port xHCI Host Controller | TI
Référence : TUSB7340IRKMT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
TUSB7340IRKMT Présentation
A USB xHCI host controller is an interface IC that implements the eXtensible Host Controller Interface standard, offloading USB protocol management from the host CPU. In the power-management and interface hierarchy, it sits between a PCIe root complex and downstream USB physical ports, translating PCI Express transactions into USB 3.0 SuperSpeed, high-speed, full-speed, or low-speed traffic on each downstream port.
Key features include four downstream USB 3.0 ports, support for SuperSpeed (5 Gbps), high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) data rates, and a PCIe x1 Gen 2 (5 GT/s) upstream link. This makes the TUSB7340 well suited to designs that must add multiple SuperSpeed ports to an x86 or embedded host with a single PCIe lane.
Technically, the TUSB7340 integrates the xHCI controller, PCIe Gen 2 PHY, and USB 3.0 PHYs in CMOS on a single die, with power rails of 1.1 V (core) and 3.3 V (I/O and PHY). The integrated PHYs reduce bill-of-materials complexity and board area compared with discrete PHY-plus-controller architectures. According to the TI TUSB73x0 datasheet, the TUSB7340 and TUSB7320 share a pin-compatible 100-pin RKM package, enabling a common PCB design that supports either two-port or four-port configurations.
Typical applications include docking stations, PCI Express add-in cards, embedded industrial computing, and motherboards requiring additional SuperSpeed ports. The four-port count directly addresses designs where hub-chip cascading is undesirable for latency or BOM reasons.
Design consideration: because SuperSpeed links run at 5 Gbps, controlled-impedance routing of the USB 3.0 differential pairs and the PCIe link with proper reference planes is essential; follow the TI datasheet layout guidelines for the WQFN-MR exposed-pad package, which must be soldered to a ground pour for thermal and return-path integrity.
This page synthesizes distributor pricing context, verified drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour TUSB7340IRKMT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TUSB7340IRKMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB7340RKMT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB7340RKMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB7320IRKMT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB7320IRKMR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TUSB7340IRKMT Spécifications
| Fonction | USB 3.0 xHCI Host Controller |
| USB Standard | USB 3.0 (SuperSpeed) |
| Number of Downstream Ports | 4 |
| SuperSpeed Data Rate | 5 Gbps |
| Host Interface | PCIe x1 Gen 2 |
| USB Data Rates Supported | SuperSpeed / High-Speed / Full-Speed / Low-Speed |
| Supply Voltage (Core) | 1.1 V |
| Supply Voltage (I/O) | 3.3 V |
| Plage de température de fonctionnement | -40C to +85C |
| Boîtier | 100-WQFN-MR (RKM), 9x9 mm |
| Nombre de broches | 100 |
| Type de montage | Surface Mount |
| Technology | CMOS |
| Product Family | TUSB73x0 (pin-compatible with TUSB7320) |
| Statut RoHS | unknown |
Guide de configuration des broches du TUSB7340IRKMT 100-wqfn-mr (rkm), 9x9 mm
Configuration des broches du TUSB7340IRKMT (boîtier 100-wqfn-mr (rkm), 9x9 mm). La numérotation des broches, les fonctions et les schémas de connexion sont définis dans la fiche technique du fabricant. Consultez-la pour l'empreinte exacte et les directives de soudage.
Aucune donnée de brochage détaillée disponible pour TUSB7340IRKMT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
TUSB7340IRKMT convient pour 6 applications: USB 3.0 PCI Express Add-In Cards, Docking Stations and Port Replicators, Industrial Embedded Computing, Motherboards and Embedded Boards, Network-Attached Storage and Server Appliances, Medical and Laboratory Instrumentation.
USB 3.0 PCI Express Add-In Cards
The TUSB7340IRKMT is the core silicon of PCI Express add-in cards that add four SuperSpeed ports to desktop workstations and servers. Its PCIe x1 Gen 2 upstream link (5 GT/s) matches the bandwidth class of a single SuperSpeed port aggregate under typical mixed traffic, and its xHCI architecture is natively supported by modern operating systems without vendor-specific host drivers. Integrating the PCIe Gen 2 PHY and four USB 3.0 PHYs on one die removes external PHY devices, shrinking the add-in card PCB and BOM. The 100-pin WQFN-MR 9x9 mm package with exposed pad keeps thermal resistance manageable at the controller's typical power level, and the -40C to +85C I-grade tolerates non-climatized industrial PCs. Layout effort centers on keeping the five 5 Gbps differential pairs (one PCIe plus four USB) length-matched with clean reference planes.
Recommandé
Docking Stations and Port Replicators
Four-port SuperSpeed host controllers are a natural fit for docking stations that aggregate keyboard, storage, camera, and display-link traffic over one upstream connection to a notebook. The TUSB7340IRKMT provides four independent 5 Gbps downstream ports from a single PCIe x1 Gen 2 upstream link, letting the dock expose multiple SuperSpeed receptacles without cascading USB hubs, which adds latency and shares a single 480 Mbps high-speed link. Because the xHCI standard controller is recognized natively by Windows, Linux, and macOS, no custom drivers ship with the dock. The I-grade -40C to +85C range covers desktop enclosures with limited airflow, and the 100-pin RKM footprint is shared with the two-port TUSB7320, so a product family can offer 2-port and 4-port docks from one PCB. Power design must budget 900 mA per SuperSpeed port per the USB 3.0 specification.
Recommandé
Industrial Embedded Computing
Industrial PCs, machine-vision controllers, and test-and-measurement chassis frequently need several high-bandwidth USB ports for cameras, data-acquisition modules, and removable storage. The TUSB7340IRKMT addresses this with four native SuperSpeed ports at 5 Gbps and an extended -40C to +85C operating range suited to unconditioned factory floors. Its PCIe host interface connects directly to embedded CPU chipsets (for example x86 SoCs or ARM bridges) that expose free Gen 2 lanes. Integration of PHYs on-die reduces EMI sources compared with discrete PHY solutions, simplifying compliance testing for CE and FCC radiated emissions. Designers should place the controller close to the connector field, use the exposed pad soldered to a solid ground plane for return currents, and follow the TI TUSB73x0 datasheet routing rules for the 90-ohm differential pairs to guarantee SuperSpeed eye compliance over the full temperature range.
Recommandé
Motherboards and Embedded Boards
Motherboard designers use the TUSB7340IRKMT when a chipset exhausts its native SuperSpeed ports but still has spare PCIe Gen 2 lanes. Soldered onto the board, it upgrades a design from two or four additional USB 3.0 receptacles without a hub cascade, preserving per-port 5 Gbps performance for external SSD enclosures and video-capture devices. The pin-compatible TUSB7320 (two ports) allows one layout to serve multiple product tiers - a high-end board uses the TUSB7340 while a cost-reduced variant fits the TUSB7320 on the identical footprint. Dual 1.1 V and 3.3 V supplies integrate with standard motherboard power trees, and the WQFN-MR exposed pad bonds to the motherboard ground plane for thermal relief and signal return. Firmware support is limited to standard xHCI initialization, minimizing BIOS development effort.
Recommandé
Network-Attached Storage and Server Appliances
NAS and small server platforms add USB 3.0 connectivity for backup targets, one-touch copy, and service access. The TUSB7340IRKMT supplies four SuperSpeed ports from one PCIe x1 Gen 2 lane, which aligns with the single spare lane typically reserved on storage SoCs for USB expansion. Its xHCI-standard register interface is supported by all mainstream Linux kernels, so appliance firmware requires no out-of-tree drivers - an important reliability criterion for always-on storage products. The -40C to +85C I-grade handles fanless enclosure ambients where drive heat raises internal temperature, and the 100-pin WQFN-MR 9x9 mm package conserves PCB area on crowded storage boards. Design attention should go to isolating the 5 Gbps pairs from switching-regulator nodes and to supplying clean 1.1 V core power, since core rail ripple degrades PCIe link stability over long uptime.
Recommandé
Medical and Laboratory Instrumentation
Benchtop medical devices and laboratory instruments use SuperSpeed USB to stream imaging, ultrasound, and high-rate sensor data to host PCs. The TUSB7340IRKMT provides four 5 Gbps ports that sustain multiple data-capture modules concurrently, and its PCIe x1 Gen 2 host interface integrates into the x86 or ARM compute module common in such instruments. The extended -40C to +85C range covers transport and storage conditions beyond typical indoor operation, and the single-chip PHY integration lowers component count, which helps with design-history-file documentation under quality systems. Because xHCI is driverless on clinical PCs running locked-down OS images, validation effort shrinks. Follow the TI TUSB73x0 datasheet layout rules for impedance-controlled SuperSpeed routing and use the exposed thermal pad to limit junction temperature rise in fanless medical enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TUSB7340IRKMT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TUSB7340IRKMR | TUSB7340RKMT | TUSB7320IRKMT | TUSB7320IRKMR |
|---|---|---|---|---|---|
| Package | 100-WQFN-MR (RKM) 9x9 mm | 100-WQFN-MR (RKM) - same | 100-WQFN-MR (RKM) - same | 100-WQFN-MR (RKM) - same | 100-WQFN-MR (RKM) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Downstream USB Ports | 4 | 4 | 4 | 2 | 2 |
| USB Standard | USB 3.0 (SuperSpeed, 5 Gbps) | USB 3.0 (5 Gbps) | USB 3.0 (5 Gbps) | USB 3.0 (5 Gbps) | USB 3.0 (5 Gbps) |
| Host Interface | PCIe x1 Gen 2 | PCIe x1 Gen 2 | PCIe x1 Gen 2 | PCIe x1 Gen 2 | PCIe x1 Gen 2 |
| Supply Voltage | 1.1 V core / 3.3 V I-O | 1.1 V / 3.3 V | 1.1 V / 3.3 V | 1.1 V / 3.3 V | 1.1 V / 3.3 V |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +85C | -40C to +85C | -40C to +85C |
| Pin Compatibility | TUSB73x0 family, 100-pin RKM | Pin-compatible | Pin-compatible | Pin-compatible | Pin-compatible |
Principaux différenciateurs
- Four downstream SuperSpeed ports (vs TUSB7320IRKMT)
- Extended industrial temperature grade (vs TUSB7340RKMT)
- Integrated PCIe Gen 2 and USB 3.0 PHYs (vs Discrete PHY + controller solutions)
Notes de conception
Route the PCIe x1 Gen 2 pair and all four USB 3.0 SuperSpeed TX/RX pairs as 90-ohm differential pairs over an unbroken reference plane. Keep each pair length-matched within the tolerances given in the TI TUSB73x0 datasheet, minimize layer transitions (each via adds impedance discontinuity at 5 Gbps), and place AC-coupling capacitors without stubs. Verify SuperSpeed eye diagrams at both temperature extremes; marginal routing that passes at room temperature may fail at +85C.
The TUSB7340 requires a 1.1 V core rail and a 3.3 V I/O/PHY rail. Derive the 1.1 V rail from 3.3 V via a small synchronous buck with adequate output current margin, and decouple both rails locally at the package with the capacitor network specified in the TI datasheet. Budget VBUS power per port at 900 mA for USB 3.0 compliance using current-limited power switches such as the TPS2549 family to meet overcurrent protection requirements.
The 100-pin WQFN-MR (RKM) exposed pad must be soldered to a solid ground pour - it is the primary ground return for all 5 Gbps signals and the main thermal path. Use a via array under the pad to tie into internal ground planes. Place the controller close to the connector field, and keep the 5 Gbps pairs away from switching-regulator inductors and clock lines. Consult the TI TUSB73x0 datasheet PCB layout section before finalizing the stackup.
Do not mix up temperature grades when sourcing: TUSB7340IRKMT (I-grade) is rated -40C to +85C, while TUSB7340RKMT is 0C to +85C commercial. Also remember the TUSB7320 in the same footprint has only two ports - software enumerating four ports on a board fitted with a TUSB7320 will fail. Confirm the fitted MPN during production test to avoid field returns.
Informations de conformité
Compliance data was not present in the provided web data. Verify RoHS/REACH status on the TI.com product page for TUSB7340IRKMT before procurement.
