VTM2308S52Z0276T00 - 103.3A Non-Iso PoL Module | Vicor
Référence : VTM2308S52Z0276T00 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145.5 | $145,50 |
| 10 | $138.2 | $1 382,00 |
| 100 | $128.75 | $12 875,00 |
| 500 | $119.4 | $59 700,00 |
| 1 000 | $112 | $112 000,00 |
VTM2308S52Z0276T00 Présentation
A Voltage Transformation Module (VTM) is a sine amplitude converter (SAC)-based DC-DC building block that delivers isolated-ratio voltage transformation and current multiplication without intermediate energy storage. Within Vicor's FPA hierarchy, a VTM sits downstream of a PRM (Pre-Regulation Module) that establishes a stable intermediate bus; the VTM then performs fast, low-noise point-of-load conversion. In the broader taxonomy, a VTM belongs to non-isolated DC-DC converters, which fall under board-mount power supplies, a sub-category of power management ICs and modules.
Key specifications include a 1.2 V fixed output, 103.33 A maximum output current, and a 38.4 V maximum input voltage (typically powered from a 36-38 V PRM-rail). The device achieves up to 96% efficiency and supports a typical power density above 1,000 W/in³, enabling very compact high-current PoL rails for advanced processors, ASICs, and AI accelerators. Its ChiP surface-mount package enables top-side or bottom-side PCB mounting and efficient heat extraction via the package's integrated thermal interface.
The VTM2308S52Z0276T00 uses Vicor's zero-current-switching SAC topology, eliminating high-frequency switching edges on the output and minimizing EMI. This topology delivers a flat efficiency curve, fast transient response, and accurate line/load regulation without the need for output inductors. The result is a clean, low-noise 1.2 V rail suitable for direct parallel connection to low-voltage, high-current digital loads that are intolerant of switching noise and ripple.
Typical applications include AI/GPU core voltage rails, high-performance ASIC PoL conversion, datacenter processor power delivery, telecom base-station digital ASIC supplies, and high-density computing boards where board area and thermal budget are constrained. The 1.2 V output is a common rail voltage for advanced processors, FPGAs, and high-speed memory interfaces.
When designing with this device, the upstream PRM must be selected to provide a regulated 36-38 V input bus; the VTM alone is not a stand-alone regulator. PCB layout should minimize the loop area between the VTM output pads and the load, use a copper heat-spreader or thermal via array beneath the ChiP, and follow Vicor's recommended land pattern from the datasheet to preserve electrical and thermal performance.
This page synthesizes distributor pricing, drop-in VTM alternatives within the Vicor VTM family, and practical design notes not found in isolation on the manufacturer datasheet.
Alternatives de remplacement direct pour VTM2308S52Z0276T00 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec VTM2308S52Z0276T00 (même facteur de forme et même empreinte) — différant par Topology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
VTM2308S52Z0276T01
✅ Remplacement direct✓ En stock
$95 / unité
Voir la fiche technique →VTM2308S52Z0276T00 Valeurs maximales et caractéristiques électriques
| Topologie | Non-Isolated Point-of-Load (PoL) Current Multiplier |
| Type de sortie | Fixed 1.2 V |
| Nombre de sorties | 1 |
| Tension de sortie | 1.2 V |
| Courant de sortie maximal | 103.33 A |
| Maximum Input Voltage | 38.4 V |
| Typical Input Voltage | 36 V to 38 V (PRM-fed) |
| Rendement | Up to 96% |
| Power Density | >1000 W/in³ |
| Package Type | Vicor ChiP (Surface Mount) |
| Type de montage | Surface Mount |
| Switching Topology | Sine Amplitude Converter (SAC), zero-current switching |
| Output Ripple | Low (SAC topology, switching edges attenuated) |
| Température de fonctionnement | -40C to +125C |
| Compliance | RoHS compliant (per manufacturer product page) |
Guide de configuration des broches du VTM2308S52Z0276T00 vicor chip (surface mount)
Configuration des broches du VTM2308S52Z0276T00 (boîtier vicor chip (surface mount)). Ce composant de puissance comporte des bornes de grille, de drain et de source. Pour les boîtiers non polarisés, consultez la fiche technique du fabricant pour l'orientation exacte de la broche 1 et les détails de l'empreinte. Les applications courantes incluent la conception d'alimentations, la commande de moteurs et la commutation de charges.
Aucune donnée de brochage détaillée disponible pour VTM2308S52Z0276T00.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
VTM2308S52Z0276T00 convient pour 6 applications: AI/GPU Core Voltage Rail, High-Performance ASIC PoL Conversion, Datacenter Processor Power Delivery, Telecom Base Station ASIC Supply, High-Density Computing Board, FPGA Core Rail Power.
AI/GPU Core Voltage Rail
The VTM2308S52Z0276T00's 1.2V at 103.33A output maps directly to the Vcore rail of high-end AI accelerators and GPUs that demand 100+ A at sub-1.5 V with low ripple. Its sine amplitude converter topology eliminates switching edges on the output, keeping the noise floor far below what a multiphase buck converter produces, which is critical for maintaining bit-error-rate margins in high-speed SerDes interfaces. Placed downstream of a Vicor PRM that establishes a 36-38V intermediate bus, the VTM acts as the final current-multiplier stage and is typically co-located directly beneath the GPU socket to minimize the high-current loop.
Recommandé
High-Performance ASIC PoL Conversion
Advanced ASICs in networking switches, AI inference cards, and high-frequency trading platforms often require tightly regulated 1.2V rails at very high current. The VTM2308S52Z0276T00's 1.2V/103.33A rating suits these loads directly, while its >1000W/in³ power density lets the engineer place the module directly under the ASIC footprint with minimal board area. The lack of output inductors simplifies PCB layout and frees the bottom side of the board for signal routing and decoupling.
Recommandé
Datacenter Processor Power Delivery
Datacenter processors consume 100-300W from a single 1.2V (or lower) rail, and board area is at a premium in 1U/2U server form factors. The VTM2308S52Z0276T00 fits naturally into a 48V-direct-to-PoL architecture by pairing with a Vicor PRM that converts 48V to a 36-38V bus, then delivering 1.2V at 103.33A. Its up to 96% efficiency keeps the cooling budget reasonable at this power level, and the ChiP package enables top-side cooling with a standard heatsink or cold plate.
Recommandé
Telecom Base Station ASIC Supply
Telecom base-station boards combine RF transceivers, baseband ASICs, and high-speed SERDES, all of which benefit from the very low output ripple of a sine amplitude converter topology. The VTM2308S52Z0276T00's 1.2V/103.33A capability suits the main baseband ASIC core rail, and the surface-mount ChiP package handles thermal cycling and shock typical of telecom equipment. EMI is also reduced because the SAC topology does not produce fast switching edges that could couple into adjacent RF traces.
Recommandé
High-Density Computing Board
When PCB area is constrained but the load demands >100 A at low voltage, the VTM2308S52Z0276T00's >1000W/in³ power density enables the module to sit directly under or adjacent to the load IC, minimizing the high-current copper loop. Designers can use both sides of the board for components because the VTM ChiP can be mounted top or bottom side. Combined with the PRM48BF480T200A00, this forms a complete 48V-direct-to-PoL solution that eliminates the traditional 48V-to-12V intermediate stage entirely.
Recommandé
FPGA Core Rail Power
High-end FPGAs (e.g., Virtex, Versal, Stratix class) typically require 0.85-1.2V at 50-150 A depending on logic utilization. The VTM2308S52Z0276T00's 1.2V/103.33A output fits within this envelope for many FPGA variants, and its fast transient response (a hallmark of SAC topology) helps maintain regulation during sudden load steps when the FPGA transitions between logic states. Pairing with a Vicor PRM upstream gives the designer a fully programmable two-stage power tree with telemetry.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour VTM2308S52Z0276T00 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | VTM2308S52Z0276T01 |
|---|---|---|
| Brand | Vicor | Vicor - same |
| Package | Vicor ChiP (Surface Mount) | Vicor ChiP (Surface Mount) - same |
| Output Voltage | 1.2 V | 1.2 V |
| Maximum Output Current | 103.33 A | 103.33 A |
| Maximum Input Voltage | 38.4 V | 38.4 V |
| Topology | Sine Amplitude Converter (SAC) | Sine Amplitude Converter (SAC) |
| Efficiency | Up to 96% | Up to 96% |
| Power Density | >1000 W/in³ | >1000 W/in³ |
| Mounting Type | Surface Mount (ChiP) | Surface Mount (ChiP) |
Principaux différenciateurs
- Sine amplitude converter topology eliminates output switching noise (vs Conventional multiphase buck PoL converters)
- Extreme power density above 1000 W/in³ (vs Conventional buck PoL modules)
- Factorized Power Architecture enables 48V-direct-to-PoL (vs Traditional 48V-to-12V-to-1.2V two-stage designs)
Notes de conception
Estimated: at 1.2 V x 103.33 A = ~124 W output, with up to 96% efficiency implying ~5 W dissipation worst case. The Vicor ChiP package dissipates this heat primarily through its bottom thermal pad; provide a thermal via array directly under the module landing pads and a copper heat-spreader layer on the top or bottom PCB surface. Do not block the thermal pad with solder mask - it must be a solderable thermal pad per the VTM2308 datasheet mechanical drawing.
Place the VTM2308S52Z0276T00 as close as physically possible to the load (e.g., GPU socket) to minimize the high-current output loop inductance. Use the recommended land pattern from the Vicor VTM2308 datasheet; the ChiP pads are not a standard JEDEC footprint and must be replicated exactly to maintain electrical and thermal performance. Maintain a continuous ground pour across the layers beneath and around the module to provide a low-impedance return path for the SAC switching currents.
Do not attempt to power the VTM2308S52Z0276T00 from a 48 V source directly - the maximum input is 38.4 V. The VTM must be preceded by a Vicor PRM (Pre-Regulation Module) that establishes the 36-38 V intermediate bus. Connecting 48 V to the VTM input will permanently damage the module. Also avoid paralleling multiple VTM2308S52Z0276T00 modules without following Vicor's current-sharing guidelines, as the SAC topology does not inherently share current like a buck converter would.
Keep the input and output loop areas as small as possible. The SAC topology inherently has low EMI, but poor layout can still create radiated noise that couples into adjacent RF or analog traces. Place the upstream PRM within a few centimeters of the VTM input pads, and route the 1.2 V output on wide copper pours (or multiple inner layers in parallel) directly to the load. Avoid routing noisy digital signals across or near the VTM footprint on adjacent layers.
Informations de conformité
RoHS and lead-free confirmed per Vicor product page; halogen-free status not explicitly listed in the verified web data and marked unknown. AEC-Q100 not applicable - this is a board-mount power module, not an automotive-qualified IC.
