XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
Référence : XC3S400-4FT256I ⚠ Dernier achatXC3S400-4FT256I Présentation
A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package.
The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments.
The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic.
Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device.
The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility.
This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.
Alternatives de remplacement direct pour XC3S400-4FT256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S400-4FT256I (même facteur de forme et même empreinte) — différant par Logic Cells, Mounting Type, Operating Temperature, Package, System Gates.
XC3S400-4FTG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400-4FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S400A-4FTG256C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC3S400-4FT256I Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 400,000 gates |
| Logic Cells | 8,064 logic cells |
| User I/O | 173 I/Os |
| Boîtier | 256-ball FTBGA |
| Package Type | Lead-free FTBGA |
| Nombre de broches | 256 pins |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Nominal Core Voltage | 1.2 V |
| Performance Grade | -4 speed grade |
| Maximum Performance | 630 MHz |
| Température de fonctionnement | 0 °C to 85 °C |
| Temperature Grade | Industrial |
| Logic Resource Count | 192 logic blocks |
| Type de montage | Surface mount |
| Lead-Free Status | Lead free |
Guide de configuration des broches du XC3S400-4FT256I lead-free ftbga
Configuration des broches du XC3S400-4FT256I (boîtier lead-free ftbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S400-4FT256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S400-4FT256I convient pour 6 applications: Industrial Control Systems, Communications Equipment, Embedded Signal Processing, Test and Measurement Equipment, Automotive and Vehicle Electronics, Data Acquisition and Interface Bridging.
Industrial Control Systems
The XC3S400-4FT256I fits industrial control systems that need deterministic parallel logic, flexible I/O assignment, and a device rated for 0 °C to 85 °C. Its 400,000 system gates and 8,064 logic cells can combine sequencing, machine-control logic, diagnostic monitoring, and communications interfaces in one programmable device. The 173 user I/Os allow external sensors, actuators, relays, and industrial buses to be connected without relying on a fixed peripheral arrangement. The 256-ball FTBGA package supports dense routing in a compact board design, but assembly and thermal planning are essential. Because the part is associated with a discontinuation notice, retain the exact device in legacy systems and verify supply before committing to a new production run.
Recommandé
Communications Equipment
The XC3S400-4FT256I is suitable for communications modules requiring configurable protocol handling, parallel data paths, and numerous external connections. Its 400,000 system gates and 173 user I/Os can support framing logic, clock and data recovery assistance, status monitoring, and interface adaptation in parallel. The -4 performance designation and the supplied 630 MHz comparison value provide useful basis for timing-oriented designs, although the exact timing budget must be validated against the device datasheet. The 1.2 V core supply and 90 nm process technology are consistent with a compact programmable-logic implementation. Use careful clock routing, controlled impedance, and industrial-temperature component selection when deploying the FPGA in communication infrastructure.
Recommandé
Embedded Signal Processing
The XC3S400-4FT256I can act as a configurable hardware accelerator for embedded signal-processing, where deterministic parallel operation is more valuable than a software-only implementation. The available logic capacity of 8,064 cells and 400,000 system gates allows designers to implement filtering, state machines, parallel data movement, and custom interface logic. Its 173 I/Os support connections to sensors, converters, memory, and external processors. The device is built on 90 nm technology and operates with a 1.2 V nominal core supply, making it appropriate for low-voltage embedded systems when the associated I/O banks and supply rails are designed correctly. Validate timing closure and configuration method before using the part in safety- or mission-critical equipment.
Recommandé
Test and Measurement Equipment
The XC3S400-4FT256I is appropriate for test and measurement instruments that need reconfigurable timing, acquisition control, pattern generation, and communication interfaces. Its FPGA fabric can run multiple parallel measurement channels or implement specialized trigger and sequencing logic, while the 173 user I/Os connect to converters, analog switches, and test fixtures. The 256-ball FTBGA package reduces board area compared with a large leaded package but requires a multilayer PCB, via-in-pad considerations where appropriate, and a controlled assembly process. Industrial temperature operation supports equipment deployed outside tightly controlled environments. Because the target has a discontinuation notice, engineers should preserve configuration files, bitstreams, and board documentation to support maintenance of installed equipment.
Recommandé
Automotive and Vehicle Electronics
The XC3S400-4FT256I can be considered for non-safety vehicle electronics, industrial vehicle controls, and communication modules where configurable logic and numerous I/Os are useful. The device’s 400,000 system gates and 173 user I/Os can support gateway logic, body-comfort functions, diagnostics, and data transformation. Its specified 0 °C to 85 °C industrial range is narrower than many automotive-grade temperature requirements, so qualification, transient protection, and vibration testing must be addressed at the system level. The provided data does not state AEC-Q100 qualification for this MPN. A new safety-related or automotive design should therefore use a currently qualified device, while a legacy replacement should be checked for timing, pinout, supply, and software compatibility.
Recommandé
Data Acquisition and Interface Bridging
The XC3S400-4FT256I is useful in data-acquisition front ends where multiple digital channels must be combined with external converters, processors, or communication links. The 173 user I/Os provide substantial connectivity for parallel ADC and DAC control, capture sequencing, and data packing, while the programmable fabric can implement buffering and protocol conversion. The 1.14 V to 1.26 V core range and 630 MHz listed comparison value support compact, high-speed digital logic designs. Practical implementation must include controlled clock distribution, termination for high-speed interfaces, decoupling close to the power balls, and careful BGA escape routing. Validate the exact I/O voltage, bank configuration, input thresholds, and timing before production release.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S400-4FT256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S400-4FTG256I | XC3S400-4FTG256C | XC3S400A-4FTG256C |
|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | 256-ball FTBGA | 256-ball FTBGA | 256-ball FTBGA | 256-ball FTBGA |
| Temperature Grade | Industrial, 0 °C to 85 °C | Industrial designation | Commercial designation | Commercial designation |
Principaux différenciateurs
- Industrial-temperature qualification for the target MPN (vs XC3S400-4FTG256C)
- 173-user-I/O resource allocation (vs XC3S400-4FTG256I)
- Higher listed performance for the Spartan-3A alternative (vs XC3S400A-4FTG256C)
Notes de conception
Treat the 256-ball FTBGA footprint as a high-density escape-routing problem. Confirm the exact land pattern, ball-pitch dimensions, solder-mask and paste specifications, via-in-pad requirements, and assembly tolerances against the official package drawing. Route power, ground, configuration, and high-speed clock paths before general-purpose signals so the PCB supports the device without excessive layer changes.
Use the verified 1.14 V to 1.26 V core range and nominal 1.2 V operating point only as the starting point for power design. Confirm every I/O-bank voltage, configuration supply, sequencing requirement, and current limit from the manufacturer datasheet. Place bulk and high-frequency decoupling capacitors close to the relevant power and ground balls, and verify power-up and power-down behavior in the complete board design.
The 90 nm FPGA can dissipate power during high-switching or high-I/O designs, and the 256-ball package requires effective heat spreading through the PCB. Use the manufacturer power-dissipation and thermal data to estimate junction temperature, provide adequate ground-plane area, consider thermal vias, and evaluate airflow or a heat spreader where the calculated temperature exceeds the design limit.
Do not substitute an FPGA solely because its system-gate count and package family match. Confirm the exact ball assignment, configuration interface, speed grade, I/O standards, supply rails, temperature grade, and bitstream compatibility in the manufacturer documentation. The XC3S400-4FT256I is associated with a discontinuation notice, so preserve the original design files and verify lifecycle status before treating any related MPN as a drop-in replacement.
Informations de conformité
The verified distributor data identifies the package as lead free. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status were not established from the supplied data.
