XC3S400-4FT256I vs XC3S400A-4FTG256C Comparaison
Comparaison détaillée côte à côte de XC3S400-4FT256I par Xilinx et XC3S400A-4FTG256C par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC3S400-4FT256I | XC3S400A-4FTG256C |
|---|---|---|
| Marque | Xilinx | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Spartan-3 | — |
| System Gates | 400,000 gates | 400,000 |
| Logic Cells | 8,064 logic cells | 8,064 |
| User I/O | 173 I/Os | — |
| Boîtier | 256-ball FTBGA | 256-FTBGA (FTG256), 17 × 17 mm |
| Package Type | Lead-free FTBGA | — |
| Nombre de broches | 256 pins | — |
| Process Technology | 90 nm | — |
| Core Supply Voltage | 1.14 V to 1.26 V | — |
| Nominal Core Voltage | 1.2 V | — |
| Performance Grade | -4 speed grade | — |
| Maximum Performance | 630 MHz | — |
| Température de fonctionnement | 0 °C to 85 °C | 0°C to +85°C (commercial) |
| Temperature Grade | Industrial | — |
| Logic Resource Count | 192 logic blocks | — |
| Type de montage | Surface mount | Surface Mount (BGA) |
| Lead-Free Status | Lead free | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| AEC-Q100 Qualification | [DATA_NEEDED: AEC-Q100 qualification] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pinout] | — |
| Family | — | Spartan-3A |
| Manufacturer | — | AMD (Xilinx) |
| Block RAM Bits | — | 368,640 |
| Block RAM Blocks | — | 20 (18 Kbit each) |
| User I/Os | — | 195 |
| Dedicated Multipliers | — | 4 (18 × 18-bit signed) |
| Digital Clock Managers (DCMs) | — | 4 |
| Speed/Grade | — | -4 (commercial) |
| Max Internal Clock | — | 770 MHz |
| Process | — | 90 nm CMOS |
| Configuration Modes | — | SPI, BPI, JTAG |