XC3S50-4PQ208I - 50K Spartan-3 FPGA, 208-Pin | Xilinx
Référence : XC3S50-4PQ208I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
XC3S50-4PQ208I Présentation
A field-programmable gate array is a semiconductor device whose digital logic is configured after manufacture. An FPGA combines programmable logic blocks, programmable interconnect, input/output blocks, and memory resources into a flexible parallel-processing platform. The Spartan-3 family targets designs that need more capability than simple fixed-function logic while retaining cost, power, and design-entry advantages appropriate to compact embedded systems.
The XC3S50-4PQ208I provides 50,000 system gates, 1,728 logic cells, 124 user I/O pins, and 73,728 RAM bits. Its -4 speed designation identifies the verified performance grade, while the I suffix denotes the specified industrial temperature class. The 208-BFQFP package provides 208 physical terminals for PCB integration, with gull-wing leads and a square package format. The verified distributor listing also identifies 1.2 V FPGA operation and 90 nm technology.
Because the device is programmable, engineers can implement parallel datapaths, control logic, interfaces, state machines, and signal-processing functions in one integrated device. The Spartan-3 architecture is useful when deterministic hardware timing and flexible post-build updates are more valuable than the simplicity of a fixed-function microcontroller or small PLD. Resource counts should be checked against the complete Xilinx datasheet before assigning a large design, especially when block RAM, DSP, clocking, or high-speed I/O requirements are substantial.
Typical uses include industrial control, communications interfaces, test equipment, instrumentation, embedded gateways, and compact control systems. The 124 user I/O pins are useful for parallel buses, status LEDs, capture logic, and external interfaces. Designers must also budget pin multiplexing, clocking, configuration memory or configuration sources, I/O standards, power rails, and board-level signal integrity; those details are not fully specified in the supplied search data and must be verified against the manufacturer datasheet.
A key design consideration is that an FPGA replacement must match the physical package, pinout, electrical limits, configuration method, memory resources, and timing requirements. The verified search results identify no pin-compatible substitute in the supplied cross-reference data, so a footprint-compatible replacement should not be assumed. This page consolidates verified specifications, sourcing links, application guidance, and the limitations of the available replacement data.
Alternatives de remplacement direct pour XC3S50-4PQ208I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3S50-4PQ208I (même facteur de forme et même empreinte) — différant par Device Type, Process Technology, FPGA Family, Logic Cells, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3S50-4PQG208I
✅ Remplacement direct✓ En stock
$55.85 / unité
Voir la fiche technique →XC3S50-5PQG208C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC3S500E-4PQG208C
✅ Remplacement direct✓ En stock
$23.7985 / unité
Voir la fiche technique →XC3S50-4PQ208I Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-3 |
| System Gates | 50,000 gates |
| Logic Cells / Logic Blocks | 1,728 logic elements |
| Total RAM Bits | 73,728 bits |
| User I/O Pins | 124 pins |
| Boîtier | 208-BFQFP, 208 pins |
| Package Type | Square gull-wing FQFP package |
| Core Supply | 1.2 V |
| Process Technology | 90 nm |
| Température de fonctionnement | 0°C to 85°C |
| Temperature Class | Industrial temperature designation |
| Speed Grade | -4 performance grade |
| Number of Terminals | 208 terminals |
| Style de montage | Surface mount |
| Qualification | Not Qualified |
Guide de configuration des broches du XC3S50-4PQ208I square gull-wing fqfp package
Configuration des broches du XC3S50-4PQ208I (boîtier square gull-wing fqfp package). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC3S50-4PQ208I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC3S50-4PQ208I convient pour 6 applications: Industrial Control and Automation, Communications Interface and Protocol Bridge, Test and Measurement Instrumentation, Embedded Gateway and Data Acquisition, Programmable Signal Conditioning, Compact Educational and Prototype Logic Platform.
Industrial Control and Automation
The XC3S50-4PQ208I fits compact industrial-control logic where a controller needs parallel I/O, state machines, and programmable sequencing. Its verified 124 user I/O pins can connect digital sensors, actuator drivers, interlocks, status indicators, and communication transceivers, while 1,728 logic elements provide hardware parallelism beyond a simple fixed-function controller. The 208-BFQFP package is surface mountable, but board designers must follow the manufacturer pinout and power guidance. A 0°C to 85°C operating range is identified for this order code, making thermal qualification and enclosure design important for factory equipment.
Recommandé
Communications Interface and Protocol Bridge
Use the XC3S50-4PQ208I for deterministic protocol conversion, framing, buffering, and test logic around communications equipment. The verified 124 user I/O pins support parallel data paths and control signals, while the Spartan-3 FPGA’s configurable logic can implement byte packing, parity generation, packet filtering, and timing assistance. The 1,728 logic elements and 73,728 RAM bits should be checked against the selected protocol’s storage and parallelism needs. A communications design also needs verified clocking, I/O standards, termination, and signal-integrity requirements that are not included in the supplied search data.
Recommandé
Test and Measurement Instrumentation
The XC3S50-4PQ208I can serve as a programmable capture, sequencing, and pattern-generation engine in compact test equipment. Its verified 1,728 logic elements are useful for parallel state machines, timing counters, channel control, and trigger routing, while 73,728 RAM bits can hold short patterns or buffered samples. The 124 user I/O pins provide connectivity to sensors, front-panel controls, and display or communication logic. Engineers should validate acquisition timing, clock quality, input thresholds, output drive, and analog front-end requirements against the complete Xilinx datasheet before selecting this FPGA.
Recommandé
Embedded Gateway and Data Acquisition
The XC3S50-4PQ208I is suitable for small embedded gateways that must combine local digital acquisition, control, buffering, and communications. The 124 verified user I/O pins can support discrete inputs, relay outputs, field-bus transceivers, and status LEDs, while the FPGA fabric can implement protocol conversion and event filtering in hardware. Its 50,000-system-gate and 73,728-RAM-bit position makes it appropriate for moderate, not highly parallel, workloads. Validate memory mapping, configuration persistence, clock recovery, and environmental requirements in the complete design documentation.
Recommandé
Programmable Signal Conditioning
The XC3S50-4PQ208I can implement digital signal-conditioning functions such as parallel filtering, delay matching, pulse qualification, edge detection, and data redistribution. Its configurable interconnect and 124 user I/O pins are useful when multiple digital channels must be handled deterministically. The 73,728 RAM bits provide limited on-chip storage for short buffers, but this device is not characterized in the supplied data as a high-speed DSP or large-memory platform. Confirm supported clock frequencies, I/O standards, and timing closure in the Xilinx toolchain before committing the design.
Recommandé
Compact Educational and Prototype Logic Platform
The XC3S50-4PQ208I provides a manageable Spartan-3 platform for education, prototyping, and small logic experiments. Students can use the 1,728 logic elements to demonstrate counters, finite-state machines, parallel datapaths, memory access, and FPGA-based I/O control. The 208-pin package exposes more connections than many small development devices, making it useful for experiments involving external switches, displays, memory, or communication logic. Because the verified data does not provide development-board configuration or complete pinout, beginners should use a board with established schematics and a compatible Xilinx programming toolchain.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3S50-4PQ208I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3S50-4PQG208I | XC3S50-5PQG208C | XC3S500E-4PQG208C |
|---|---|---|---|---|
| Package | 208-BFQFP, 208 pins | 208-pin PQFP class; exact footprint requires verification | 208-pin PQFP class; exact footprint requires verification | 208-pin PQFP class; exact footprint requires verification |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx |
| Device Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3E |
| Speed / Suffix | -4 / I | -4 / I | -5 / C | -4 / C |
Principaux différenciateurs
- Verified 124-user-I/O availability in a 208-pin device (vs XC3S50-4PQG208I)
- Verified 1,728 logic elements and 73,728 RAM bits (vs XC3S50-5PQG208C)
- Explicit 1.2 V and 90 nm process identifiers (vs XC3S500E-4PQG208C)
Notes de conception
The verified data confirms a 1.2 V core supply but does not provide the complete power tree or current limits. Before PCB release, obtain the manufacturer power specification and separate core, I/O, auxiliary, and configuration supplies as applicable. Place required decoupling close to the relevant device pins, provide adequate return paths, and verify regulator tolerance, startup sequencing, and power-current margin under the worst supported I/O activity. Do not infer supply requirements from the 1.2 V figure alone.
The XC3S50-4PQ208I uses a 208-pin BFQFP surface-mount package, so PCB land patterns, paste volume, via-in-pad strategy, and assembly thermal profiles must be based on the official package drawing. Confirm pin numbering and exposed versus non-exposed mechanical features before fabrication. Route power and ground planes to minimize loop area, maintain continuous ground reference beneath the device, and use differential or length-controlled routing wherever the selected I/O standard and clock topology require it.
Do not treat a same-family or same-pin-count FPGA as a drop-in replacement without checking the complete pinout, configuration pins, I/O standards, supply rails, memory resources, speed grade, temperature class, and timing constraints. The supplied alternatives search does not establish verified pin compatibility. A replacement decision should include a manufacturer data-sheet comparison, schematic review, pin-state analysis during configuration and power-down, and post-silicon timing validation.
Configuration signals, clock inputs, and high-fanout control nets deserve special attention because an FPGA can place multiple loads or switching edges on these resources. Follow the Xilinx configuration and clocking guidance for termination, biasing, decoupling, and routing. Keep sensitive analog or low-level digital inputs away from noisy switching paths, and use the complete I/O specification to select termination and drive strength. The supplied data does not state supported I/O standards, so those values must remain design-review items.
Informations de conformité
The supplied verified search results do not provide manufacturer RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. Qualification is marked not_applicable only for AEC-Q100 because the supplied data does not identify an automotive qualification claim.
