XC6SLX25-3CSG324I - Spartan-6 LX FPGA, 324 CSBGA | AMD/Xilinx
Référence : XC6SLX25-3CSG324I ✓ ActifXC6SLX25-3CSG324I Présentation
A field-programmable gate array is a reconfigurable digital semiconductor used to implement control logic, interfaces, signal processing, and embedded system functions after fabrication. The Spartan-6 family belongs to the FPGA and CPLD hierarchy and combines programmable logic, configurable I/O, memory resources, and clocking resources in one device. This makes the XC6SLX25 useful when a design needs programmable hardware rather than a fixed application-specific integrated circuit.
The XC6SLX25-3CSG324I provides 24,051 logic cells and a stated internal frequency of 500 MHz. Its -3 speed designation identifies the highest-performance Spartan-6 LX speed grade described in the product information. The device is offered in a 324-CSBGA package with 0.80 mm pitch, so the PCB land pattern, via arrangement, assembly process, and thermal design must be based on the AMD Spartan-6 package documentation.
The device is identified as operating from 0 C to 85 C in the product listing. The lead-free package designation is important for manufacturing environments using controlled soldering processes and solder-material requirements. The device is intended for designers creating parallel logic, embedded control, communications, instrumentation, and industrial automation systems with programmable FPGA architectures.
Typical design considerations include high-speed board routing, careful power and ground distribution, BGA assembly capability, and validation of the exact pinout and package files before PCB release. The AMD Spartan-6 package pinout files should be used for the physical implementation, while the Spartan-6 FPGA Data Sheet DS162 should be used for DC and switching characteristics.
This page combines the device specifications, package information, sourcing guidance, comparison points, and practical design notes needed to evaluate the XC6SLX25-3CSG324I for an FPGA-based system.
Alternatives de remplacement direct pour XC6SLX25-3CSG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX25-3CSG324I (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Package Type, Temperature Grade, Mounting Type.
XC6SLX25-2CSG324I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-3CSG324C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX25-2CSG324C
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-2CSG324I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-3CSG324I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX25-3CSG324I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-6 LX FPGA |
| Programmable Logic Cells | 24,051 cells |
| Internal Frequency | 500 MHz |
| Speed Grade | -3 |
| Package Type | 324-LFBGA, CSPBGA |
| Package Dimensions | 15 x 15 mm |
| Package Pitch | 0.80 mm |
| Package Designation | MO-275 |
| Nombre de broches | 324 pins |
| Température de fonctionnement | 0 C to 85 C |
| Lead-Free Package | Lead-free |
| FPGA Family | Spartan-6 LX |
| Manufacturer | AMD/Xilinx |
| Type de montage | Surface Mount |
| Catalog Number | XC6SLX25-3CSG324I |
Guide de configuration des broches du XC6SLX25-3CSG324I lead-free
Configuration des broches du XC6SLX25-3CSG324I (boîtier lead-free). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX25-3CSG324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX25-3CSG324I convient pour 6 applications: Industrial Automation Controller, Instrumentation Signal Conditioning, Communication Interface Aggregation, Video and Image Processing, Aerospace Ground Equipment, Programmable Logic Platform.
Industrial Automation Controller
The XC6SLX25-3CSG324I fits programmable industrial control because it combines 24,051 logic cells with a -3 speed grade and an industrial-temperature range of 0 C to 85 C. Its 324-ball interface supports parallel control, industrial I/O expansion, status acquisition, and deterministic sequencing without relying on a fixed logic device. The 15 x 15 mm CSBGA package demands careful BGA layout and assembly planning, but it enables a compact controller when board area is limited. Design engineers should use the AMD Spartan-6 package files for ball assignments and verify timing, power integrity, and thermal performance under the expected industrial operating cycle.
Recommandé
Instrumentation Signal Conditioning
For precision instrumentation, the XC6SLX25-3CSG324I can implement parallel acquisition, digital filtering, calibration tables, and control interfaces in one programmable device. Its 24,051 logic cells provide substantial configurable logic capacity, while the stated 500 MHz internal frequency supports timing-oriented designs that meet the device's speed-grade limits. The 324-CSBGA package gives access to a large pin count for converters, memory interfaces, and communication links. Engineers must budget logic and routing resources for each pipeline stage and confirm the -3 timing closure rather than treating the internal frequency as a guaranteed system-clock rate.
Recommandé
Communication Interface Aggregation
The XC6SLX25-3CSG324I is suitable for merging parallel data paths, protocol converters, test-sequence generation, and buffered interface logic. Its 324 pins provide more board-level connectivity than smaller FPGA packages, allowing multiple I/O standards and data channels to be consolidated while retaining programmable timing. The -3 grade should be selected when maximum Spartan-6 LX performance is important, but actual interface rates remain subject to I/O timing and routing constraints. Layout work should follow AMD's package files and include controlled-impedance routing, return paths, and adequate power and ground distribution around the BGA device.
Recommandé
Video and Image Processing
The XC6SLX25-3CSG324I can serve as a programmable video timing, pixel-processing, or test-pattern controller because 24,051 logic cells provide room for parallel pipelines, counters, and control state machines. The 324-CSBGA interface can accommodate high-pin-count data paths and supporting memory or sensor connections. Its -3 speed grade is useful for timing-critical horizontal and vertical processing, although achievable resolution and frame rate depend on I/O standards, external memory, and routing. Designers should perform post-route timing analysis and confirm output timing against the target display or camera interface.
Recommandé
Aerospace Ground Equipment
The XC6SLX25-3CSG324I can support programmable logic in aerospace ground-test equipment where compact logic density and deterministic interface control are useful. Its industrial 0 C to 85 C range and -3 speed grade suit controlled indoor environments, while the 324-CSBGA package enables extensive I/O in a relatively compact body. Ground equipment does not inherit the qualification requirements of an airborne design, but reliability programs can still impose extended-temperature, vibration, and lifecycle needs. Engineers should select higher-temperature or qualified devices when the equipment must operate outside the specified range.
Recommandé
Programmable Logic Platform
The XC6SLX25-3CSG324I works well as the central programmable-logic element in a laboratory or embedded control platform that needs configurable I/O, counters, state machines, and interface bridging. Its 24,051 logic cells allow one device to consolidate functions that might otherwise require several smaller programmable components, while the 324-CSBGA package provides a broad pin count. The FPGA remains constrained by its -3 speed grade, available memory resources, I/O standards, and routing. A successful platform should reserve logic for timing closure, use AMD pinout files during layout, and include a defined boot, configuration, and recovery strategy in the system architecture.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX25-3CSG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX25-2CSG324I | XC6SLX25-3CSG324C | XC6SLX25-2CSG324C | XC6SLX45-2CSG324I | XC6SLX45-3CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch | 324-CSBGA, 15 x 15 mm, 0.80 mm pitch |
| Brand | AMD/Xilinx | AMD/Xilinx | AMD/Xilinx | AMD/Xilinx | AMD/Xilinx | AMD/Xilinx |
| Speed Grade | -3 | -2 | -3 | -2 | -2 | -3 |
| Temperature Grade | Industrial I, 0 C to 85 C | Industrial I | Commercial C | Commercial C | Industrial I | Industrial I |
| Number of Pins | 324 pins | 324 pins | 324 pins | 324 pins | 324 pins | 324 pins |
| Lead-Free Package | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
Principaux différenciateurs
- Highest listed Spartan-6 LX speed grade in the comparison set (vs XC6SLX25-2CSG324I)
- Industrial-temperature capability with the -3 speed grade (vs XC6SLX25-3CSG324C)
- Lower-density implementation with the same package and -3 grade (vs XC6SLX45-3CSG324I)
Notes de conception
Use the AMD Spartan-6 package device pinout files as the controlling source for the 324-CSBGA land pattern. Confirm the 15 x 15 mm body, 0.80 mm pitch, MO-275 designation, ball assignments, and assembly-specific pad geometry before releasing the PCB. Keep power and ground distribution aligned with the manufacturer's package recommendations, and design the board process around the inspection, soldering, and rework requirements of a fine-pitch BGA.
Route every high-speed interface as a controlled-impedance path with a continuous return plane and avoid splits across the FPGA area. Place configuration, decoupling, clock, and I/O components according to the manufacturer reference design, and minimize stub length between the BGA device and external circuitry. Post-route timing analysis must include board-level effects, clock uncertainty, and the actual I/O standards used in the product.
Do not treat the listed 500 MHz internal frequency as a guaranteed system operating frequency. The -3 grade identifies the performance class, while achievable clock and interface rates depend on routing, resource use, timing constraints, and the selected I/O standard. When substituting a -2 or commercial-temperature variant, rerun timing and temperature checks rather than assuming the original -3 industrial design transfers unchanged.
Informations de conformité
The package is identified as lead-free in the product listing. RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals status are not confirmed.
