XC6SLX45-2CSG324I - 43,661-Cell Spartan-6 FPGA | AMD
Référence : XC6SLX45-2CSG324I ✓ ActifXC6SLX45-2CSG324I Présentation
A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, block RAM, programmable I/O, and dedicated hard intellectual property into one device. An FPGA belongs to the programmable-logic hierarchy, sitting above fixed-function logic devices and supporting parallel hardware acceleration, interface bridging, control, and signal processing. The Spartan-6 LX family combines these resources in devices intended for cost-sensitive, high-volume embedded systems.
Key resources include 43,661 logic cells, 3,411 configurable logic blocks, 2,138,112 RAM bits, and 218 I/O. The -2 suffix identifies the device speed grade, while the I suffix denotes the industrial-temperature option. The CSG324 package is a lead-free 15 mm by 15 mm surface-mount BGA with a 0.80 mm ball pitch and 324 terminals.
The Spartan-6 architecture supports programmable logic, block RAM, digital signal processing resources, memory interfaces, and selectable I/O standards. Its combination of substantial logic density and 218 user I/O allows one device to consolidate functions that might otherwise require an FPGA, microcontroller, and discrete interface logic. The 45 nm implementation also supports a broad family of industrial, consumer, communications, and automotive-infotainment designs.
Typical applications include industrial automation controllers, automotive infotainment systems, video and image-processing pipelines, communications-interface bridges, embedded control systems, and general-purpose accelerator boards. The 218-I/O package is particularly useful when a design must connect multiple buses, converters, memories, and external control signals while retaining substantial parallel-processing capability.
PCB design should follow the AMD package pinout file and the selected Spartan-6 design constraints. Place decoupling capacitors close to supply pins, preserve the required ballout and power-plane geometry, and provide a clean configuration path for reliable startup. Validate timing with the implementation tools appropriate to the installed device and speed grade.
This product record combines the verified Spartan-6 resource figures with package-specific sourcing guidance, application analysis, comparison parameters, and practical replacement-selection considerations. It is intended to help engineers distinguish true same-package options from superficially similar devices with different speed grades, temperature grades, densities, or footprints.
Alternatives de remplacement direct pour XC6SLX45-2CSG324I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX45-2CSG324I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Package Dimensions, Temperature Grade, Logic Cells.
XC6SLX45-3CSG324I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-L1CSG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2CSG324C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-2CSG324Q
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XA6SLX45-2CSG324I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2CSG324I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 cells |
| Configurable Logic Blocks | 3,411 CLBs |
| Total RAM | 2,138,112 bits |
| User I/O Count | 218 I/O |
| Internal Frequency | 500 MHz |
| Process Technology | 45 nm |
| Performance Grade | -2 speed grade |
| Temperature Grade | Industrial: -40 °C to +100 °C junction temperature |
| Core Supply Voltage | 1.14 V to 1.26 V |
| Package Type | 324-LFBGA, CSBGA-324, MO-275 |
| Package Dimensions | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Terminal Count | 324 terminals |
| Type de montage | Surface-mount SMD |
| Lead-Free Status | Lead-free |
| Statut RoHS | RoHS compliant |
| Device Family | Spartan-6 LX |
Guide de configuration des broches du XC6SLX45-2CSG324I 15 mm x 15 mm
Configuration des broches du XC6SLX45-2CSG324I (boîtier 15 mm x 15 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX45-2CSG324I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX45-2CSG324I convient pour 6 applications: Industrial Automation Controller, Automotive Infotainment Bridge, Video and Image Processing Pipeline, Communications Interface Bridge, Embedded Control and Acquisition System, Consumer and Industrial Automation Equipment.
Industrial Automation Controller
The XC6SLX45-2CSG324I fits industrial automation because it combines 43,661 logic cells with 218 I/O while carrying the industrial-temperature suffix. Engineers can implement sequencing, motion-control interfaces, machine interlocks, sensor acquisition, and communications bridging in one device. The 45 nm Spartan-6 LX architecture allows parallel control logic to execute deterministically, while 2,138,112 RAM bits support packet buffering and local data paths. The -2 grade should be checked against the required clock and interface timing, and the PCB should follow AMD's CSG324 power and ballout requirements.
Recommandé
Automotive Infotainment Bridge
The XC6SLX45-2CSG324I is suitable for automotive infotainment and display-interface bridging, where programmable logic can consolidate protocol conversion and control functions. Its 218 I/O provide ample connections for display links, serializers, memory interfaces, and control peripherals, while 43,661 logic cells support parallel datapaths. The industrial-temperature designation supports equipment operating beyond typical room-temperature conditions. Designers should perform the appropriate automotive qualification review, validate timing for the selected -2 speed grade, and implement clean power distribution across the 324-ball CSBGA.
Recommandé
Video and Image Processing Pipeline
The XC6SLX45-2CSG324I can implement parallel video or image-processing pipelines by mapping pixel transport, thresholding, filtering, and control functions into its 43,661 logic cells. Its 2,138,112 RAM bits provide useful local line buffers, while 218 I/O accommodate data capture and interface logic. The -2 speed grade supports clocked datapath designs when the implementation meets timing constraints. Engineers should use the AMD Spartan-6 clocking and memory resources according to the target video timing, and confirm that the selected CSG324 board supports the required physical and signal interfaces.
Recommandé
Communications Interface Bridge
The XC6SLX45-2CSG324I is appropriate for protocol bridges that translate among serial, parallel, memory, and control interfaces. Its 218 I/O reduce the need for external glue logic, while the programmable logic fabric supports simultaneous packet processing, buffering, and state management. The 2,138,112 RAM bits can be partitioned for FIFOs or dual-port buffers. For a bridge design, engineers should constrain all interface clocks, review the selected -2 grade's timing margin, and follow the AMD CSG324 package guidance for power integrity, decoupling, and signal routing.
Recommandé
Embedded Control and Acquisition System
The XC6SLX45-2CSG324I supports embedded control and data-acquisition systems requiring deterministic parallel logic alongside configurable I/O. Engineers can implement sampling control, trigger sequencing, sensor conditioning logic, and memory-managed data paths without relying on a separate microcontroller for every real-time function. The 43,661-cell fabric and 218 I/O provide meaningful consolidation in compact embedded equipment. The design should include careful clock-domain boundary constraints, I/O-standard assignments compatible with external devices, and thermal verification for the industrial-temperature CSG324 package.
Recommandé
Consumer and Industrial Automation Equipment
The XC6SLX45-2CSG324I fits cost-sensitive high-volume equipment requiring extensive programmable logic without the complexity of a larger FPGA. Its 45 nm Spartan-6 LX implementation balances logic density, memory, and I/O availability for consumer-adjacent products and industrial automation modules. The 324-ball package supports compact board construction, although its 0.80 mm pitch requires appropriate assembly capability. Designers should verify lifecycle objectives, configure the device for robust startup, and validate both functional behavior and timing after each implementation change.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX45-2CSG324I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX45-3CSG324I | XC6SLX45-L1CSG324I | XC6SLX45-2CSG324C | XC6SLX45-2CSG324Q | XA6SLX45-2CSG324I |
|---|---|---|---|---|---|---|
| Package | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA | 324-ball CSBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Device Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 class |
| Logic Cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells | 43,661 cells |
| RAM Bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits | 2,138,112 bits |
| User I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O | 218 I/O |
| Speed Grade | -2 | -3 | -1L | -2 | -2 | -2 |
| Temperature Grade | Industrial | Industrial | Industrial | Commercial | Q-grade option | Industrial |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Core Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
Principaux différenciateurs
- Uses the -2 performance grade within the Spartan-6 LX family (vs XC6SLX45-3CSG324I)
- Provides the industrial-temperature suffix for embedded equipment (vs XC6SLX45-2CSG324C)
- Retains 218 I/O and 2,138,112 RAM bits in the same 324-ball CSBGA (vs XC6SLX45-L1CSG324I)
- Offers 43,661 logic cells for integrated control and datapath processing (vs XC6SLX25-3CSG324I)
Notes de conception
Use the AMD CSG324 package drawing and ASCII ballout as the controlling sources for land patterns and electrical assignments. The package is a 15 mm by 15 mm, 324-ball BGA with 0.80 mm pitch, so small placement or registration errors can create open or shorted connections. Confirm drill, solder-mask, paste, and assembly-capability requirements with the board manufacturer before releasing the layout.
Assign every power and ground ball according to the AMD Spartan-6 package file rather than merging balls by apparent function alone. Decoupling capacitors should be placed near the corresponding device pins with short current loops, while the power and ground planes must satisfy the simultaneous switching requirements of the selected design. Validate the 1.14 V to 1.26 V core-supply range across temperature and process corners.
Do not treat a same-package FPGA as automatically interchangeable. Compare the XC6SLX45 density, -2 or alternative speed grade, I/O count, voltage configuration, temperature range, pin assignments, and block-RAM mix, then rerun timing and power analysis. Configuration compatibility also matters because existing bitstreams may need regeneration when the target device, speed grade, or design revision changes.
Estimated: device dissipation depends on the implemented design and cannot be calculated from the part number alone. Evaluate utilization, toggle rate, configured RAM, I/O activity, voltage, and ambient temperature using the AMD power tools, then add the measured or estimated junction rise to the worst-case ambient condition. The industrial suffix does not remove the need to control internal power density and board temperature.
Apply the AMD Spartan-6 I/O and clocking guidance for every external interface, including I/O standard, drive strength, slew, pull behavior, and timing constraints. Keep high-speed routes short, provide continuous reference planes where required, and separate noisy clock or power-conversion paths from sensitive inputs. Re-run implementation after any pin constraint or package-related change.
Informations de conformité
The device is identified as RoHS compliant and lead-free in the manufacturer-family and distributor specification records. No verified automotive qualification statement, REACH declaration, halogen-free declaration, or conflict-minerals declaration was identified.
