XC6SLX45-2CSG484I - 43,661-Cell Spartan-6 LX FPGA | AMD
Référence : XC6SLX45-2CSG484I ✓ ActifXC6SLX45-2CSG484I Présentation
A field-programmable gate array is a programmable semiconductor containing configurable logic blocks, programmable interconnect, block RAM, and input/output resources. An FPGA belongs to the programmable-logic device hierarchy above standard fixed-function logic ICs. Spartan-6 devices combine this flexibility with deterministic hardware operation, allowing designs to be upgraded through configuration bitstreams without changing the printed circuit board.
The XC6SLX45-2CSG484I provides 43,661 logic cells organized into 6,822 adaptive logic modules, along with 2.04 Mbit of embedded block memory. Its 45 nm CMOS implementation and 1.2 V operating voltage place it in a low-voltage programmable-logic architecture. The listed 500 MHz internal frequency describes a headline device characteristic, while actual system performance also depends on the selected clocking, I/O, routing, and implemented design.
The device uses a 15 mm by 15 mm lead-free CSBGA package with a 0.80 mm pitch. The industrial suffix I denotes the 0°C to 85°C operating range specified for this configuration. Its 484-ball surface-mount land pattern supports dense PCB routing and high pin availability, but careful ball-grid assignment, power-plane design, and thermal management are required for reliable implementation.
Typical uses include industrial control, test and measurement equipment, communications infrastructure, embedded vision, signal processing, and general-purpose high-speed logic consolidation. The large logic-cell count is useful when a design exceeds the practical capacity of small CPLDs, while embedded block memory can reduce external memory access in moderately parallelized data-processing paths.
When designing a board around the XC6SLX45-2CSG484I, follow the AMD Spartan-6 pinout, configuration, power, clocking, and decoupling guidance exactly. Preserve the required configuration interface and avoid routing high-speed signals through the power and ground planes. Validate signal integrity and power integrity with the selected I/O standards, clock topology, and final stack-up.
This product page combines the AMD device identity, exact ordering code, package details, documented alternatives, and practical engineering guidance in one reference. It helps engineers distinguish package, temperature, and speed-grade changes before approving a drop-in replacement or designing a new Spartan-6 board.
Alternatives de remplacement direct pour XC6SLX45-2CSG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX45-2CSG484I (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Adaptive Logic Modules, Device Type.
XC6SLX45-2CSG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-3CSG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45T-2CSG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2FG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XA6SLX45-3CSG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2CSG484I Valeurs maximales et caractéristiques électriques
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 43,661 logic cells |
| Adaptive Logic Modules | 6,822 ALMs |
| Embedded Memory | 2.04 Mbit |
| Process Technology | 45 nm CMOS |
| Core Operating Voltage | 1.2 V |
| Internal Frequency | 500 MHz |
| Speed Grade | -2 |
| Boîtier | 484-pin CSBGA |
| Package Dimensions | 15 mm x 15 mm |
| Package Pitch | 0.80 mm |
| Ball Count | 484 balls |
| Température de fonctionnement | 0°C to 85°C |
| Type de montage | Surface mount |
| Lead-Free Status | Lead free |
| Device Series | Spartan-6 LX |
| Product Type | Programmable logic device |
Guide de configuration des broches du XC6SLX45-2CSG484I 0.80 mm
Configuration des broches du XC6SLX45-2CSG484I (boîtier 0.80 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX45-2CSG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX45-2CSG484I convient pour 6 applications: Industrial Control and Automation, Test and Measurement Instrumentation, Communications Signal Processing, Embedded Vision and Image Processing, Programmable Logic Consolidation, High-Speed Data Acquisition.
Industrial Control and Automation
The XC6SLX45-2CSG484I fits industrial controllers that coordinate sensors, motion functions, interlocks, and operator interfaces within a compact programmable-logic platform. Its 43,661 logic cells and 6,822 ALMs provide substantial capacity for parallel control paths and complex state machines, while 2.04 Mbit of embedded memory can hold working data close to the logic. The 0°C to 85°C range supports industrial-temperature equipment. Place the device on a multilayer board with continuous power and ground planes, then validate timing under the final I/O loading and industrial temperature conditions.
Recommandé
Test and Measurement Instrumentation
The XC6SLX45-2CSG484I is suitable for parallel acquisition, sequencing, pattern generation, and data-processing logic in test and measurement equipment. The 43,661-cell Spartan-6 LX device can implement multiple instrument channels concurrently, and its 2.04 Mbit of embedded memory can reduce data-movement overhead for buffered samples. The listed 500 MHz internal frequency provides a basis for high-speed logic design, although usable timing depends on routing and I/O constraints. Validate every high-speed interface with the final clocking scheme and PCB stack-up.
Recommandé
Communications Signal Processing
The XC6SLX45-2CSG484I can support communications systems requiring parallel filtering, packet handling, framing, and interface adaptation. Its 6,822 adaptive logic modules and 2.04 Mbit of embedded memory allow substantial fixed pipelines to coexist with configurable control logic. The -2 speed grade is appropriate when the design can meet timing at that grade, while XC6SLX45-3CSG484I offers a faster option for more demanding timing closures. Keep clocks, transceivers, and high-speed I/O paths isolated from switching power paths.
Recommandé
Embedded Vision and Image Processing
The XC6SLX45-2CSG484I offers enough programmable logic for embedded image pre-processing, pixel classification, and parallel pipeline control. A total of 43,661 logic cells supports substantial fixed-function processing alongside programmable decision logic, while 2.04 Mbit of embedded memory can buffer moderate amounts of image data within the FPGA. Its industrial temperature range is useful in camera and inspection systems operating from 0°C to 85°C. The design must account for external image-sensor interfaces, memory timing, and deterministic I/O constraints.
Recommandé
Programmable Logic Consolidation
The XC6SLX45-2CSG484I is useful when several fixed-function PLDs, glue logic, and interface blocks must be consolidated into one programmable device. Its 43,661 logic cells and 2.04 Mbit of embedded memory offer substantially more capacity than small CPLDs while retaining deterministic FPGA behavior. The 1.2 V core architecture requires careful power planning, and the 484-ball CSBGA land pattern demands advanced assembly capability. Consolidate functions only after checking migration effort, pin constraints, and the configuration scheme.
Recommandé
High-Speed Data Acquisition
The XC6SLX45-2CSG484I can implement high-speed sampling control, parallel data alignment, and real-time filtering for professional audio, communications, and industrial acquisition systems. Its 43,661 logic cells and 6,822 ALMs allow pipelined processing with deterministic latency, while 2.04 Mbit of embedded memory supports buffering and elastic interfaces. The 500 MHz internal-frequency figure establishes the device's performance class, but actual sample rate is limited by I/O timing, clocking, and board-level signal integrity. Perform corner-to-corner timing and eye-pattern verification.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX45-2CSG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX45-2CSG484C | XC6SLX45-3CSG484I | XC6SLX45T-2CSG484I | XC6SLX45-2FG484C | XA6SLX45-3CSG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin CSBGA | 484-pin CSBGA | 484-pin CSBGA | 484-pin CSBGA | 484-pin CSBGA | 484-pin CSBGA |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -2 | -3 | -2 | -2 | -3 |
| Special Features | Spartan-6 LX industrial-temperature configuration | Commercial-temperature configuration | Faster -3 speed grade | T-series device designation | Commercial-temperature configuration | XA-series -3 speed grade |
Principaux différenciateurs
- Maintains the original -2 performance grade in a same-package replacement (vs XC6SLX45-2CSG484C)
- Provides one higher speed grade for timing-sensitive designs (vs XC6SLX45-3CSG484I)
- Preserves the original logic density and embedded-memory capacity (vs XC6SLX45-2FG484C)
- Offers a T-series option without changing the documented -2 speed grade (vs XC6SLX45T-2CSG484I)
Notes de conception
Implement the Spartan-6 LX power architecture exactly as defined in the AMD CSG484 documentation. The 1.2 V core rail requires a low-noise source with sequencing coordinated across configuration, auxiliary, and I/O supplies. Place stable decoupling capacitance at the device power balls, keep supply paths short, and verify startup, shutdown, current-limit behavior, and voltage tolerance under worst-case configuration and I/O activity before releasing the layout.
Plan the 484-ball CSBGA assembly for heat spreading through the board rather than relying on a small copper area. The 1.2 V core architecture can still produce significant total power when many logic, memory, and I/O resources are active. Use the AMD power estimator with the intended clocking and utilization, model worst-case ambient temperature, and provide thermal vias and copper planes where the package construction and assembly process permit.
Route the 0.80 mm-pitch BGA on a multilayer PCB with continuous ground planes and careful power-plane splitting. Match layer transitions to the fabricator's assembly capabilities, preserve solder-mask and land-pattern rules for the selected package, and avoid vias beneath components where thermal expansion or assembly tolerances could create defects. Review every ball assignment against the manufacturer package drawing before releasing artwork.
Separate clock, configuration, serial transceiver, and other high-speed routes from noisy power paths. Use the final I/O standards, clock topology, target data rates, and PCB stack-up in simulation because the 500 MHz internal-frequency figure does not by itself guarantee a specific external interface rate. Add source-series termination where required and validate eye margin, crosstalk, jitter, and clock skew on the manufactured assembly.
Do not treat the I, C, T, -2, and -3 identifiers as interchangeable without reviewing their qualification and timing effects. A same-package replacement can still change commercial versus industrial status, speed grade, device family, or configuration behavior. Re-run synthesis constraints, implementation timing, power analysis, and hardware validation for the exact replacement MPN, and retain the original ordering code in controlled production records.
Informations de conformité
The device is identified as lead-free. Exact RoHS, REACH, halogen-free, and conflict-minerals declarations for this ordering code require current manufacturer documentation.
