XC6SLX45-3FGG484I - 43,661-Cell Spartan-6 FPGA | AMD
Référence : XC6SLX45-3FGG484I ✗ Fin de vieXC6SLX45-3FGG484I Présentation
A field-programmable gate array is a digital semiconductor whose logic, interconnect, and processing resources can be configured after manufacture. Within the product hierarchy, an FPGA is a programmable logic device, a reconfigurable semiconductor, and a higher-complexity alternative to fixed-function logic. The Spartan-6 LX family combines logic resources, block RAM, DSP blocks, programmable I/O, and dedicated configuration functions within a single integrated circuit.
The XC6SLX45-3FGG484I provides 43,661 logic cells organized into 6,822 adaptive logic modules, with related family data identifying 3,411 configurable logic blocks and a maximum operating frequency of 862 MHz. Its 316 I/O support useful external connectivity for control signals, data buses, memory interfaces, and industrial communication links. The device is manufactured using 45 nm CMOS technology according to the manufacturer family documentation.
The -3 designation identifies the high-performance Spartan-6 LX speed grade, making this ordering code appropriate when timing closure or interface performance is more important than minimum cost. Its 484-ball package supports dense board layouts, while the 0.80 mm ball pitch and 15 mm by 15 mm body require careful ball assignment, escape routing, and multilayer PCB design. The package is identified as lead-free and compatible with MO-275-style board-level construction guidance.
Typical applications include factory automation controllers, programmable machine interfaces, motor-control systems, industrial networking equipment, test and measurement platforms, and embedded video or vision processing. The combination of substantial logic density, DSP capability, and numerous I/O allows designers to consolidate control logic and parallel processing into one programmable device instead of using multiple fixed-function components.
The primary design consideration is PCB implementation rather than linear power dissipation. Follow the AMD Spartan-6 package pinout files when assigning balls and route high-speed interfaces with controlled impedance, continuous reference planes, and appropriate length matching. Confirm the selected configuration, I/O standards, supported clocking resources, and industrial temperature requirements before releasing the design to fabrication.
This product page consolidates the verified device identity, package characteristics, family parameters, ordering-code alternatives, and practical implementation guidance. It also highlights which details require confirmation in the AMD package data and design tools before a new board is released.
Alternatives de remplacement direct pour XC6SLX45-3FGG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX45-3FGG484I (même facteur de forme et même empreinte) — différant par Package, Logic Cells, Operating Temperature, Speed Grade, Device Type.
XC6SLX45T-3FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-3FGG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX45-2FG484C
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX45-3FGG484I Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Spartan-6 LX |
| Logic Cells | 43,661 cells |
| Adaptive Logic Modules | 6,822 ALMs |
| Configurable Logic Blocks | 3,411 CLBs |
| Internal Frequency | 500 MHz |
| Maximum Operating Frequency | 862 MHz |
| Input and Output Count | 316 I/O |
| Package Type | 484-BBGA |
| Package Body Size | 15 mm x 15 mm |
| Ball Pitch | 0.80 mm |
| Process Technology | 45 nm CMOS |
| Speed Grade | -3 |
| Temperature Grade | I (industrial) |
| Température de fonctionnement | 0°C to 85°C |
| Lead-Free Status | Lead-free package |
| Board Construction Reference | MO-275 |
| Type de montage | Surface mount |
Guide de configuration des broches du XC6SLX45-3FGG484I 15 mm x 15 mm
Configuration des broches du XC6SLX45-3FGG484I (boîtier 15 mm x 15 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX45-3FGG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX45-3FGG484I convient pour 6 applications: Industrial Automation Controller, Motor Control System, Machine Vision Preprocessing, Industrial Networking Equipment, Test and Measurement Equipment, Embedded Communication Gateway.
Industrial Automation Controller
The XC6SLX45-3FGG484I fits industrial automation controllers that combine sequencing, data acquisition, communications, and machine-safety-adjacent control logic in one programmable device. Its 43,661 logic cells provide substantial capacity for parallel control channels, while 316 I/O support encoders, discrete sensors, actuator outputs, and industrial buses. The -3 speed grade supplies useful timing margin for demanding control loops, and the industrial ordering suffix supports a 0°C to 85°C ambient range. Design the system around the official AMD package pinout and verify timing after the PCB constraints are entered.
Recommandé
Motor Control System
The XC6SLX45-3FGG484I is well suited to embedded motor-control systems that combine pulse-width modulation, encoder capture, fault handling, and supervisory logic. The 500 MHz internal frequency and high-performance -3 grade support deterministic control pipelines, while the Spartan-6 LX logic and DSP resources can consolidate functions that would otherwise require separate processors and interface devices. Its 316 I/O provide ample connectivity for position sensors, phase signals, protection inputs, and communications. External power-stage isolation, grounding, and timing analysis remain outside the FPGA package and must be handled at board level.
Recommandé
Machine Vision Preprocessing
The XC6SLX45-3FGG484I can implement front-end machine-vision preprocessing such as pixel classification, thresholding, line detection, and data reduction before information reaches a higher-level processor. Parallel Spartan-6 LX logic supports throughput-oriented pipelines, while the 316 I/O can connect image sensors, line buffers, and high-speed data sources. The -3 grade provides additional routing and timing margin compared with lower speed grades. Camera interface standards, voltage levels, and synchronization accuracy must be verified against the selected sensor and AMD I/O specifications before schematic capture.
Recommandé
Industrial Networking Equipment
The XC6SLX45-3FGG484I is appropriate for industrial networking equipment requiring programmable packet handling, protocol conversion, interface arbitration, and system control. Its 43,661 logic cells allow substantial parallel logic, and the 316 I/O offer flexible connectivity for multiple physical-layer interfaces and management signals. The -3 speed grade can improve timing closure for high-speed internal datapaths, although external PHY characteristics and line rates determine the achievable system performance. Use controlled-impedance routing and verify all transceiver, isolation, and magnetics requirements independently of the FPGA.
Recommandé
Test and Measurement Equipment
The XC6SLX45-3FGG484I can serve as the programmable acquisition and control core in test and measurement systems requiring multiple data channels, timing logic, sequencing, and analysis pipelines. Its extensive I/O and logic capacity allow parallel engine channels and digital pattern generation to share one device, while the -3 speed grade supports demanding internal timing. The industrial temperature range permits use in controlled equipment environments. For high-voltage or safety-related measurement, additional isolation, protection, and calibration circuitry must be designed around the FPGA rather than assumed to be provided by it.
Recommandé
Embedded Communication Gateway
The XC6SLX45-3FGG484I fits communication gateways that must bridge serial links, buffer data, maintain protocol state, and coordinate industrial or networked peripherals. Parallel configurable logic supports multiple channels and protocol engines, and the 316 I/O provide flexible support for digital interfaces. The -3 grade offers timing margin for demanding routing or pipeline designs, while the 0°C to 85°C industrial range fits many deployed systems. Designers should use the AMD clocking and pinout documentation to preserve configuration, startup, and signal-integrity requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX45-3FGG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX45T-3FGG484I | XC6SLX45-2FGG484I | XC6SLX45-3FGG484C | XC6SLX45T-2FGG484I | XC6SLX45-2FG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
| FPGA Family | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LX | Spartan-6 LX | Spartan-6 LXT | Spartan-6 LX |
| Speed Grade | -3 | -3 | -2 | -3 | -2 | -2 |
Principaux différenciateurs
- Higher performance grade than -2 alternatives (vs XC6SLX45-2FGG484I)
- Industrial temperature ordering (vs XC6SLX45-3FGG484C)
- High-density 484-ball package with substantial I/O (vs XC6SLX45-2FG484C)
Notes de conception
Use AMD's official Spartan-6 FGG484 package pinout file as the controlling source for ball assignment. The 0.80 mm pitch and 15 mm by 15 mm body require a multilayer PCB with short escape routes for high-speed signals. Keep configuration pins, clock inputs, and dedicated power balls connected exactly as specified. Run the final design through AMD's package and board checks before fabrication rather than relying on a generic BGA symbol.
Plan continuous power and ground planes beneath the BGA, with via arrays placed to support both signal escape and thermal dissipation. Separate high-speed clock and data routes from noisy switching nodes, maintain the referenced-impedance geometry selected for the board stack-up, and apply length matching only to interfaces whose source documents specify it. Preserve the FPGA package's exposed thermal behavior and avoid placing tall components where they impede convection or assembly inspection.
Changing among -3 and -2 ordering codes changes the timing model even though the family and package remain the same. After any substitution, rerun synthesis and implementation, inspect setup and hold timing, and confirm that every clock domain meets its constraint. Also verify the final temperature suffix against the product's ambient requirements; a faster grade cannot compensate for an insufficient environmental rating.
Informations de conformité
The package is identified as lead-free and associated with MO-275 board-construction guidance. Detailed RoHS, REACH, AEC-Q100, halogen-free, and conflict-minerals declarations were not established by the cited product records.