XC6SLX75-2CSG484I - 45nm Spartan-6 LX FPGA | AMD
Référence : XC6SLX75-2CSG484I ✓ ActifXC6SLX75-2CSG484I Présentation
A field-programmable gate array, or FPGA, is a semiconductor whose digital logic, interconnect, and I/O can be configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, which includes complex programmable logic devices, field-programmable gate arrays, and system-programmable devices. Spartan-6 LX devices provide parallel programmable logic resources for control, signal processing, communications, and embedded-system designs.
The XC6SLX75-2CSG484I provides 74,637 logic cells and 11,662 adaptive logic modules. Its 3.02 Mbit of embedded block RAM supports buffering, packet storage, data acquisition, and general-purpose digital processing. The 292 available I/O provide connections to external converters, memory, communications transceivers, and control logic. These figures position the device between smaller Spartan-6 parts and higher-density programmable-logic devices.
The part is manufactured on a 45 nm CMOS process and uses a 1.2 V core voltage. The -2 ordering code identifies the performance grade, while CSG484 identifies the 484-ball surface-mount package. An I suffix denotes the industrial temperature option. Because the available listing does not provide complete timing, power, I/O-standard, and absolute-maximum data, those details must be confirmed in the manufacturer documentation before a design is released.
Typical uses include industrial control, communications infrastructure, instrumentation, embedded signal processing, data acquisition, and compact control systems. Its combination of 74,637 logic cells and 3.02 Mbit of embedded memory allows designers to implement parallel algorithms and control functions in one programmable device while simplifying the logic around external ADCs, transceivers, and processors.
PCB implementation requires careful BGA escape routing, power planning, decoupling, and thermal analysis. Because this is a 484-ball package, signal-integrity and assembly considerations are more significant than for a leaded package. The CSBGA footprint must match the PCB land pattern exactly, and the complete pinout must be checked against the selected Spartan-6 package documentation before routing.
This page combines verified distributor and cross-reference data with practical qualification guidance for engineers evaluating the XC6SLX75-2CSG484I. It distinguishes documented density, memory, voltage, package, and lifecycle facts from unreported parameters and identifies the temperature- and package-code alternatives that require design review.
Alternatives de remplacement direct pour XC6SLX75-2CSG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC6SLX75-2CSG484I (même facteur de forme et même empreinte) — différant par Logic Cells, Mounting Type.
XC6SLX75T-2CSG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-2CSG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-2FGG484I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC6SLX75T-2FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75T-2FGG484C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC6SLX75-2CSG484I Valeurs maximales et caractéristiques électriques
| Product Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 74,637 cells |
| Logic Elements | 74,637 LE |
| Adaptive Logic Modules | 11,662 ALM |
| Embedded Memory | 3.02 Mbit |
| Maximum I/O Count | 292 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Performance Grade | -2 |
| Temperature Grade Code | I |
| Package Type | 484-FBGA (CSPBGA) |
| Package Pin Count | 484 pins |
| Type de montage | Surface Mount |
| Programming Technology | Field-programmable gate array |
| Statut du cycle de vie | Active production |
Guide de configuration des broches du XC6SLX75-2CSG484I 484 pins
Configuration des broches du XC6SLX75-2CSG484I (boîtier 484 pins). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC6SLX75-2CSG484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC6SLX75-2CSG484I convient pour 6 applications: Industrial Control and Automation, Data-Acquisition and Signal Processing, Communications and Network Control, Embedded Instrumentation, Programmable Logic and System Control, Aerospace and Defense Test Equipment.
Industrial Control and Automation
The XC6SLX75-2CSG484I is appropriate for programmable industrial-control logic because it provides 74,637 logic cells, 11,662 adaptive logic modules, 3.02 Mbit of embedded memory, and up to 292 I/O within one 484-FBGA device. The available I/O can accommodate digital sensors, machine outputs, interlocks, status indicators, and external bus devices. Its I temperature-grade ordering option is relevant to industrial equipment, although the complete electrical and environmental limits must be checked in the manufacturer documentation. Engineers can implement sequencing and control logic alongside local data buffering without relying on a separate FPGA for every function. The -2 performance grade and 1.2 V core supply are the verified identifying parameters, while clock, I/O, and power details remain subject to the complete datasheet review.
Recommandé
Data-Acquisition and Signal Processing
The XC6SLX75-2CSG484I can support parallel data-acquisition and digital signal-processing functions where deterministic logic and local buffering are required. Its 74,637 logic cells provide substantial parallel-processing capacity, while 3.02 Mbit of embedded memory can hold acquisition samples, filter coefficients, or intermediate results. Up to 292 I/O make the device suitable for connecting external ADCs, digital sensors, and data-capture logic. The 1.2 V core supply and -2 performance grade are verified, but signal-interface rates and supported I/O standards are not supplied. Engineers must therefore select the correct bank voltages and confirm timing margins against the acquisition architecture rather than assuming that every I/O supports every voltage or protocol.
Recommandé
Communications and Network Control
The XC6SLX75-2CSG484I is suitable for communications control, protocol handling, and packet-processing functions that benefit from programmable parallel logic. Its 11,662 adaptive logic modules and 3.02 Mbit of embedded memory can support buffering, framing, filtering, and state-machine implementation, while as many as 292 I/O provide interfaces to transceivers, status signals, and data converters. The verified 45 nm CMOS process and -2 performance grade identify the device family but do not establish particular Ethernet, serial, or transceiver standards. Those interfaces must be verified from the I/O and timing documentation. A practical design should partition fixed interface logic from flexible packet processing and validate the complete clocking scheme with the selected communication components.
Recommandé
Embedded Instrumentation
The XC6SLX75-2CSG484I fits embedded instrumentation systems that combine measurement control, local data storage, and human-interface or communications logic. The FPGA's 74,637 logic cells can implement control and formatting functions, its 3.02 Mbit of embedded memory can buffer captured data, and its up-to-292 I/O can connect converters, displays, switches, and external interface devices. The 484-FBGA package supports dense integration but demands careful escape routing and power distribution. Since no verified display-interface or instrumentation-specific timing data was supplied, the design must use only interfaces confirmed in the package pinout and device documentation. The 1.2 V core rail should be planned separately from any required I/O bank supplies, with decoupling and return-current paths reviewed as part of signal-integrity analysis.
Recommandé
Programmable Logic and System Control
The XC6SLX75-2CSG484I can serve as a centralized programmable-logic device for system control, arbitration, sequencing, and mixed fixed/soft logic. With 74,637 logic cells and 11,662 adaptive logic modules, it provides substantially more implementation capacity than a small CPLD while remaining in the Spartan-6 LX family. Its 3.02 Mbit of embedded memory can support deeper queues or register files than discrete logic, and up to 292 I/O offer extensive board-level connectivity. The verified records do not supply block-RAM operating modes or maximum clock rates, so engineers should verify those details before allocating advanced pipelines. The -2 grade is a useful procurement identifier, but it should not replace a full timing and power review for the target board, clock, and end-product conditions.
Recommandé
Aerospace and Defense Test Equipment
The XC6SLX75-2CSG484I can be evaluated for ground-based test and instrumentation equipment where deterministic programmable logic, configurable I/O, and substantial embedded memory are useful. Its 74,637 logic cells and 11,662 adaptive logic modules support parallel test-sequence and data-processing functions, while 3.02 Mbit of embedded memory can be divided among capture, correlation, and buffer resources. The industrial I ordering option does not by itself establish aerospace or defense qualification; no verified MIL-HDBK, AEC-Q100, or radiation-test evidence was supplied. Engineers must obtain the exact qualification and environmental records for the selected ordering code. The 484-FBGA assembly also needs package-specific solder-mask, land-pattern, X-ray, and thermal controls appropriate to the quality requirements of the finished system.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC6SLX75-2CSG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC6SLX75T-2CSG484I | XC6SLX75-2CSG484C | XC6SLX75-2FGG484I | XC6SLX75T-2FGG484I | XC6SLX75T-2FGG484C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 484-FBGA (CSPBGA) | 484-FBGA (CSPBGA) | 484-FBGA (CSPBGA) | 484-FBGA (CSPBGA) | 484-FBGA (CSPBGA) | 484-FBGA (CSPBGA) |
| Series | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Logic Cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells | 74,637 cells |
| Performance Grade | -2 | -2 | -2 | -2 | -2 | -2 |
Principaux différenciateurs
- Matches the documented 74,637-cell Spartan-6 LX density while retaining the CSG484 ordering family (vs XC6SLX100-2CSG484I)
- Provides the industrial I-grade option in the directly documented CSG484 family (vs XC6SLX75-2CSG484C)
- Offers 24 more documented I/O than the related FGG484I listing (vs XC6SLX75-2FGG484I)
Notes de conception
Plan the 1.2 V core rail independently from all I/O bank supplies because the verified data confirms only the 1.2 V core voltage. Place the regulator and local decoupling as close as practical to the device, provide a low-impedance ground reference, and use the manufacturer power-decoupling recommendations before assigning capacitor values. Do not infer I/O voltage tolerance from the core rail or assume that all 292 I/O share one bank voltage.
The 484-FBGA CSPBGA footprint requires controlled escape routing and a PCB land pattern copied from the exact package drawing. Keep high-speed nets short, provide continuous return paths, and account for BGA pitch, solder-mask definition, and assembly requirements. Before committing a layout, compare every used ball and power position against the selected ordering code; the verified FGG484 comparison demonstrates that a related package code can expose 268 I/O rather than 292.
Thermal assessment must include the FPGA, the 1.2 V supply, nearby converters, and the 484-ball package. The verified data does not provide junction temperature, package thermal resistance, or FPGA power consumption, so a numerical thermal conclusion would be unsupported. Use the manufacturer's power and thermal characterization data for the exact device, preserve exposed copper and via connectivity where the package design allows, and test the assembled board under worst-case activity and ambient conditions.
Do not treat XC6SLX75, XC6SLX75T, CSG484, and FGG484 as interchangeable without checking the complete ordering code. The verified records show that package-code and temperature-grade changes can alter available I/O or qualification requirements even when logic density remains 74,637 cells. Confirm the pinout, configuration interface, bank supplies, lifecycle status, and temperature option against the exact manufacturer documentation before approving a substitution.
Informations de conformité
The supplied snippets reference RoHS and REACH comparisons but do not provide explicit compliance conclusions for this exact part. The industrial I suffix is not treated as evidence of AEC-Q100 qualification. Compliance fields remain unknown until supported by an applicable manufacturer declaration.
