XC7A12T-1CPG238C - 12,800-LC Artix-7 FPGA | AMD
Référence : XC7A12T-1CPG238C ✓ ActifXC7A12T-1CPG238C Présentation
An FPGA is a semiconductor whose digital functionality is defined after fabrication through a configuration bitstream. Within the product hierarchy, this Artix-7 device belongs to the Xilinx 7 Series FPGA family and combines a configurable logic array with programmable I/O blocks, DSP slices, block RAM, and dedicated configuration resources. This makes it more flexible than a fixed-function application-specific integrated circuit while providing more integration than a collection of discrete logic devices.
The verified specifications identify 12,800 logic cells, 737,280 bits of block RAM, 40 DSP slices, and 106 I/O. The AMD Artix-7 product page states that the family uses a 28 nm process and is optimized for low-power applications requiring serial transceivers and high DSP and logic throughput. These attributes make the device suitable for embedded control, industrial automation, communications, and signal-processing systems where firmware updates and reconfigurable hardware add practical value.
The XC7A12T designation identifies the Artix-7 device family and its resource level, while the -1 designation identifies the performance grade. The CPG238 suffix identifies the compact 238-ball package used by the device. Distributor listings also describe the package as 238-LFBGA or CSPBGA. Because the exact target MPN uses the commercial-temperature suffix C, engineers should confirm the complete ordering information, pinout, configuration requirements, and operating-temperature requirements against the AMD package and product documentation before releasing a design.
Typical uses include industrial control and factory automation, low-power embedded processing, communications equipment, sensor aggregation, and compact DSP-based products. The 40 DSP slices support parallel arithmetic operations, while 720 Kbit of block RAM allows data buffering and local storage without relying entirely on external memory. The 106 I/O count supports interfaces to sensors, transceivers, converters, and discrete digital peripherals when the selected I/O standards and voltage banks permit them.
A practical design priority is to complete pin planning before layout. AMD provides Artix-7 package pinout files in TXT and CSV formats, and those files should be used to confirm every ball assignment, configuration pin, supply pin, and exposed-pad connection. Designers must also verify that the PCB stack-up, via pattern, power distribution, and decoupling arrangement meet the package and platform requirements.
This product record combines distributor availability, package details, Artix-7 family characteristics, and a same-family replacement analysis. It also distinguishes verified device facts from unavailable electrical details, avoiding unsupported assumptions about voltage ratings, temperature limits, pin functions, and lifecycle commitments.
Alternatives de remplacement direct pour XC7A12T-1CPG238C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A12T-1CPG238C (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Process Technology.
XC7A12T-2CPG238C
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A12T-3CPG238C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-2CPG238I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-3CPG238I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A15T-1CPG238C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A12T-1CPG238C Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 Field-Programmable Gate Array |
| Logic Cells | 12,800 logic cells |
| Block RAM | 737,280 bits |
| DSP Slices | 40 DSP slices |
| User I/O | 106 I/O |
| Boîtier | 238-LFBGA CSBGA |
| Package Designation | CPG238 |
| Process Technology | 28 nm |
| Performance Grade | -1 speed grade |
| Temperature-Grade Suffix | C suffix |
| Surface-Mount Type | Surface mount BGA |
| DigiKey Listed Price | Price not stated in the provided result |
| LCSC Listed Starting Price | USD 7.0966 |
| Alternate LCSC Listed Price | USD 12.1272 |
Guide de configuration des broches du XC7A12T-1CPG238C cpg238
Configuration des broches du XC7A12T-1CPG238C (boîtier cpg238). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A12T-1CPG238C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A12T-1CPG238C convient pour 6 applications: Industrial Control and Automation, Communications and Protocol Bridging, Embedded Sensor Aggregation, Low-Power Edge Processing, Programmable Signal Conditioning, Compact Data-Acquisition System.
Industrial Control and Automation
The XC7A12T-1CPG238C fits compact industrial-control logic where a fixed microcontroller cannot provide sufficient parallelism or where field updates add value. Its 12,800 logic cells can implement multiple control channels, while 40 DSP slices support filtering or motion-related arithmetic and 720 Kbit of block RAM buffers data locally. With 106 I/O, the device can connect sensors, isolation devices, converters, and field-bus transceivers. The 238-CPBGA package also supports compact boards, but industrial suitability still depends on verifying the required operating-temperature grade and supported I/O standards.
Recommandé
Communications and Protocol Bridging
The XC7A12T-1CPG238C is suitable for communications equipment requiring configurable datapaths and parallel-to-serial logic around dedicated transceivers. The 12,800 logic cells can implement framing, buffering, and protocol conversion, while the 40 DSP slices can support filtering or symbol-processing tasks. Its 106 I/O provide connections for transceivers, memories, and control logic, and 720 Kbit of block RAM can absorb packet traffic or support deterministic buffering. Designers should assign interfaces and voltage banks from official package data before layout and confirm timing closure in the selected FPGA tool.
Recommandé
Embedded Sensor Aggregation
The XC7A12T-1CPG238C can combine multiple sensor channels when deterministic sampling and programmable preprocessing are important. The device’s 40 DSP slices can execute parallel digital filtering or calibration arithmetic, and its 720 Kbit of block RAM provides local buffering for samples from slow and fast peripherals. The 106 available I/O simplify connections among sensors, converters, and isolation or communication devices. Because the supplied data does not define every I/O standard or voltage range, the design must select compatible banks and validate acquisition timing against the final device documentation.
Recommandé
Low-Power Edge Processing
The XC7A12T-1CPG238C supports low-power edge-processing designs where a microcontroller plus external accelerators would otherwise increase board complexity. AMD states that Artix-7 devices use a 28 nm process and are optimized for low-power applications with high logic and DSP throughput. The FPGA combines 12,800 logic cells, 40 DSP slices, and 720 Kbit of block RAM in one programmable device, reducing the number of external components. Actual power must be evaluated from the final bitstream and operating activity; the supplied evidence does not provide a verified quiescent-power specification for this exact MPN.
Recommandé
Programmable Signal Conditioning
The XC7A12T-1CPG238C is a practical fit for programmable signal-conditioning products that need adjustable digital behavior. The 40 DSP slices can implement FIR, IIR, interpolation, or decimation operations, while 12,800 logic cells can manage control state, interfaces, and test logic. The 720 Kbit of block RAM supports sample pipelines, and 106 I/O provide connections to converters and output stages. Because filter performance depends on clock rate, device speed grade, resource sharing, and I/O placement, engineers should prototype the target configuration and use the AMD timing and power tools before production.
Recommandé
Compact Data-Acquisition System
The XC7A12T-1CPG238C can serve as the central digital engine in a compact data-acquisition system, coordinating converters, memory, timing, and host communication. Its 106 I/O allow parallel or multiplexed converter interfaces, while 720 Kbit of block RAM can buffer acquisition bursts and 40 DSP slices can perform real-time preprocessing. The programmable architecture permits product variants to share one board while changing acquisition behavior through a bitstream. Designers should verify converter compatibility, supported I/O standards, acquisition timing, and memory bandwidth in the final system implementation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A12T-1CPG238C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A12T-2CPG238C | XC7A12T-3CPG238C | XC7A12T-2CPG238I | XC7A12T-3CPG238I | XC7A15T-1CPG238C |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 238-CPBGA (CPG238) | 238-CPBGA (CPG238) | 238-CPBGA (CPG238) | 238-CPBGA (CPG238) | 238-CPBGA (CPG238) | 238-CPBGA (CPG238) |
| Performance Grade | -1 | -2 | -3 | -2 | -3 | -1 |
| Temperature Suffix | C | C | C | I | I | C |
| DSP Slices | 40 DSP slices | 40 DSP slices | 40 DSP slices | 40 DSP slices | 40 DSP slices | 40 DSP slices |
| Block RAM | 720 Kbit | 720 Kbit | 720 Kbit | 720 Kbit | 720 Kbit | 720 Kbit |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
Principaux différenciateurs
- Lower-capacity 12T option in the same Artix-7 family (vs XC7A15T-1CPG238C)
- Baseline -1 performance grade with 40 DSP slices (vs XC7A12T-2CPG238C)
- Commercial suffix preserves the intended ordering basis (vs XC7A12T-2CPG238I)
- Integrated 12,800 logic cells, 40 DSP slices, and 720 Kbit block RAM (vs XC7A12T-3CPG238C)
Notes de conception
Use the official AMD Artix-7 CPG238 package file before assigning signals. Verify all 238 ball locations, configuration pins, supply balls, and exposed-pad requirements against the package drawing. The supplied search results establish a 238-CPBGA package but do not provide the complete ball table, so the pinout field remains null rather than presenting an incomplete or fabricated list. Also validate the PCB via pattern and escape-routing rules against the selected package construction.
Partition the design into the correct supply domains and apply the manufacturer-recommended decoupling and power-distribution layout. The provided data verifies a 28 nm Artix-7 process and a 12,800-logic-cell device, but it does not provide the target’s supply-voltage limits or quiescent current. Do not infer power requirements from process technology alone. Use the official power estimator with the final bitstream, then check static and dynamic consumption at the intended clock, I/O activity, voltage, and temperature.
Do not approve an alternative solely because its suffix contains CPG238. The speed grade, temperature suffix, logic resources, configuration compatibility, timing margin, and qualification requirements can all affect approval. For example, XC7A12T-2CPG238C changes from the target’s -1 grade to -2, while XC7A15T-1CPG238C retains the -1 grade but changes logic capacity. Compare official package files and regenerate timing and power reports before substitution.
Reserve layout flexibility for clock, configuration, and high-speed interface resources even when the initial design uses only a subset of the 106 I/O. Place clocking and configuration paths away from noisy switching nodes, maintain continuous return paths, and observe device-specific I/O and bank constraints. The supplied evidence does not enumerate supported I/O standards, so each external interface must be mapped against the official device documentation and pinout file before schematic capture is frozen.
Informations de conformité
The supplied search results do not explicitly state RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals status for the exact MPN. Compliance must be confirmed from AMD product documentation or the authorized distributor record.
