XC7A12T-2CPG238C - 12.8K Artix-7 FPGA | AMD
Référence : XC7A12T-2CPG238C ✓ ActifXC7A12T-2CPG238C Présentation
An FPGA is a programmable semiconductor in the broader semiconductor and digital-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, block RAM, digital signal processing resources, and general-purpose I/O in one device. Artix-7 belongs to the FPGA family within programmable-logic devices and combines moderate logic capacity with low power consumption for cost-sensitive embedded designs.
The XC7A12T provides 12,800 logic cells and 106 user I/Os, making it suitable for parallel data acquisition, control logic, communications bridges, industrial interfaces, and embedded signal-processing systems. The 238-pin CSPBGA package offers substantially more external connections than a leaded FPGA package, supporting high-pin-count interfaces while keeping the device physically compact. The 1.0 V core supply is an important integration constraint for systems using modern low-voltage FPGA logic.
The device is fabricated on 28 nm HKMG technology. This process places the XC7A12T between higher-capacity programmable devices and simpler fixed-function controllers in cost and integration terms. Its 106 I/Os allow designers to connect external memory, converters, transceivers, clocks, and parallel data sources directly to configurable logic. The supplied distributor data identifies the Artix-7 architecture but does not expose detailed block RAM, DSP slice, maximum clock, or I/O performance figures.
Typical applications include industrial control and automation, communications and networking interfaces, instrumentation, embedded vision, sensor aggregation, and low-power portable equipment. In these systems, the FPGA can consolidate parallel interfaces, protocol conversion, timing, data acquisition, and control functions while shortening development time compared with multiple fixed-function devices. The 10 mm × 10 mm CSPBGA also supports space-constrained board layouts when careful escape routing and multilayer PCB construction are used.
The principal design consideration is BGA implementation. A 238-ball package requires a multilayer PCB, controlled via geometry, adequate solder-mask and paste design, X-ray inspection, and a temperature-controlled assembly profile. Designers must also verify the complete power tree for the 1.0 V core and associated I/O supply requirements rather than assuming that one rail satisfies the device.
This page combines verified distributor specifications with practical selection guidance, package considerations, and engineering-focused comparisons. It separates known values from unavailable details so procurement teams can identify supply, fit, and lifecycle risks before committing the XC7A12T-2CPG238C to an FPGA-based design.
Alternatives de remplacement direct pour XC7A12T-2CPG238C — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A12T-2CPG238C (même facteur de forme et même empreinte) — différant par Device Type, Logic Cells, Process Technology.
XC7A12T-2CPG238I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-1CPG238C
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7A12T-3CPG238C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-1CPG238I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-3CPG238I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A12T-2CPG238C Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 12,800 cells |
| User I/O Count | 106 I/Os |
| Process Technology | 28 nm HKMG |
| Core Supply Voltage | 1.0 V |
| Package Type | 238-pin CSPBGA |
| Package Dimensions | 10 mm × 10 mm |
| Speed Grade | -2 |
| Temperature Grade | Commercial |
| Programmable Logic | 12,800 logic cells |
| I/O Architecture | SelectIO |
Guide de configuration des broches du XC7A12T-2CPG238C 10 mm × 10 mm
Configuration des broches du XC7A12T-2CPG238C (boîtier 10 mm × 10 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A12T-2CPG238C.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A12T-2CPG238C convient pour 6 applications: Industrial Control and Automation, Data Acquisition and Instrumentation, Communications Interface Bridge, Embedded Vision and Sensor Fusion, Low-Power Portable Equipment, Programmable Timing and Control.
Industrial Control and Automation
The XC7A12T-2CPG238C fits compact industrial controllers that combine sequencing, machine-state monitoring, and parallel sensor interfaces. Its 12,800 logic cells provide a stated resource level for moderate control logic, while 106 user I/Os support encoders, discrete inputs, actuators, and digital communications without requiring a separate large microcontroller. The 1.0 V core integrates efficiently with modern low-voltage digital rails. Because the C suffix denotes commercial temperature, the design must remain within the verified commercial limits; an I-grade CPG238 variant may be required for hotter industrial environments. Final architecture selection should follow AMD synthesis, implementation, and timing reports rather than relying only on raw cell counts.
Recommandé
Data Acquisition and Instrumentation
The XC7A12T-2CPG238C is suitable for parallel data-acquisition front ends that must synchronize multiple channels, perform local filtering, and transfer results over a high-speed digital interface. With 106 user I/Os and 12,800 logic cells, it can implement acquisition timing, channel selection, data packing, and protocol conversion in programmable logic. The 238-pin CSPBGA provides the required connection density while remaining compact at 10 mm × 10 mm. Designers should reserve enough logic for interface timing, acquisition control, and any filtering because the verified material does not specify DSP or block-RAM counts. Vivado utilization and timing analysis are therefore required to prove the 12,800-cell implementation closes at the -2 speed grade.
Recommandé
Communications Interface Bridge
The XC7A12T-2CPG238C can implement a protocol-conversion or interface bridge between parallel FPGA logic and serial communications peripherals. Its 106 user I/Os are valuable for connecting parallel buses, control signals, status indicators, and multiple transceiver channels, while 12,800 logic cells support framing, buffering, and state management. The commercial-grade device is appropriate for indoor communications equipment operating within its rated temperature range. In a complete bridge, the FPGA should handle protocol timing and data movement while a dedicated transceiver handles the physical layer. Place the BGA device on a multilayer PCB with short escape routes, provide clean clocking, and validate eye diagrams and protocol margins across voltage and temperature corners.
Recommandé
Embedded Vision and Sensor Fusion
The XC7A12T-2CPG238C can serve as a sensor-fusion controller when a system must combine parallel image or sensor data with local decision logic. The 12,800 logic cells support control, timing, and interface logic for modest image pipelines, and 106 I/Os permit direct connection to sensors, capture devices, and local storage. The compact 238-pin CSPBGA preserves board area compared with larger leaded packages, although it increases assembly complexity. Engineers must account for configuration storage, clock jitter, input timing, and the distinction between logic-cell count and DSP capacity. Because complete DSP, RAM, and maximum-clock figures were not supplied, the final pipeline must be evaluated in AMD Vivado with realistic constraints before the BOM is approved.
Recommandé
Low-Power Portable Equipment
The XC7A12T-2CPG238C fits portable and edge systems that need programmable control without the resource level of a larger FPGA. Its 28 nm HKMG implementation and 1.0 V core align with modern power-conscious digital architectures, while 12,800 logic cells can consolidate supervisory logic, low-rate data processing, and interface sequencing. The 10 mm × 10 mm CSPBGA helps reduce board footprint, although dense BGA routing and assembly can offset some system-level savings. Designers should compare active power, configuration time, and board-level efficiency using actual utilization because the supplied excerpts do not include a complete power table. A power-oriented implementation should disable unused blocks, control clock distribution, and confirm that the commercial temperature option covers the enclosure environment.
Recommandé
Programmable Timing and Control
The XC7A12T-2CPG238C is appropriate for deterministic timing, pulse generation, and multi-channel control systems where flexible logic is more valuable than a fixed register map. Its 106 user I/Os allow multiple outputs to be coordinated under programmable counters and state machines, while 12,800 logic cells provide room for trigger logic and local decision paths. The -2 grade is the selected performance option, so timing closure must be demonstrated against the actual clock, I/O standards, and board topology. For laboratory or industrial systems, use synchronized clock distribution, controlled impedance routing, and terminated interfaces. The commercial-grade C suffix remains the correct choice only if the complete enclosure stays within its specified ambient and junction-temperature limits.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A12T-2CPG238C — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A12T-2CPG238I | XC7A12T-1CPG238C | XC7A12T-3CPG238C | XC7A12T-1CPG238I | XC7A12T-3CPG238I |
|---|---|---|---|---|---|---|
| Package | 238-pin CSPBGA, 10 mm × 10 mm | 238-pin CSPBGA, 10 mm × 10 mm | 238-pin CSPBGA, 10 mm × 10 mm | 238-pin CSPBGA, 10 mm × 10 mm | 238-pin CSPBGA, 10 mm × 10 mm | 238-pin CSPBGA, 10 mm × 10 mm |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 12,800 cells | 12,800 cells | 12,800 cells | 12,800 cells | 12,800 cells | 12,800 cells |
| User I/O | 106 I/Os | 106 I/Os | 106 I/Os | 106 I/Os | 106 I/Os | 106 I/Os |
| Process Technology | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG |
| Core Supply Voltage | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V | 1.0 V |
| Speed Grade | -2 | -2 | -1 | -3 | -1 | -3 |
| Temperature Grade | Commercial | Industrial | Commercial | Commercial | Industrial | Industrial |
| Special Features | Commercial -2 speed grade | Industrial -2 speed grade | Commercial -1 speed grade | Commercial -3 speed grade | Industrial -1 speed grade | Industrial -3 speed grade |
Principaux différenciateurs
- Exact commercial-temperature -2 configuration (vs XC7A12T-2CPG238I)
- Higher designated speed option in the same footprint (vs XC7A12T-1CPG238C)
- Direct industrial-temperature upgrade path (vs XC7A12T-1CPG238C)
Notes de conception
Treat the 238-pin CSPBGA as a multilayer, fine-pitch BGA design rather than a conventional leaded-package layout. Use the AMD package drawing and recommended PCB land pattern to define the via-in-pad or via-fanout strategy, solder mask, and paste apertures. Route escape paths on multiple signal layers to avoid congestion around the 1.0 V core and configuration balls. Complete stack-up, impedance, and assembly-process reviews before releasing the board for fabrication.
Do not design the supply network from the 1.0 V core value alone. Confirm every power ball, rail sequence, voltage tolerance, and current limit from the manufacturer datasheet. Place local high-frequency bypass capacitors adjacent to the relevant supply and ground balls, with separate return paths for switching supplies and sensitive analog rails. Validate startup, configuration behavior, and rail sequencing because FPGA power-up requirements can differ materially from ordinary digital ICs.
Preserve signal integrity with short clock routes, continuous reference planes, matched-length rules where required, and controlled impedance for high-speed interfaces. Avoid routing sensitive signals through power and ground-ball escape regions where return paths may be disrupted. Separate clocks, configuration signals, and high-speed data as much as the 10 mm × 10 mm footprint permits, and use via stitching and suitable return vias to maintain low-inductance return paths.
A drop-in replacement should not be assumed solely because it uses a 238-ball package. Check exact ball assignments, speed grade, temperature grade, configuration interface, supply rails, and timing constraints before approving XC7A12T-2CPG238I or another CPG238 suffix variant. The commercial C and industrial I options differ in environmental requirements, while changing the -2 speed grade can alter timing margin. Run synthesis, implementation, and timing sign-off against the exact replacement MPN.
Informations de conformité
The supplied distributor excerpts identify the device as a commercial-grade Artix-7 FPGA but do not provide formal RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations.
