XC7A35T-2FT256I - 33,280-LCell Artix-7 FPGA | AMD/Xilinx
Référence : XC7A35T-2FT256I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.7151 | $15,72 |
| 10 | $15.7151 | $157,15 |
| 100 | $15.7151 | $1 571,51 |
| 500 | $15.7151 | $7 857,55 |
| 1 000 | $15.7151 | $15 715,10 |
XC7A35T-2FT256I Présentation
An FPGA is a reconfigurable semiconductor whose interconnect and logic are defined by a bitstream rather than fixed circuitry. Artix-7 devices occupy the low-cost, low-power portion of the AMD/Xilinx 7-series portfolio and target compact systems requiring substantial parallel processing without the cost and power of larger high-end devices. This places the XC7A35T above a basic programmable-logic device and below larger Artix-7 members in resource capacity.
The verified listing identifies 33,280 logic cells, 1,800 Kb of block RAM, 90 DSP slices, 170 I/O, and a 256-LBGA package for the closely identified XC7A35T-2FTG256I listing. Those values position the device for moderate control logic, parallel datapaths, embedded memory, video or image preprocessing, sensor fusion, and communications control. The search data does not explicitly state the target suffix's exact temperature limits, supply rails, maximum clock, or package dimensions, so those values remain marked for verification rather than being inferred.
At the system level, the programmable fabric supports parallel datapaths that would require many discrete logic devices, while 90 DSP slices can accelerate multiply-accumulate operations. The 1,800 Kb block RAM provides on-chip storage for buffering, lookup tables, packet queues, and data acquisition. The 170 I/O allow interfaces to external memory, converters, transceivers, displays, and industrial peripherals, subject to the exact bank voltage, pin multiplexing, and I/O-standard constraints listed in the manufacturer documentation.
The XC7A35T-2FT256I is suitable for industrial automation, test and measurement, communications infrastructure, embedded vision, and compact edge-processing systems. A board-level migration must preserve the 256-ball footprint, pin functions, supported I/O standards, power rails, configuration interface, memory interface requirements, clocking, and bitstream compatibility. Even when a distributor describes two orderable suffixes as similar, engineers should verify the exact package and temperature suffix before purchasing.
A sound design starts with the AMD package pinout files and the Artix-7 documentation, followed by Vivado design constraints and timing analysis. Validate every power rail, decoupling network, configuration scheme, pin placement, and high-speed interface against the exact device suffix. Treat tool-generated timing and utilization results as design-specific measurements rather than guaranteed device specifications.
This page consolidates verified source links, exposed uncertainty, pricing context, and engineering-oriented selection guidance. It adds migration and design-risk context beyond a distributor listing while avoiding unverified claims about electrical limits, lifecycle status, compliance, or package pin names.
Alternatives de remplacement direct pour XC7A35T-2FT256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A35T-2FT256I (même facteur de forme et même empreinte) — différant par Block RAM, Logic Cells, Mounting Type, Package, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A35T-2FTG256I
✅ Remplacement direct✓ En stock
$31.1719 / unité
Voir la fiche technique →XC7A35T-2FTG256C
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A35T-2FT256I Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 field-programmable gate array (FPGA) |
| Logic Cells | 33,280 cells |
| DSP Slices | 90 slices |
| Block RAM | 1,800 Kbit |
| I/O Count | 170 I/O |
| Boîtier | 256-ball FTBGA (256-LBGA) |
| Performance Grade | -2 |
| Temperature Grade | Industrial |
| Process Technology | 28 nm |
| FPGA Family | Artix-7 |
| Programmable Logic | FPGA configurable logic fabric |
| Embedded Memory | Block RAM |
| Digital Signal Processing | 90 DSP slices |
| Type de montage | Surface-mount ball grid array |
| Supplier Inventory Statement | In stock as of 2026-10-21 |
| Listed Unit Price | $15.7151 USD as of 2026-10-21 |
Guide de configuration des broches du XC7A35T-2FT256I 256-ball ftbga (256-lbga)
Configuration des broches du XC7A35T-2FT256I (boîtier 256-ball ftbga (256-lbga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A35T-2FT256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A35T-2FT256I convient pour 6 applications: Industrial Automation Controller, Test and Measurement Instrumentation, Embedded Vision Preprocessor, Communications Preprocessing, Sensor Fusion and Data Acquisition, Educational FPGA Platform.
Industrial Automation Controller
The XC7A35T-2FT256I fits compact automation controllers because it combines 33,280 programmable logic cells, 170 I/O, 90 DSP slices, and 1,800 Kb of block RAM. Parallel logic can coordinate sensors, actuators, timing, communication protocols, and motion-control datapaths without splitting the design among several discrete processors. Industrial programming is handled by the I temperature suffix, although the exact limits must be checked for the selected package. Place external memory, isolated interfaces, and transceivers around the FPGA while using Vivado constraints to verify every bank voltage and timing path. This device is most appropriate when utilization remains comfortably below its totals and deterministic parallel control is more valuable than adding a separate microcontroller.
Recommandé
Test and Measurement Instrumentation
The Artix-7 fabric is well suited to acquisition and timing control in test equipment because 33,280 logic cells can implement parallel state machines while 1,800 Kb of block RAM buffers samples or control sequences. The 170 I/O provide interfaces for converters, trigger logic, front-panel controllers, and communication transceivers. A typical design would capture multiple ADC channels, align timing, perform preliminary filtering, and transfer results to a host interface. Vivado implementation must confirm routing margins at the intended clock rates, and the board must separate sensitive analog and digital return paths. Exact converter interfaces and voltage rails require device-level verification because they are not present in the supplied source data.
Recommandé
Embedded Vision Preprocessor
The XC7A35T-2FT256I can implement the parallel stages between an image sensor and a host or display pipeline. Its 33,280 logic cells support timing generation and pixel-format conversion, 90 DSP slices support filters or fixed-point arithmetic, and 1,800 Kb of block RAM can support line or tile buffering. The 170 I/O give designers access to sensor, display, and communications interfaces, subject to bank-specific VCCO and timing constraints. Engineers should prototype the pixel pipeline in Vivado and verify bandwidth against the camera's resolution and frame rate. For substantially larger images or heavier convolution workloads, migrate to a larger Artix-7 member rather than relying on nominal resource totals.
Recommandé
Communications Preprocessing
The FPGA's programmable fabric and 1,800 Kb of block RAM make XC7A35T-2FT256I useful for packet buffering, framing, CRC generation, filtering, and interface conversion. Its 170 I/O can support parallel buses or serializer links when the selected bank voltage and I/O standards permit them. A practical design would terminate data from a communications transceiver, align it to the internal clock domain, apply protocol-specific checks, and transfer valid frames through a host interface. Implementation must be constrained and timing-analyzed for the actual link rate because the verified data does not specify maximum clocks or transceiver counts. The device is best where low deterministic latency justifies programmable hardware.
Recommandé
Sensor Fusion and Data Acquisition
XC7A35T-2FT256I can combine sensor timing, parallel sampling, filtering, and protocol formatting on one programmable device. The 90 DSP slices provide hardware resources for multiply-accumulate operations, while 1,800 Kb of block RAM can hold sample windows and intermediate results. Its 170 I/O allow connection to ADC outputs, digital sensors, clocks, and communications circuitry, provided the designer selects compatible I/O standards and bank supply rails. For inertial, vibration, or industrial monitoring, designers can use parallel datapaths to reduce processor load and preserve deterministic timing. Power integrity, decoupling, grounding, and exact temperature limits must be validated from the manufacturer documentation before deployment.
Recommandé
Educational FPGA Platform
The XC7A35T-2FT256I offers enough logic, DSP, RAM, and I/O for instruction, robotics, and digital-design projects that exceed small CPLDs. Students can implement processors, finite-state machines, waveform generators, serial links, and small accelerator examples while learning constraint-driven Vivado workflows. Its 256-ball package demands careful PCB layout, but development boards can remove much of the high-density BGA risk. Resource planning should leave headroom for debug logic and project expansion, and timing closure should be checked after every major architecture change. Before purchasing, confirm that the board exposes the exact package pins, configuration interface, power rails, clocking, and I/O standards required by the intended projects.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A35T-2FT256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A35T-2FTG256I | XC7A35T-2FTG256C |
|---|---|---|---|
| Brand | AMD/Xilinx | AMD/Xilinx | AMD/Xilinx |
| Package | 256-ball FTBGA/256-LBGA | 256-ball FTBGA/256-LBGA | 256-ball FTBGA/256-LBGA |
| Performance Grade | -2 | -2 | -2 |
| Temperature Grade | Industrial I grade | Industrial I grade | Commercial C grade |
Principaux différenciateurs
- Verified resource set supports moderate parallel processing (vs XC7A35T-2FTG256C)
- Industrial temperature ordering aligns with automated equipment (vs XC7A35T-2FTG256C)
- The -2 performance grade is consistent across the related order codes (vs XC7A35T-2FTG256C)
Notes de conception
Normalize the complete ordering string before release. Search results prominently list XC7A35T-2FTG256I while the requested part is XC7A35T-2FT256I, and those strings are not interchangeable without an authoritative ordering-code explanation. Compare the manufacturer ordering guide, device name, package code, speed grade, temperature code, lot marking, and footprint before prototype procurement. A distributor similarity result is not proof of pin-to-pin equivalence.
Do not assign supply voltages or decoupling values from memory because the exact rails, tolerances, and current limits were not supplied. Use the exact Artix-7 data sheet and board-design guidance to identify core, auxiliary, I/O, and configuration supplies. Place required bulk and high-frequency decoupling at the associated power balls, provide clean power sequencing, and validate the rails under worst-case logic, RAM, DSP, and I/O activity before release.
A 256-ball BGA requires escape routing, via-in-pad or via-adjacent fanout, layer-transition planning, and careful return-path continuity. AMD's official package-pinout page provides downloadable device files and points users to the package-file format documentation. Match ball assignments to the exact orderable suffix, preserve package outline and land pattern tolerances, and inspect assembly constraints rather than treating all FTG256 variants as automatically identical.
Bank-level I/O standards and timing depend on the exact device documentation. Constrain every external interface in Vivado, include board-level uncertainty, and validate source-synchronous, clocked, and high-speed serial paths with the intended PCB models. Do not infer maximum clocks, differential I/O availability, or drive strength from the 170-I/O count; those properties vary by bank, package pin, voltage, and selected standard.
Informations de conformité
The supplied search results do not explicitly establish compliance for XC7A35T-2FT256I. Related product pages and comparison snippets mention RoHS or REACH, but those claims were not transferred without exact authoritative data.
