XC7A75T-2FT256I - 75K Logic Cell Artix-7 FPGA | AMD
Référence : XC7A75T-2FT256I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $84.0171 | $84,02 |
| 10 | $84.0171 | $840,17 |
| 100 | $84.0171 | $8 401,71 |
| 500 | $84.0171 | $42 008,55 |
| 1 000 | $84.0171 | $84 017,10 |
XC7A75T-2FT256I Présentation
An FPGA is a semiconductor device whose programmable logic, memory, and I/O resources can be configured after manufacture. Artix-7 belongs to the AMD/Xilinx FPGA product hierarchy and uses a 28 nm process platform, as described on the verified AMD Artix-7 product page. Within the broader category of programmable logic devices, the XC7A75T family is positioned between smaller control-oriented devices and larger communications or processing devices. The XC7A75T-2FT256I combines a 3,870,720-bit memory resource with a compact 256-ball package for designs requiring substantial configurable logic in a relatively small board area.
The verified listing supplies the product identity as an Artix-7 FPGA IC with 170, 3,870,720, 75,520, and 256-LBGA attributes, while the detailed product result describes a 256-FTBGA package. These numbers should not be conflated without the manufacturer pinout and device-selection documentation. The -2 suffix denotes the requested speed grade in the ordering nomenclature, but the verified material does not provide operating frequencies or timing margins. The exact performance grade limits, I/O standards, block RAM organization, DSP resources, configuration interface, and power characteristics require manufacturer datasheet verification before schematic capture or timing closure.
This device is suitable for industrial control logic, sensor acquisition, motor-control interfaces, low- and medium-speed communications, test equipment, and embedded instrumentation. A design team can use programmable fabric for parallel interfaces, state machines, protocol handling, and control paths while using block RAM for buffering and DSP slices for selected arithmetic operations. The industrial temperature result covers -40°C to 100°C junction temperature according to the supplied distributor data, but temperature behavior still depends on the final system power dissipation, airflow, board construction, and selected FPGA grade.
For implementation, preserve the exact 256-FTBGA land pattern, ball assignments, power rails, decoupling requirements, configuration pins, and I/O-bank constraints defined by AMD. Do not substitute a visually similar 256-ball package without checking the official package files and UG475 pinout documentation. Configuration storage, startup behavior, clocking, JTAG access, and bitstream generation should be validated in AMD Vivado or another explicitly supported FPGA toolchain. A common engineering pitfall is treating a distributor similarity result as proof of interchangeability; FPGA replacement requires exact package, pin, speed, temperature, resource, and bitstream compatibility.
This page consolidates the verified distributor identity, package information, public AMD family description, package-pinout references, and practical selection considerations. It distinguishes confirmed data from parameters that require confirmation, helping engineers evaluate sourcing, footprint matching, and migration risk before committing to a 256-FTBGA FPGA layout.
Alternatives de remplacement direct pour XC7A75T-2FT256I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A75T-2FTG256I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A75T-2FT256I Valeurs maximales et caractéristiques électriques
| Device Type | Artix-7 Field Programmable Gate Array (FPGA) IC |
| Logic Cell Count | 75,520 |
| RAM Bits | 3,870,720 bits |
| Performance Grade | -2 |
| Temperature Grade | Industrial |
| Température de jonction en fonctionnement | -40°C to 100°C |
| Boîtier | 256-FTBGA (17 x 17 mm) |
| Package Type | 256-LBGA |
| Type de montage | Surface Mount |
| Packaging | Tray |
| Process Technology | 28 nm |
| AEC-Q100 Qualification | not_applicable |
Guide de configuration des broches du XC7A75T-2FT256I 256-lbga
Configuration des broches du XC7A75T-2FT256I (boîtier 256-lbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7A75T-2FT256I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7A75T-2FT256I convient pour 7 applications: Industrial Automation and PLC Control, Sensor Acquisition and Signal Conditioning, Motor Control and Real-Time Sequencing, Communications and Protocol Bridging, Test and Measurement Instrumentation, Embedded Vision and Data Preprocessing, Aerospace-Style High-Reliability Control Prototypes.
Industrial Automation and PLC Control
XC7A75T-2FT256I fits industrial automation when a controller needs programmable parallel logic, buffering, and protocol handling in a compact surface-mount package. The verified 75,520 logic cells and 3,870,720 RAM bits provide room for state machines, sequencing logic, data acquisition paths, and communication interfaces, while the industrial -40°C to 100°C junction-temperature result supports deployment in controlled factory environments. Before schematic capture, confirm the exact I/O count, supported voltage standards, clock limits, and power budget from AMD device data. The 256-FTBGA footprint also requires careful ball assignment, power distribution, decoupling, and thermal design rather than a simple through-hole or two-row replacement.
Recommandé
Sensor Acquisition and Signal Conditioning
The XC7A75T-2FT256I can consolidate sensor acquisition logic, digital filtering, calibration tables, and control sequencing into one programmable device. Its 75,520 logic cells support parallel datapaths and control state machines, while the 3,870,720 RAM bits can support buffers and intermediate data storage where the required architecture fits. Use the verified package and device files to map external sensors, ADC interfaces, and digital sensors to the correct I/O banks. Because the supplied data does not specify I/O standards, input thresholds, or maximum clock rates, engineers must validate signal integrity and timing against the exact device documentation before committing the FPGA configuration.
Recommandé
Motor Control and Real-Time Sequencing
XC7A75T-2FT256I is suitable for deterministic motor-control and sequencing functions where programmable logic must coordinate timing, interlocks, pulse generation, and supervisory control. The Artix-7 fabric allows independent logic blocks and data paths to be organized for parallel control tasks, while the verified RAM resource can hold calibration data or command buffers. The final design must verify PWM-related I/O availability, clocking, timing margins, and electrical drive requirements; those parameters are not present in the supplied snippets. Use the official package pinout and timing data to separate control logic from high-current power stages and validate thermal performance at the system level.
Recommandé
Communications and Protocol Bridging
The XC7A75T-2FT256I can serve as a programmable protocol bridge when a design needs configurable framing, buffering, filtering, and interface conversion. Its 75,520 logic cells and 3,870,720 RAM bits are useful for parallel data movement and control logic, provided the selected I/O resources and clock domains are confirmed. The verified data identifies a 256-FTBGA package, so high-speed signals must be routed with controlled impedance, proper power planes, and manufacturer-recommended decoupling. This device should not be assumed to include high-speed serial transceiver resources; transceiver availability, pin assignments, and supported protocols must be checked in the exact Artix-7 device documentation before selecting it for a communications link.
Recommandé
Test and Measurement Instrumentation
XC7A75T-2FT256I is appropriate for programmable test systems that coordinate trigger sequencing, data capture logic, pattern generation, and communication between instruments. The confirmed 75,520 logic cells can support multiple parallel test channels, while the verified RAM capacity can hold captured samples or control parameters. Use the FPGA's programmable fabric to implement deterministic timing and state management, then verify the available clock, I/O, and power specifications for the selected package. For instrumentation, analog front-end accuracy, grounding, isolation, and calibration remain separate system requirements. The FPGA part should be selected only after confirming that its package, grade, and temperature range match the enclosure and calibration environment.
Recommandé
Embedded Vision and Data Preprocessing
XC7A75T-2FT256I can be evaluated for embedded vision preprocessing when the design requires parallel pixel movement, thresholding, feature extraction, and control of an external image sensor or processor. The Artix-7 fabric's programmable logic and 3,870,720 RAM bits may support line buffers or fixed-size working stores, but the exact architecture depends on image dimensions, frame timing, memory bandwidth, and available I/O. The verified source does not establish dedicated DSP or video capabilities for this exact MPN, so those resources must be confirmed before estimating performance. A practical design should separate high-speed input timing, frame memory, and image-processing logic, then perform timing closure with the official Vivado device support.
Recommandé
Aerospace-Style High-Reliability Control Prototypes
XC7A75T-2FT256I may be useful in non-production control prototypes where deterministic programmable logic, configurable I/O, and substantial RAM are needed. Its verified industrial temperature range of -40°C to 100°C junction temperature is not an aerospace qualification, and the supplied data contains no radiation, screening, or flight-qualification claim. Engineers should therefore treat it as a laboratory or industrial prototype platform unless the exact part receives separate aerospace qualification evidence. The 256-FTBGA package demands careful power integrity, decoupling, thermal analysis, and configuration-storage design. Any use in safety-critical or flight equipment requires system-level review and approved component sourcing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A75T-2FT256I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A75T-2FTG256I |
|---|---|---|
| Brand | AMD | AMD |
| Package | 256-FTBGA (17 x 17 mm) | 256-LBGA |
| FPGA Family | Artix-7 | Artix-7 |
| Performance Grade | -2 | -2 |
| Process Technology | 28 nm Artix-7 family | 28 nm Artix-7 family |
| Special Features | Artix-7 FPGA; programmable logic and memory | Artix-7 FPGA; programmable logic and memory |
Principaux différenciateurs
- Verified Artix-7 resource density (vs XC7A75T-2FTG256I)
- Verified industrial temperature data (vs XC7A75T-2FTG256I)
- Compact 256-FTBGA package (vs XC7A75T-2FTG256I)
- 28 nm Artix-7 platform (vs XC7A75T-2FTG256I)
Notes de conception
Treat the 256-FTBGA footprint as a high-density routed board, not a generic BGA substitution. Follow the exact AMD package drawing for ball locations, power and ground balls, solder-mask and paste design, and assembly requirements. Place required decoupling capacitors according to the manufacturer power-distribution guidance, and route configuration, clock, and high-speed interfaces with controlled return paths. The verified snippets do not provide the complete pinout, so no ball-level routing decision should be made until the exact package files are loaded into the PCB tool.
The verified industrial-temperature statement is -40°C to 100°C junction temperature, but it does not specify FPGA power dissipation or package thermal resistance. Before enclosure release, obtain the exact device power estimates, estimate total board dissipation, and apply the appropriate junction-to-ambient and junction-to-board thermal model. Estimated: junction temperature equals ambient temperature plus the calculated thermal rise, so omitting package thermal data can produce an unsafe design estimate. Validate with board-level thermal analysis and representative hardware when the final clocking and I/O utilization are known.
External interfaces must be assigned only after reviewing the exact XC7A75T package pinout and supported I/O standards. Keep clock, configuration, and high-speed data paths short where possible, provide continuous reference planes, control impedance, and avoid routing through split power or ground planes. If the design uses a high-speed converter or transceiver, validate input bandwidth, output timing, clocking, and board-level channel loss with the companion device documentation. The supplied data does not specify I/O voltage ranges or timing limits, so these checks are mandatory before schematic sign-off.
Informations de conformité
The supplied verified snippets do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status for XC7A75T-2FT256I. Obtain the current manufacturer or supplier declaration for the exact MPN.
