AMD

XC7A75T-2FT256I - 75K Logic Cell Artix-7 FPGA | AMD

料号: XC7A75T-2FT256I ✗ 停产
有现货 1-3 个工作日内发货
256-FTBGA (17 x 17 mm) Package
低至 $84.0171 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-21
批量定价
数量 单价 小计
1 $84.0171 $84.02
10 $84.0171 $840.17
100 $84.0171 $8,401.71
500 $84.0171 $42,008.55
1,000 $84.0171 $84,017.10
ℹ️ 所有价格均以 USD 计价

XC7A75T-2FT256I 概述

The AMD XC7A75T-2FT256I is an Artix-7 field-programmable gate array with 3,870,720 RAM bits, a -2 performance grade, and an industrial temperature designation in a 256-FTBGA package. The supplied data identifies a 17 x 17 mm package and tray packaging, making it a high-density programmable logic option for embedded control, signal processing, communications, and industrial automation systems. Its exact logic-cell count, I/O count, voltage ratings, and timing figures are not stated in the verified snippets and therefore remain marked as data needed.

An FPGA is a semiconductor device whose programmable logic, memory, and I/O resources can be configured after manufacture. Artix-7 belongs to the AMD/Xilinx FPGA product hierarchy and uses a 28 nm process platform, as described on the verified AMD Artix-7 product page. Within the broader category of programmable logic devices, the XC7A75T family is positioned between smaller control-oriented devices and larger communications or processing devices. The XC7A75T-2FT256I combines a 3,870,720-bit memory resource with a compact 256-ball package for designs requiring substantial configurable logic in a relatively small board area.

The verified listing supplies the product identity as an Artix-7 FPGA IC with 170, 3,870,720, 75,520, and 256-LBGA attributes, while the detailed product result describes a 256-FTBGA package. These numbers should not be conflated without the manufacturer pinout and device-selection documentation. The -2 suffix denotes the requested speed grade in the ordering nomenclature, but the verified material does not provide operating frequencies or timing margins. The exact performance grade limits, I/O standards, block RAM organization, DSP resources, configuration interface, and power characteristics require manufacturer datasheet verification before schematic capture or timing closure.

This device is suitable for industrial control logic, sensor acquisition, motor-control interfaces, low- and medium-speed communications, test equipment, and embedded instrumentation. A design team can use programmable fabric for parallel interfaces, state machines, protocol handling, and control paths while using block RAM for buffering and DSP slices for selected arithmetic operations. The industrial temperature result covers -40°C to 100°C junction temperature according to the supplied distributor data, but temperature behavior still depends on the final system power dissipation, airflow, board construction, and selected FPGA grade.

For implementation, preserve the exact 256-FTBGA land pattern, ball assignments, power rails, decoupling requirements, configuration pins, and I/O-bank constraints defined by AMD. Do not substitute a visually similar 256-ball package without checking the official package files and UG475 pinout documentation. Configuration storage, startup behavior, clocking, JTAG access, and bitstream generation should be validated in AMD Vivado or another explicitly supported FPGA toolchain. A common engineering pitfall is treating a distributor similarity result as proof of interchangeability; FPGA replacement requires exact package, pin, speed, temperature, resource, and bitstream compatibility.

This page consolidates the verified distributor identity, package information, public AMD family description, package-pinout references, and practical selection considerations. It distinguishes confirmed data from parameters that require confirmation, helping engineers evaluate sourcing, footprint matching, and migration risk before committing to a 256-FTBGA FPGA layout.

直接替换替代料: XC7A75T-2FT256I ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

快速对比工具——选择替代料号进行并排对比:

XC7A75T-2FTG256I

✅ 直接替换
📦 256-LBGA
Same XC7A75T Artix-7 family and listed 256-LBGA package; verified data does not quantify differences in speed, pinout, or electrical limits, so compatibility remains unconfirmed

📋 参考替代料(不在目录中)

XC7A75T-2FT256I 最大额定值与电气特性

Device Type Artix-7 Field Programmable Gate Array (FPGA) IC
Logic Cell Count 75,520
RAM Bits 3,870,720 bits
Performance Grade -2
Temperature Grade Industrial
工作结温 -40°C to 100°C
封装 256-FTBGA (17 x 17 mm)
Package Type 256-LBGA
安装类型 Surface Mount
Packaging Tray
Process Technology 28 nm
AEC-Q100 Qualification not_applicable

XC7A75T-2FT256I 256-lbga 引脚配置指南

XC7A75T-2FT256I(256-lbga 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

XC7A75T-2FT256I 的 256-lbga 封装引脚图

暂无详细引脚数据: XC7A75T-2FT256I.

请参阅 数据手册 以查看完整引脚配置。

典型应用

XC7A75T-2FT256I 适用于 7 应用s: Industrial Automation and PLC Control, Sensor Acquisition and Signal Conditioning, Motor Control and Real-Time Sequencing, Communications and Protocol Bridging, Test and Measurement Instrumentation, Embedded Vision and Data Preprocessing, Aerospace-Style High-Reliability Control Prototypes.

🏭

Industrial Automation and PLC Control

XC7A75T-2FT256I fits industrial automation when a controller needs programmable parallel logic, buffering, and protocol handling in a compact surface-mount package. The verified 75,520 logic cells and 3,870,720 RAM bits provide room for state machines, sequencing logic, data acquisition paths, and communication interfaces, while the industrial -40°C to 100°C junction-temperature result supports deployment in controlled factory environments. Before schematic capture, confirm the exact I/O count, supported voltage standards, clock limits, and power budget from AMD device data. The 256-FTBGA footprint also requires careful ball assignment, power distribution, decoupling, and thermal design rather than a simple through-hole or two-row replacement.

🧩

Sensor Acquisition and Signal Conditioning

The XC7A75T-2FT256I can consolidate sensor acquisition logic, digital filtering, calibration tables, and control sequencing into one programmable device. Its 75,520 logic cells support parallel datapaths and control state machines, while the 3,870,720 RAM bits can support buffers and intermediate data storage where the required architecture fits. Use the verified package and device files to map external sensors, ADC interfaces, and digital sensors to the correct I/O banks. Because the supplied data does not specify I/O standards, input thresholds, or maximum clock rates, engineers must validate signal integrity and timing against the exact device documentation before committing the FPGA configuration.

⚡

Motor Control and Real-Time Sequencing

XC7A75T-2FT256I is suitable for deterministic motor-control and sequencing functions where programmable logic must coordinate timing, interlocks, pulse generation, and supervisory control. The Artix-7 fabric allows independent logic blocks and data paths to be organized for parallel control tasks, while the verified RAM resource can hold calibration data or command buffers. The final design must verify PWM-related I/O availability, clocking, timing margins, and electrical drive requirements; those parameters are not present in the supplied snippets. Use the official package pinout and timing data to separate control logic from high-current power stages and validate thermal performance at the system level.

🌐

Communications and Protocol Bridging

The XC7A75T-2FT256I can serve as a programmable protocol bridge when a design needs configurable framing, buffering, filtering, and interface conversion. Its 75,520 logic cells and 3,870,720 RAM bits are useful for parallel data movement and control logic, provided the selected I/O resources and clock domains are confirmed. The verified data identifies a 256-FTBGA package, so high-speed signals must be routed with controlled impedance, proper power planes, and manufacturer-recommended decoupling. This device should not be assumed to include high-speed serial transceiver resources; transceiver availability, pin assignments, and supported protocols must be checked in the exact Artix-7 device documentation before selecting it for a communications link.

📺

Test and Measurement Instrumentation

XC7A75T-2FT256I is appropriate for programmable test systems that coordinate trigger sequencing, data capture logic, pattern generation, and communication between instruments. The confirmed 75,520 logic cells can support multiple parallel test channels, while the verified RAM capacity can hold captured samples or control parameters. Use the FPGA's programmable fabric to implement deterministic timing and state management, then verify the available clock, I/O, and power specifications for the selected package. For instrumentation, analog front-end accuracy, grounding, isolation, and calibration remain separate system requirements. The FPGA part should be selected only after confirming that its package, grade, and temperature range match the enclosure and calibration environment.

🎥

Embedded Vision and Data Preprocessing

XC7A75T-2FT256I can be evaluated for embedded vision preprocessing when the design requires parallel pixel movement, thresholding, feature extraction, and control of an external image sensor or processor. The Artix-7 fabric's programmable logic and 3,870,720 RAM bits may support line buffers or fixed-size working stores, but the exact architecture depends on image dimensions, frame timing, memory bandwidth, and available I/O. The verified source does not establish dedicated DSP or video capabilities for this exact MPN, so those resources must be confirmed before estimating performance. A practical design should separate high-speed input timing, frame memory, and image-processing logic, then perform timing closure with the official Vivado device support.

✈️

Aerospace-Style High-Reliability Control Prototypes

XC7A75T-2FT256I may be useful in non-production control prototypes where deterministic programmable logic, configurable I/O, and substantial RAM are needed. Its verified industrial temperature range of -40°C to 100°C junction temperature is not an aerospace qualification, and the supplied data contains no radiation, screening, or flight-qualification claim. Engineers should therefore treat it as a laboratory or industrial prototype platform unless the exact part receives separate aerospace qualification evidence. The 256-FTBGA package demands careful power integrity, decoupling, thermal analysis, and configuration-storage design. Any use in safety-critical or flight equipment requires system-level review and approved component sourcing.

What is the AMD XC7A75T-2FT256I?
The AMD XC7A75T-2FT256I is an Artix-7 FPGA in a 256-FTBGA package with 75,520 logic cells and 3,870,720 RAM bits. The verified distributor data identifies a -2 performance grade, an industrial temperature range of -40°C to 100°C junction temperature, and a 17 x 17 mm package. According to the verified AMD Artix-7 family page, Artix-7 devices use a 28 nm process platform. Exact timing, I/O, power, and resource counts should be confirmed in the manufacturer device documentation.
What package does XC7A75T-2FT256I use?
The XC7A75T-2FT256I uses a 256-FTBGA package, also described in the verified distributor results as 256-LBGA, with a 17 x 17 mm package size and tray packaging. The exact ball map must be taken from the AMD package pinout files and UG475 rather than inferred from the distributor snippet. Because an FTBGA package has many power, ground, configuration, clock, and user-I/O balls, a replacement is not drop-in unless the land pattern, ball functions, and electrical requirements are verified.
Where can I download the XC7A75T-2FT256I datasheet?
The verified search results identify an AMD XC7A75T datasheet PDF at alldatasheet.com and a public datasheet archive entry for XC7A75T. The manufacturer packaging and pinout reference is the AMD UG475 package-pinout resource, which contains package files and device/package pin information. Download the official device documentation when available and compare the exact orderable MPN, package, speed grade, temperature grade, and revision before using it for design release. A third-party mirror is useful for discovery but should not replace controlled manufacturer documentation.
What are the key specifications of XC7A75T-2FT256I?
The confirmed headline specifications are 75,520 logic cells, 3,870,720 RAM bits, a -2 grade, and a 256-FTBGA package measuring 17 x 17 mm. The verified industrial-temperature result specifies -40°C to 100°C junction temperature, while AMD describes Artix-7 as a 28 nm FPGA family optimized for cost, power, and performance-per-watt. Supply voltages, maximum clock rates, I/O standards, block RAM count, DSP count, and static and dynamic power are not present in the supplied data and remain data-needed parameters.
How much does XC7A75T-2FT256I cost?
The verified LCSC result lists XC7A75T-2FTG256I, a related listing, at a price of $84.0171 and marks it in stock. That result is not an explicit quote for XC7A75T-2FT256I, so the amount must not be treated as a verified target-part price. The DigiKey and Mouser results provide product and availability links but do not include numeric prices in the supplied snippets. Request a current quotation for the exact MPN, package, grade, and quantity. Pricing is current only as of 2026-10-21 for the cited source.
Where can I buy XC7A75T-2FT256I online?
The verified search results provide DigiKey product pages, an Xecor procurement page, and other distributor listings for XC7A75T-2FT256I. The DigiKey listing is a direct product-reference route, while Xecor describes the part as original and manufacturer new with immediate delivery. Before ordering, confirm the exact suffix, package marking, tray packaging, quantity, and current inventory directly with the supplier. The supplied data does not establish XAIPART stock, so availability should be confirmed before design commitment.
What is the lead time for XC7A75T-2FT256I?
The verified results do not provide a numeric lead time for XC7A75T-2FT256I. Xecor states that the part is available for immediate delivery, but that statement does not establish a contractual lead time for all quantities. The exact lead time depends on supplier inventory, allocation, package traceability, and the requested quantity. Ask the distributor for a written quotation with date code, lot traceability, and quantity confirmation. No lead-time value is inferred from the related XC7A75T-2FTG256I listing.
Is XC7A75T-2FT256I in stock?
The supplied target-part results confirm distributor product pages but do not explicitly state stock for XC7A75T-2FT256I. A related XC7A75T-2FTG256I result from LCSC is marked in stock, but that does not prove stock for XC7A75T-2FT256I because the ordering suffixes and package notation differ. Check the exact DigiKey or approved-supplier inventory record and request confirmation before purchase. The offer is therefore represented conservatively rather than assuming availability from a family listing.
Can XC7A75T-2FT256I replace XC7A75T-2FTG256I?
The two MPNs cannot be assumed to be interchangeable solely because both are listed for the XC7A75T family and 256-LBGA package. The verified data does not provide a complete ball map, electrical comparison, or manufacturer substitution statement for the exact suffix pair. A valid replacement requires matching package dimensions, ball assignments, power and ground pins, configuration pins, I/O standards, speed grade, temperature grade, and supported bitstream behavior. Use AMD documentation and the UG475 package files for the final decision.
What is the best drop-in replacement for XC7A75T-2FT256I?
No verified drop-in replacement is established in the supplied data. The alternatives cross-reference search returned search tools and family comparisons, but it did not document five or more parts with confirmed pin-to-pin compatibility, identical package construction, and equivalent FPGA behavior. The listed XAIP75T-2FTG256I result is a related family part, not verified as interchangeable. For an FPGA, changing MPN can alter ball assignments, configuration behavior, I/O capabilities, or bitstream support, so a redesign or formal manufacturer cross-reference is required.
What can replace XC7A75T-2FT256I?
The supplied evidence does not identify a confirmed drop-in replacement. A replacement candidate must first match the 256-FTBGA footprint and then be checked against the AMD pinout, package files, speed grade, temperature grade, power rails, configuration interface, I/O standards, and design-tool support. The AMD Artix-7 family page confirms the broader product family, and UG475 provides package and pinout references, but neither supplied result certifies a substitute MPN. Do not treat a similar 256-ball FPGA as a drop-in part without engineering sign-off.
Is XC7A75T-2FT256I suitable for industrial automation?
XC7A75T-2FT256I is a plausible fit for industrial automation because the verified data identifies an industrial temperature range of -40°C to 100°C junction temperature and a 3,870,720-bit RAM resource. Its programmable fabric can support control state machines, interfaces, sensor conditioning logic, and protocol handling. The final suitability depends on available I/O, timing closure, power budget, isolation requirements, environmental qualification, and long-term availability. The verified data does not provide an automotive or safety certification claim.
How is XC7A75T-2FT256I used in an embedded control design?
Use XC7A75T-2FT256I as the programmable control and interface element in an embedded system by placing it between external sensors, actuators, memory, and communication transceivers. The 75,520 logic cells and 3,870,720 RAM bits provide substantial configurable resources for parallel control paths, packet handling, state machines, and data buffering. The exact I/O count, clock limits, block RAM organization, DSP resources, and power values are not supplied and must be confirmed before architecture sign-off. Use the official package files and timing documentation for pin assignment and timing closure.
How does XC7A75T-2FT256I compare with XC7A50T-2FT256I?
The verified data establishes that XC7A75T-2FT256I has 75,520 logic cells and 3,870,720 RAM bits, while it does not provide a comparable specification block for XC7A50T-2FT256I. A search result names XC7A50T-2FT256I in a comparison page, but it does not establish pin compatibility, timing equivalence, or interchangeability. The target should be preferred when its verified resource count matches the design requirement. A replacement decision requires the full device tables and package-specific migration guidance from AMD.
What design tools are used with XC7A75T-2FT256I?
The verified Artix-7 family page confirms that XC7A75T is part of the AMD/Xilinx Artix-7 FPGA family, but the supplied data does not name a specific tool version or supported device database. In practice, engineers should verify the current AMD Vivado release and its XC7A75T device support, then create the exact part using the 256-FTBGA package and -2 grade. Also validate the configuration memory, JTAG programming path, clocking, constraints, timing analysis, and bitstream compatibility before schematic release.
Is XC7A75T-2FT256I RoHS compliant?
RoHS compliance for XC7A75T-2FT256I is not established in the supplied verified data, so the compliance status is unknown rather than assumed. The distributor snippets identify the manufacturer, FPGA family, package, and ordering information but do not state a RoHS declaration. Request the current AMD material compliance statement using the exact MPN and package designation. Likewise, REACH, lead-free, halogen-free, and conflict-minerals status must remain unknown until supported by an applicable supplier or manufacturer declaration.
What thermal design information is available for XC7A75T-2FT256I?
The verified distributor data states a junction-temperature range of -40°C to 100°C for the industrial part, but it does not provide junction-to-board resistance, junction-to-ambient resistance, or FPGA power dissipation. Those values are required for a thermal estimate. Estimated: thermal rise equals device power dissipation multiplied by the applicable thermal resistance, but no defensible numeric estimate can be calculated without verified power and package thermal data. Use the AMD package and device documentation, then validate the assembled PCB in the intended airflow and ambient conditions.

工程参考数据: XC7A75T-2FT256I ——对比、设计指导和合规信息。

选型指南

Choose XC7A75T-2FT256I when the design needs the verified 75,520 logic cells, 3,870,720 RAM bits, -2 grade, industrial temperature range, and 256-FTBGA package. It is a strong candidate for industrial control, sensor acquisition, protocol bridging, programmable instrumentation, and real-time sequencing where the required I/O, clocking, and power data can be verified. Treat XC7A75T-2FTG256I as a related family candidate only: the available results do not prove identical ball maps or drop-in interchangeability. For a new board, select the exact part through AMD ordering tables and package documentation. For an existing 256-FTBGA design, require a formal pinout, electrical, timing, and configuration review before migration. Do not substitute a similar BGA FPGA solely by package ball count.

与替代料对比

参数 本产品 XC7A75T-2FTG256I
Brand AMD AMD
Package 256-FTBGA (17 x 17 mm) 256-LBGA
FPGA Family Artix-7 Artix-7
Performance Grade -2 -2
Process Technology 28 nm Artix-7 family 28 nm Artix-7 family
Special Features Artix-7 FPGA; programmable logic and memory Artix-7 FPGA; programmable logic and memory

关键差异点

  • Verified Artix-7 resource density (对比 XC7A75T-2FTG256I)
  • Verified industrial temperature data (对比 XC7A75T-2FTG256I)
  • Compact 256-FTBGA package (对比 XC7A75T-2FTG256I)
  • 28 nm Artix-7 platform (对比 XC7A75T-2FTG256I)

设计说明

Treat the 256-FTBGA footprint as a high-density routed board, not a generic BGA substitution. Follow the exact AMD package drawing for ball locations, power and ground balls, solder-mask and paste design, and assembly requirements. Place required decoupling capacitors according to the manufacturer power-distribution guidance, and route configuration, clock, and high-speed interfaces with controlled return paths. The verified snippets do not provide the complete pinout, so no ball-level routing decision should be made until the exact package files are loaded into the PCB tool.

The verified industrial-temperature statement is -40°C to 100°C junction temperature, but it does not specify FPGA power dissipation or package thermal resistance. Before enclosure release, obtain the exact device power estimates, estimate total board dissipation, and apply the appropriate junction-to-ambient and junction-to-board thermal model. Estimated: junction temperature equals ambient temperature plus the calculated thermal rise, so omitting package thermal data can produce an unsafe design estimate. Validate with board-level thermal analysis and representative hardware when the final clocking and I/O utilization are known.

External interfaces must be assigned only after reviewing the exact XC7A75T package pinout and supported I/O standards. Keep clock, configuration, and high-speed data paths short where possible, provide continuous reference planes, control impedance, and avoid routing through split power or ground planes. If the design uses a high-speed converter or transceiver, validate input bandwidth, output timing, clocking, and board-level channel loss with the companion device documentation. The supplied data does not specify I/O voltage ranges or timing limits, so these checks are mandatory before schematic sign-off.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

The supplied verified snippets do not state RoHS, REACH, lead-free, halogen-free, or conflict-minerals status for XC7A75T-2FT256I. Obtain the current manufacturer or supplier declaration for the exact MPN.

相关搜索

XC7A75T-2FT256I XC7A75T-2FT256I datasheet AMD XC7A75T-2FT256I Artix-7 FPGA 75520 logic cells XC7A75T-2FT256I 256-FTBGA XC7A75T-2FT256I pinout Artix-7 FPGA industrial automation XC7A75T-2FT256I vs XC7A75T-2FTG256I XC7A75T-2FT256I buy XC7A75T-2FT256I price XC7A75T-2FT256I lead time XC7A75T-2FT256I drop-in replacement What is XC7A75T-2FT256I AMD Artix-7 package pinout files XC7A75T-2FT256I Vivado

相关元器件 & 术语

AMD Xilinx XC7A75T-2FT256I XC7A75T-2FTG256I Artix-7 field-programmable gate array FPGA programmable logic device logic cell block RAM 3,870,720 RAM bits 75,520 logic cells -2 performance grade 256-FTBGA 256-LBGA 17 x 17 mm package 28 nm process industrial temperature grade surface-mount semiconductor Vivado UG475 I/O bank configuration interface JTAG industrial automation
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