XC7Z030-2FB484I - Zynq-7000 SoC 800MHz Kintex-7 FPGA 484-FCBGA | AMD
Référence : XC7Z030-2FB484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $552 | $552,00 |
| 10 | $524.4 | $5 244,00 |
| 100 | $496.8 | $49 680,00 |
| 500 | $441.6 | $220 800,00 |
| 1 000 | $386.4 | $386 400,00 |
XC7Z030-2FB484I Présentation
What is a Zynq SoC? A Zynq-7000 System-on-Chip is a heterogeneous device that pairs ARM Cortex-A9 application processor cores with Xilinx Kintex-7 (or Artix-7) FPGA fabric through high-bandwidth AXI interconnects. Unlike a pure FPGA, the Zynq boots and runs C/C++ code natively while exposing programmable logic for hardware acceleration, custom peripherals, and parallel DSP pipelines. It sits in the hierarchy: Zynq-7000 -> SoC -> embedded processor + FPGA hybrid -> semiconductor device, and is widely used in embedded computing platforms including ZC702 evaluation boards and custom carrier cards.
Key architectural features include dual Cortex-A9 cores with NEON SIMD and single/double precision floating point, ARM CoreSight debug, hardware block RAM (BRAM), DSP48E1 slices, multiplexed I/O (MIO) and extended MIO (EMIO), and integrated memory controllers supporting DDR3/DDR3L/LPDDR2. The Kintex-7 fabric provides 125K logic cells, approximately 9.4 Mb of block RAM, and DSP48E1 slices suitable for FIR filters, FFT engines, and high-throughput signal processing. The part integrates GTX (Gigabit Transceiver) hard IP for multi-gigabit serial links in the higher-density Zynq-7000 family variants.
Typical applications include machine vision and video pipelines, software-defined radio (SDR) baseband, industrial motor control with EtherCAT, ADAS prototyping, medical imaging front-ends, and custom embedded compute platforms where Linux or RTOS runs on the Cortex-A9 while the FPGA fabric accelerates PCIe, custom I/O, or DSP functions. The 800 MHz Cortex-A9 frequency enables real-time control loops and multimedia workloads. Power-supply decoupling follows Xilinx ug583, and PCB signal-integrity routing follows ug583/ug587 guidance for the MIO/EMIO DDR interfaces.
When designing with this part, ensure your Vivado Design Suite and Vitis IDE versions match the silicon revision listed in the device DNA register. Pin-compatible same-package Zynq-7000 variants allow migration up or down the family (Z-7010/Z-7015/Z-7020/Z-7030/Z-7035/Z-7045/Z-7100) on the same 484-ball FCBGA footprint, enabling platform reuse across SKUs.
This page synthesizes drop-in package-compatible alternatives, parametric comparison data, and practical PCB design notes specific to the XC7Z030-2FB484I - context not assembled on any single distributor product page.
Alternatives de remplacement direct pour XC7Z030-2FB484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7Z030-2FB484I (même facteur de forme et même empreinte) — différant par Logic Cells, Package, Mounting Type, Family, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7Z030-2FBG484I
✅ Remplacement direct✓ En stock
$58 / unité
Voir la fiche technique →XC7Z030-1FBG484I
✅ Remplacement direct✓ En stock
$160 / unité
Voir la fiche technique →XC7Z030-L2FBG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XA7Z030-2FB484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XQ7Z030-2FB484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7Z020-2FB484I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7Z030-2FB484I Valeurs maximales et caractéristiques électriques
| Product Type | SoC (FPGA + ARM Cortex-A9) |
| Series | Zynq-7000 |
| Family | Kintex-7 based programmable logic |
| Logic Cells | 125,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Frequency | 800 MHz |
| Speed Grade | -2 (mid-tier) |
| Boîtier | 484-FCBGA (23x23 mm, 1 mm pitch) |
| Plage de température de fonctionnement | -40C to +100C (Industrial) |
| Technology Node | 28 nm CMOS |
| Type de montage | Surface Mount (BGA) |
| Memory Interfaces | DDR3/DDR3L/LPDDR2 via hard memory controller |
| Peripheral I/O | MIO/EMIO (multiplexed and extended) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du XC7Z030-2FB484I 484-fcbga (23x23 mm, 1 mm pitch)
Configuration des broches du XC7Z030-2FB484I (boîtier 484-fcbga (23x23 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7Z030-2FB484I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7Z030-2FB484I convient pour 6 applications: Machine Vision and Industrial Camera Pipelines, Software-Defined Radio (SDR) Baseband, Industrial Motor Control and EtherCAT Slave, Aerospace and Defense Prototyping, Medical Imaging Front-End, Embedded Linux / RTOS Single-Board Computer.
Machine Vision and Industrial Camera Pipelines
The XC7Z030-2FB484I is a strong fit for machine vision because the dual 800 MHz Cortex-A9 cores run Linux + OpenCV while the Kintex-7 fabric delivers parallel pixel processing, MIPI/CSI-2 ingest via EMIO, and hardware-accelerated convolution. The 125K logic cells and ~9.4 Mb block RAM comfortably hold line buffers for 4K image pipelines, and the 484-FCBGA exposes enough MIO pins to drive multiple MIPI lanes and a Gigabit Ethernet pipeline to a host PC. Compared with a discrete SoC + FPGA two-board design the single-package integration cuts BOM cost, PCB area, and signal-integrity risk between PS and PL. Use Vivado IP Integrator to stitch the processor subsystem with custom vision IPs.
Recommandé
Software-Defined Radio (SDR) Baseband
In SDR baseband designs the XC7Z030-2FB484I runs Linux + GNU Radio on the Cortex-A9 while the Kintex-7 fabric implements FFTs, channelizers, and digital up/down converters using DSP48E1 slices. The hard Cortex-A9 host simplifies TCP/IP streaming of IQ samples to a host, while the programmable logic achieves 10-100x speedups over software-only implementations for wideband LTE and 5G NR prototyping. The 484-FCBGA exposes enough GTX-capable MIO pairs for multi-gigabit sample links to RF front-ends, and the industrial temperature rating supports outdoor and vehicular deployment. Designers reference Analog Devices AD-FMCOMMS carrier cards for typical transceiver pairings.
Recommandé
Industrial Motor Control and EtherCAT Slave
The XC7Z030-2FB484I supports industrial motor controllers by combining deterministic ARM Cortex-A9 control loops with FPGA-accelerated encoder interfaces, current-loop PWM generation, and EtherCAT slave IP (e.g. Beckhoff ET1100 firmware instantiated in fabric). The 800 MHz Cortex-A9 host runs a real-time Linux PREEMPT_RT or FreeRTOS scheduler, while the Kintex-7 fabric offloads cycle-critical feedback sampling at >50 kHz without jitter. The -40C to +100C industrial temperature range matches factory-floor cabinet requirements, and the 484-FCBGA exposes the GPIO and high-speed transceiver pins needed for absolute encoders, resolver interfaces, and fieldbus uplinks.
Recommandé
Aerospace and Defense Prototyping
For aerospace and defense prototyping the XC7Z030-2FB484I (industrial grade) and its XQ7Z030 defense-grade counterpart provide Mil-Std-810 / DO-160 prototypable compute density in a single BGA. The hardened Cortex-A9 runs security-critical real-time OS tasks while the Kintex-7 fabric executes signal processing, cryptographic offload, or radar baseband in user-configurable hardware. The 484-FCBGA footprint is shared with higher-density Zynq-7000 members, allowing a single carrier card to host a range of parts from Z-7030 to Z-7045 with stocking flexibility. Designers should still qualify the chosen XA/XQ suffix variant against the end-system environmental requirements.
Recommandé
Medical Imaging Front-End
Medical imaging front-ends such as portable ultrasound and endoscopy processors benefit from the XC7Z030-2FB484I's combination of 800 MHz Cortex-A9 patient-side processing and Kintex-7 acceleration for beamforming, Doppler processing, and image reconstruction. The DSP48E1 slices enable parallel FIR and FFT pipelines critical for real-time ultrasound rendering, while the Cortex-A9 host handles the user-interface stack and DICOM transmission. The 484-FCBGA exposes LVDS pairs for high-speed ADC interface and supports hardware encryption for HIPAA-compliant patient data flows. The industrial 'I' temperature grade and lead-free packaging suit IEC 60601-1 design flows.
Recommandé
Embedded Linux / RTOS Single-Board Computer
Many embedded SBC designs use the XC7Z030-2FB484I as the application processor because the dual 800 MHz Cortex-A9 runs full Linux (PetaLinux or Yocto) or FreeRTOS while exposing programmable logic for custom peripherals, security accelerators, or SD/eMMC interfaces. Designers can use the 484-FCBGA's high pin count to break out multiple Gigabit Ethernet ports, USB 2.0, SATA, and PCIe Gen2 endpoints without external bridge chips. Compared with discrete SoC + FPGA two-chip designs the XC7Z030 reduces PCB layers, simplifies power sequencing, and shortens signal-integrity closure on AXI interconnects between PS and PL.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7Z030-2FB484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7Z030-2FBG484I | XC7Z030-1FBG484I | XC7Z030-L2FBG484I | XA7Z030-2FB484I | XC7Z020-2FB484I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) |
| FPGA Fabric | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells, low power) | Kintex-7 (125K logic cells) | Artix-7 (85K logic cells) |
| CPU Speed Grade | -2 (800 MHz) | -2 (800 MHz) | -1 (667 MHz) | -2 (800 MHz, low power) | -2 (800 MHz) | -2 (800 MHz) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (XA suffix) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | RoHS compliant, lead-free | RoHS 'G' suffix, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free |
| Series Variant | Z-7030 (Kintex-7) | Z-7030 (Kintex-7) | Z-7030 (Kintex-7) | Z-7030 (Kintex-7, low-power) | Z-7030 (XA aerospace prefix) | Z-7020 (Artix-7) |
| Param Match Percent | 100% | 100% | 90% | 95% | 100% | 80% |
Principaux différenciateurs
- Same-footprint low-power variant available for power-constrained designs (vs XC7Z030-L2FBG484I)
- Speed-grade -2 delivers +20% CPU frequency over speed-grade -1 (vs XC7Z030-1FBG484I)
- Pin-compatible down-migration to Artix-7 for cost reduction (vs XC7Z020-2FB484I)
- Available with RoHS/G suffix for compliant markets (vs XC7Z030-2FBG484I)
Notes de conception
Follow AMD's UG583 PCB Design Guide and UG587 Zynq-7000 SoC Board Design Guide when laying out the 484-FCBGA. Use at least an 8-layer controlled-impedance stackup with 50-ohm single-ended and 90-ohm differential routes for GTX transceivers. BGA escape must use microvia-in-pad technology to fan out 1 mm pitch signals within standard design rules. Place decouple capacitors adjacent to each PS and PL power-supply pin (1uF + 100 nF + bulk) and isolate analog supply (Vccadc) with a ferrite bead.
Estimated: at typical Kintex-7 + dual Cortex-A9 workloads at 800 MHz, total device power can reach 3-5W. With a 484-FCBGA and adequate top copper pour, theta-JA is approximately 8-12 C/W, yielding a junction temperature rise of ~40-60C above ambient. Use thermal vias in the BGA land pattern and a heatsink or forced-air cooling when sustained power exceeds 3W in enclosed enclosures. Thermal characterization is recommended using Xilinx XPE tools before fixing the mechanical design.
Three common pitfalls: (1) boot-mode pins (BOOT_MODE, POR_EN) must be strapped correctly to select Quad-SPI NAND/NOR/SD boot - forgetting this results in 'no boot' on first power-up; (2) on the XC7Z030-2FB484I, MIO bank 501 voltages must match the connected peripherals (1.8V/2.5V/3.3V) - mixed voltage will not damage the part but pins will not toggle; (3) bypass capacitors near PS GTPs and PL GTX transceivers must be very low-ESR ceramic types as specified in UG587, otherwise deterministic jitter margins will fail margin tests.
DDR3/3L routing: match all data byte lanes within 25 mil (0.635 mm), Vref routed with each DQS group, and keep differential DQS pairs within 5 mil length matching across the entire 484-FCBGA escape. Use Fly-by topology for DDR3 address/command signals with termination at the farthest DRAM. Reference AMD ug583 chapter on DDR termination to avoid write-leveling failures in production.
The XC7Z030-2FB484I requires multiple supply rails: 1.0V Vccint for PL + PS cores, 1.8V/2.5V/3.3V MIO bank supplies, 1.5V DDR_aux, GTX analog supplies, and Vccadc. Power sequencing must follow AMD's UG585-defined order, or the PS may latch into an unrecoverable state. Use a dedicated PMIC or a bench supply sequencing circuit rather than discrete linear regulators when running production volumes.
Informations de conformité
RoHS and lead-free compliance per AMD (Xilinx) product page and DS191 Zynq-7000 datasheet. AEC-Q100 is not applicable (industrial-grade SoC). Designers should consult AMD environmental compliance documentation for halogen-free status of the exact package variant.
