XC7Z030-2FB484I - Zynq-7000 SoC 800MHz Kintex-7 FPGA 484-FCBGA | AMD
部品番号: XC7Z030-2FB484I ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $552 | $552.00 |
| 10 | $524.4 | $5,244.00 |
| 100 | $496.8 | $49,680.00 |
| 500 | $441.6 | $220,800.00 |
| 1,000 | $386.4 | $386,400.00 |
XC7Z030-2FB484I 概要
What is a Zynq SoC? A Zynq-7000 System-on-Chip is a heterogeneous device that pairs ARM Cortex-A9 application processor cores with Xilinx Kintex-7 (or Artix-7) FPGA fabric through high-bandwidth AXI interconnects. Unlike a pure FPGA, the Zynq boots and runs C/C++ code natively while exposing programmable logic for hardware acceleration, custom peripherals, and parallel DSP pipelines. It sits in the hierarchy: Zynq-7000 -> SoC -> embedded processor + FPGA hybrid -> semiconductor device, and is widely used in embedded computing platforms including ZC702 evaluation boards and custom carrier cards.
Key architectural features include dual Cortex-A9 cores with NEON SIMD and single/double precision floating point, ARM CoreSight debug, hardware block RAM (BRAM), DSP48E1 slices, multiplexed I/O (MIO) and extended MIO (EMIO), and integrated memory controllers supporting DDR3/DDR3L/LPDDR2. The Kintex-7 fabric provides 125K logic cells, approximately 9.4 Mb of block RAM, and DSP48E1 slices suitable for FIR filters, FFT engines, and high-throughput signal processing. The part integrates GTX (Gigabit Transceiver) hard IP for multi-gigabit serial links in the higher-density Zynq-7000 family variants.
Typical applications include machine vision and video pipelines, software-defined radio (SDR) baseband, industrial motor control with EtherCAT, ADAS prototyping, medical imaging front-ends, and custom embedded compute platforms where Linux or RTOS runs on the Cortex-A9 while the FPGA fabric accelerates PCIe, custom I/O, or DSP functions. The 800 MHz Cortex-A9 frequency enables real-time control loops and multimedia workloads. Power-supply decoupling follows Xilinx ug583, and PCB signal-integrity routing follows ug583/ug587 guidance for the MIO/EMIO DDR interfaces.
When designing with this part, ensure your Vivado Design Suite and Vitis IDE versions match the silicon revision listed in the device DNA register. Pin-compatible same-package Zynq-7000 variants allow migration up or down the family (Z-7010/Z-7015/Z-7020/Z-7030/Z-7035/Z-7045/Z-7100) on the same 484-ball FCBGA footprint, enabling platform reuse across SKUs.
This page synthesizes drop-in package-compatible alternatives, parametric comparison data, and practical PCB design notes specific to the XC7Z030-2FB484I - context not assembled on any single distributor product page.
ドロップイン代替品: XC7Z030-2FB484I — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: XC7Z030-2FB484I （同一形状・フットプリント） — 相違点: Logic Cells, Package, Mounting Type, Family, Speed Grade.
クイック比較ツール — 並列比較する代替部品を選択:
XC7Z030-2FBG484I
✅ ドロップイン✓ 在庫あり
$58 / 個
データシートを見る →XC7Z030-1FBG484I
✅ ドロップイン✓ 在庫あり
$160 / 個
データシートを見る →XC7Z030-L2FBG484I
✅ ドロップイン📋 参考代替品（カタログ未掲載）
XA7Z030-2FB484I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XQ7Z030-2FB484I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7Z020-2FB484I
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
XC7Z030-2FB484I 最大定格＆電気的特性
| Product Type | SoC (FPGA + ARM Cortex-A9) |
| Series | Zynq-7000 |
| Family | Kintex-7 based programmable logic |
| Logic Cells | 125,000 |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum CPU Frequency | 800 MHz |
| Speed Grade | -2 (mid-tier) |
| パッケージ | 484-FCBGA (23x23 mm, 1 mm pitch) |
| 動作温度範囲 | -40C to +100C (Industrial) |
| Technology Node | 28 nm CMOS |
| 実装タイプ | Surface Mount (BGA) |
| Memory Interfaces | DDR3/DDR3L/LPDDR2 via hard memory controller |
| Peripheral I/O | MIO/EMIO (multiplexed and extended) |
| RoHS ステータス | Compliant |
| Lead-Free | Yes |
XC7Z030-2FB484I 484-fcbga (23x23 mm, 1 mm pitch) ピン配置ガイド
XC7Z030-2FB484I (484-fcbga (23x23 mm, 1 mm pitch) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: XC7Z030-2FB484I.
詳細は データシート をご参照ください。
主な用途
XC7Z030-2FB484I の用途: 6 件s: Machine Vision and Industrial Camera Pipelines, Software-Defined Radio (SDR) Baseband, Industrial Motor Control and EtherCAT Slave, Aerospace and Defense Prototyping, Medical Imaging Front-End, Embedded Linux / RTOS Single-Board Computer.
Machine Vision and Industrial Camera Pipelines
The XC7Z030-2FB484I is a strong fit for machine vision because the dual 800 MHz Cortex-A9 cores run Linux + OpenCV while the Kintex-7 fabric delivers parallel pixel processing, MIPI/CSI-2 ingest via EMIO, and hardware-accelerated convolution. The 125K logic cells and ~9.4 Mb block RAM comfortably hold line buffers for 4K image pipelines, and the 484-FCBGA exposes enough MIO pins to drive multiple MIPI lanes and a Gigabit Ethernet pipeline to a host PC. Compared with a discrete SoC + FPGA two-board design the single-package integration cuts BOM cost, PCB area, and signal-integrity risk between PS and PL. Use Vivado IP Integrator to stitch the processor subsystem with custom vision IPs.
おすすめ
Software-Defined Radio (SDR) Baseband
In SDR baseband designs the XC7Z030-2FB484I runs Linux + GNU Radio on the Cortex-A9 while the Kintex-7 fabric implements FFTs, channelizers, and digital up/down converters using DSP48E1 slices. The hard Cortex-A9 host simplifies TCP/IP streaming of IQ samples to a host, while the programmable logic achieves 10-100x speedups over software-only implementations for wideband LTE and 5G NR prototyping. The 484-FCBGA exposes enough GTX-capable MIO pairs for multi-gigabit sample links to RF front-ends, and the industrial temperature rating supports outdoor and vehicular deployment. Designers reference Analog Devices AD-FMCOMMS carrier cards for typical transceiver pairings.
おすすめ
Industrial Motor Control and EtherCAT Slave
The XC7Z030-2FB484I supports industrial motor controllers by combining deterministic ARM Cortex-A9 control loops with FPGA-accelerated encoder interfaces, current-loop PWM generation, and EtherCAT slave IP (e.g. Beckhoff ET1100 firmware instantiated in fabric). The 800 MHz Cortex-A9 host runs a real-time Linux PREEMPT_RT or FreeRTOS scheduler, while the Kintex-7 fabric offloads cycle-critical feedback sampling at >50 kHz without jitter. The -40C to +100C industrial temperature range matches factory-floor cabinet requirements, and the 484-FCBGA exposes the GPIO and high-speed transceiver pins needed for absolute encoders, resolver interfaces, and fieldbus uplinks.
おすすめ
Aerospace and Defense Prototyping
For aerospace and defense prototyping the XC7Z030-2FB484I (industrial grade) and its XQ7Z030 defense-grade counterpart provide Mil-Std-810 / DO-160 prototypable compute density in a single BGA. The hardened Cortex-A9 runs security-critical real-time OS tasks while the Kintex-7 fabric executes signal processing, cryptographic offload, or radar baseband in user-configurable hardware. The 484-FCBGA footprint is shared with higher-density Zynq-7000 members, allowing a single carrier card to host a range of parts from Z-7030 to Z-7045 with stocking flexibility. Designers should still qualify the chosen XA/XQ suffix variant against the end-system environmental requirements.
おすすめ
Medical Imaging Front-End
Medical imaging front-ends such as portable ultrasound and endoscopy processors benefit from the XC7Z030-2FB484I's combination of 800 MHz Cortex-A9 patient-side processing and Kintex-7 acceleration for beamforming, Doppler processing, and image reconstruction. The DSP48E1 slices enable parallel FIR and FFT pipelines critical for real-time ultrasound rendering, while the Cortex-A9 host handles the user-interface stack and DICOM transmission. The 484-FCBGA exposes LVDS pairs for high-speed ADC interface and supports hardware encryption for HIPAA-compliant patient data flows. The industrial 'I' temperature grade and lead-free packaging suit IEC 60601-1 design flows.
おすすめ
Embedded Linux / RTOS Single-Board Computer
Many embedded SBC designs use the XC7Z030-2FB484I as the application processor because the dual 800 MHz Cortex-A9 runs full Linux (PetaLinux or Yocto) or FreeRTOS while exposing programmable logic for custom peripherals, security accelerators, or SD/eMMC interfaces. Designers can use the 484-FCBGA's high pin count to break out multiple Gigabit Ethernet ports, USB 2.0, SATA, and PCIe Gen2 endpoints without external bridge chips. Compared with discrete SoC + FPGA two-chip designs the XC7Z030 reduces PCB layers, simplifies power sequencing, and shortens signal-integrity closure on AXI interconnects between PS and PL.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: XC7Z030-2FB484I — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | XC7Z030-2FBG484I | XC7Z030-1FBG484I | XC7Z030-L2FBG484I | XA7Z030-2FB484I | XC7Z020-2FB484I |
|---|---|---|---|---|---|---|
| Brand | AMD (Xilinx) | AMD | AMD | AMD | AMD | AMD |
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) |
| FPGA Fabric | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells) | Kintex-7 (125K logic cells, low power) | Kintex-7 (125K logic cells) | Artix-7 (85K logic cells) |
| CPU Speed Grade | -2 (800 MHz) | -2 (800 MHz) | -1 (667 MHz) | -2 (800 MHz, low power) | -2 (800 MHz) | -2 (800 MHz) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (XA suffix) | Industrial (-40C to +100C) |
| RoHS / Lead-Free | RoHS compliant, lead-free | RoHS 'G' suffix, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free | RoHS compliant, lead-free |
| Series Variant | Z-7030 (Kintex-7) | Z-7030 (Kintex-7) | Z-7030 (Kintex-7) | Z-7030 (Kintex-7, low-power) | Z-7030 (XA aerospace prefix) | Z-7020 (Artix-7) |
| Param Match Percent | 100% | 100% | 90% | 95% | 100% | 80% |
主な差別化要因
- Same-footprint low-power variant available for power-constrained designs （vs XC7Z030-L2FBG484I)
- Speed-grade -2 delivers +20% CPU frequency over speed-grade -1 （vs XC7Z030-1FBG484I)
- Pin-compatible down-migration to Artix-7 for cost reduction （vs XC7Z020-2FB484I)
- Available with RoHS/G suffix for compliant markets （vs XC7Z030-2FBG484I)
設計ノート
Follow AMD's UG583 PCB Design Guide and UG587 Zynq-7000 SoC Board Design Guide when laying out the 484-FCBGA. Use at least an 8-layer controlled-impedance stackup with 50-ohm single-ended and 90-ohm differential routes for GTX transceivers. BGA escape must use microvia-in-pad technology to fan out 1 mm pitch signals within standard design rules. Place decouple capacitors adjacent to each PS and PL power-supply pin (1uF + 100 nF + bulk) and isolate analog supply (Vccadc) with a ferrite bead.
Estimated: at typical Kintex-7 + dual Cortex-A9 workloads at 800 MHz, total device power can reach 3-5W. With a 484-FCBGA and adequate top copper pour, theta-JA is approximately 8-12 C/W, yielding a junction temperature rise of ~40-60C above ambient. Use thermal vias in the BGA land pattern and a heatsink or forced-air cooling when sustained power exceeds 3W in enclosed enclosures. Thermal characterization is recommended using Xilinx XPE tools before fixing the mechanical design.
Three common pitfalls: (1) boot-mode pins (BOOT_MODE, POR_EN) must be strapped correctly to select Quad-SPI NAND/NOR/SD boot - forgetting this results in 'no boot' on first power-up; (2) on the XC7Z030-2FB484I, MIO bank 501 voltages must match the connected peripherals (1.8V/2.5V/3.3V) - mixed voltage will not damage the part but pins will not toggle; (3) bypass capacitors near PS GTPs and PL GTX transceivers must be very low-ESR ceramic types as specified in UG587, otherwise deterministic jitter margins will fail margin tests.
DDR3/3L routing: match all data byte lanes within 25 mil (0.635 mm), Vref routed with each DQS group, and keep differential DQS pairs within 5 mil length matching across the entire 484-FCBGA escape. Use Fly-by topology for DDR3 address/command signals with termination at the farthest DRAM. Reference AMD ug583 chapter on DDR termination to avoid write-leveling failures in production.
The XC7Z030-2FB484I requires multiple supply rails: 1.0V Vccint for PL + PS cores, 1.8V/2.5V/3.3V MIO bank supplies, 1.5V DDR_aux, GTX analog supplies, and Vccadc. Power sequencing must follow AMD's UG585-defined order, or the PS may latch into an unrecoverable state. Use a dedicated PMIC or a bench supply sequencing circuit rather than discrete linear regulators when running production volumes.
コンプライアンス情報
RoHS and lead-free compliance per AMD (Xilinx) product page and DS191 Zynq-7000 datasheet. AEC-Q100 is not applicable (industrial-grade SoC). Designers should consult AMD environmental compliance documentation for halogen-free status of the exact package variant.
