XC7Z100-2FF900I - Zynq-7000 444K SoC | AMD Xilinx
Référence : XC7Z100-2FF900I ✓ ActifXC7Z100-2FF900I Présentation
A Zynq-7000 SoC is a heterogeneous programmable system-on-chip that combines an ARM processing system, programmable logic, programmable I/O, memory controllers, and high-speed serial transceivers in one device. In the broader semiconductor hierarchy, it belongs to the field-programmable gate array family while adding a hard processor subsystem. This integration allows software-controlled systems to implement parallel hardware logic alongside a conventional Linux or bare-metal application processor.
The XC7Z100-2FF900I headline resources are 444K Kintex-7 logic cells, an 800 MHz dual-core ARM Cortex-A9 configuration, and a 900-FCBGA package measuring 31 mm by 31 mm. It is positioned for designs requiring substantial parallel processing, high-speed connectivity, and an integrated real-time control architecture. The -2 device grade targets performance-oriented systems, while the I designation identifies the industrial temperature option.
The integrated ARM Cortex-A9 MPCore subsystem supports a coherent dual-core application-processing environment, while the Kintex-7 fabric provides hardware acceleration for image processing, protocol handling, control loops, data acquisition, and custom peripheral logic. CoreSight debug resources accompany the processor and programmable logic, supporting design validation and post-silicon debugging. Exact fabric interface speeds, memory interface ratings, transceiver counts, and power envelopes were not included in the supplied source data and should be confirmed in the manufacturer data sheet.
Typical deployments include industrial machine vision, high-speed inspection, laboratory instrumentation, industrial networking, embedded signal processing, and communications infrastructure. A video-processing design can assign pixel pipelines to programmable logic while the ARM subsystem runs control software and networking tasks. A deterministic acquisition system can use dedicated FPGA logic for sampling and buffering while the processor performs analysis, configuration, and external communications.
Design planning must account for the package's 900 solder balls, multiple power rails, high-speed differential interfaces, and substantial thermal requirements. Follow the Zynq-7000 power-sequencing requirements, decouple each supply rail at the package pins, route high-speed pairs with controlled impedance, and provide a board-level thermal design appropriate for the selected performance class.
This page consolidates distributor pricing, verified product descriptions, family-level alternatives, package information, and practical design guidance. It also identifies specifications that were not present in the supplied verification data so that engineers can distinguish confirmed values from items requiring confirmation against the AMD data sheet before layout or sourcing decisions.
Alternatives de remplacement direct pour XC7Z100-2FF900I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7Z100-2FF900I (même facteur de forme et même empreinte) — différant par Architecture, Device Family, Package, Temperature Grade.
XC7Z100-2FFG900I
✅ Remplacement directContactez-nous pour le prix
Voir la fiche technique →XC7Z045-2FFG900I
✅ Remplacement directContactez-nous pour le prix
XC7Z100-2FF900E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7Z100-2FF900C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7Z100-1FF900I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XC7Z100-2FF900I Valeurs maximales et caractéristiques électriques
| Device Type | Zynq-7000 Kintex-7 programmable system-on-chip |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | 800 MHz |
| FPGA Logic Cells | 444K logic cells |
| FPGA Family | Kintex-7 |
| Boîtier | 900-FCBGA, 31 mm x 31 mm |
| Package Pin Count | 900 pins |
| Device Speed Grade | -2 |
| Temperature Grade | Industrial |
| Type de montage | Surface mount |
| Integrated Programmable Logic | 444K Kintex-7 logic cells |
| Debug Support | ARM CoreSight debug resources |
| AEC-Q100 Qualification | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component |
Guide de configuration des broches du XC7Z100-2FF900I 900 pins
Configuration des broches du XC7Z100-2FF900I (boîtier 900 pins). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XC7Z100-2FF900I.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XC7Z100-2FF900I convient pour 6 applications: Industrial Machine Vision, High-Speed Data Acquisition, Embedded Communications Gateway, Real-Time Motion Control, Laboratory Test and Measurement, Aerospace and Defense Test Equipment.
Industrial Machine Vision
The XC7Z100-2FF900I fits industrial machine-vision controllers because its 444K Kintex-7 logic cells can implement parallel image pipelines while the dual 800 MHz ARM Cortex-A9 subsystem handles camera control, classification, and communications. Hardware logic can perform pixel correction, thresholding, and buffering without transferring every frame to external memory. The integrated architecture reduces board-level component count compared with a separate ARM processor and FPGA. Validate the selected camera interface, memory bandwidth, and industrial temperature limits against the AMD data sheet before a production release.
Recommandé
High-Speed Data Acquisition
The XC7Z100-2FF900I is appropriate for multichannel acquisition systems that must collect and transform data at rates better handled by programmable logic than by sequential processor instructions. The 444K Kintex-7 fabric can implement counters, filters, trigger logic, and parallel data paths, while the 800 MHz ARM Cortex-A9 cores perform analysis and buffering. This division of labor is useful in oscilloscope-like, vibration, and industrial test platforms. Confirm supported memory interfaces, transceiver counts, and acquisition-clock specifications in the AMD documentation for the exact device grade.
Recommandé
Embedded Communications Gateway
The XC7Z100-2FF900I can serve as the control and acceleration platform in an embedded communications gateway. The ARM Cortex-A9 subsystem runs networking, management, and protocol software, while the 444K Kintex-7 logic fabric accelerates packet processing, framing, encryption-related data movement, or custom interfaces. Consolidating these functions in one SoC can reduce board area and inter-processor communication. Exact transceiver and I/O performance must be checked against the device data sheet rather than inferred from the general Zynq-7000 product family.
Recommandé
Real-Time Motion Control
The XC7Z100-2FF900I suits real-time motion-control systems that require deterministic hardware pipelines alongside a programmable operating-system environment. Its 444K Kintex-7 logic can host encoder interfaces, interpolation, interpolation-free position loops, and safety-adjacent control logic, while the 800 MHz dual ARM Cortex-A9 subsystem executes motion planning and supervisory control. The 900-FCBGA footprint demands a multi-rail power design and careful layout. Confirm speed grade, operating-temperature range, and interface timing before using the part for production machinery.
Recommandé
Laboratory Test and Measurement
The XC7Z100-2FF900I is well matched to laboratory instruments that combine deterministic signal processing with a graphical or networked user interface. Programmable logic can implement filters, waveform analysis, triggers, and digital signal processing, while the ARM Cortex-A9 subsystem manages the application, instrument control, and remote access. The large 444K fabric allows consolidation of several instrument functions without relying on discrete FPGA devices. Verify supported high-speed interfaces and memory resources for the target instrument architecture in the official AMD documentation.
Recommandé
Aerospace and Defense Test Equipment
The XC7Z100-2FF900I can be evaluated for ruggedized ground-support and test equipment where programmable logic and an ARM processor must coexist in a compact module. The 444K Kintex-7 fabric supports high-throughput acquisition, protocol conversion, and fault-injection logic, while the dual 800 MHz ARM Cortex-A9 subsystem runs supervisory software. The industrial I ordering suffix should not be treated as aerospace qualification; environmental, radiation, and procurement requirements require separate verification. Use the package pinout and power-sequencing documentation from AMD for implementation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7Z100-2FF900I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7Z100-2FFG900I | XC7Z045-2FFG900I | XC7Z100-2FF900E | XC7Z100-2FF900C | XC7Z100-1FF900I |
|---|---|---|---|---|---|---|
| Package | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm | 900-FCBGA, 31 mm x 31 mm |
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore | Dual ARM Cortex-A9 MPCore |
| Processor Clock Rating | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz listed processor rating; device performance grade is -1 |
| FPGA Logic Cells | 444K logic cells | 444K logic cells | Smaller Kintex-7 capacity than 444K | 444K logic cells | 444K logic cells | 444K logic cells |
| Device Speed Grade | -2 | -2 | -2 | -2 | -2 | -1, one speed-grade step below -2 |
| Temperature Ordering Attribute | I, industrial | Verify FF900 versus FFG900 ordering attribute | Verify exact ordering attribute | E, extended-temperature ordering attribute | C, commercial-temperature ordering attribute | I, industrial |
| Verified Reference Price as of 2026-10-28 | $166.3163 at LCSC | $3,446.46000 in the Octopart equivalent listing | No verified alternative price supplied | No verified alternative price supplied | No verified alternative price supplied | No verified alternative price supplied |
| Debug Support | ARM CoreSight | ARM CoreSight | ARM CoreSight | ARM CoreSight | ARM CoreSight | ARM CoreSight |
Principaux différenciateurs
- Largest verified same-family processing configuration in the comparison set (vs XC7Z045-2FFG900I)
- Industrial ordering attribute retained in the closest lower-speed candidate (vs XC7Z100-1FF900I)
- Closest verified procurement match for design-in and second-source evaluation (vs XC7Z100-2FFG900I)
Notes de conception
Treat the Zynq-7000 power design as a multi-rail, sequencing-sensitive system rather than a single-supply FPGA design. Follow the AMD DS191 data sheet and the power-supply requirements of the selected reference design for rail names, ramp rates, and enable ordering. Place bulk and high-frequency decoupling directly at the relevant package balls, preserve the specified return paths, and validate the sequencing with an oscilloscope before enabling full-speed operation. Do not substitute rail values from generic Kintex-7 designs without checking the integrated processor subsystem.
The 900-FCBGA package has a large thermal path but can still dissipate substantial power during Kintex-7 logic and ARM Cortex-A9 activity. Use the AMD package thermal data to estimate junction temperature, then size exposed copper, inner thermal planes, vias, and board-to-chassis heat transfer for the worst sustained workload. Estimated: a design may be considered thermally unverified until power and theta_JA values are taken from the exact data sheet; no package thermal resistance was present in the supplied data. Avoid relying on a nominal logic utilization figure because clocking and switching activity dominate dynamic power.
The 900-ball footprint requires disciplined high-speed layout and escape routing. Match AMD's reference-design stack-up and ballout guidance, use controlled-impedance differential pairs for high-speed links, and avoid stubs or discontinuities. Separate clocks from noisy data paths, provide solid ground-plane continuity under the device, and keep configuration, JTAG, and clock-dedicated routing short. Because the package symbol is not present in the available SVG library and the full verified ball map is not reproduced here, engineers should import the official AMD ASCII or CSV package file into PCB tooling rather than infer a ball map.
Do not treat the FF900 and FFG900 ordering codes as interchangeable solely because distributor descriptions show the same 900-FCBGA class and the same 444K logic-cell count. Check the AMD ordering tables for package, temperature, speed, and lifecycle attributes, and compare the official package drawings and device pin files. Likewise, an AMD support-thread statement about XC7Z045-2FFG900 pin equivalence is not a blanket substitute guarantee. For production designs, verify bitstream compatibility, power sequencing, exposed-ball connections, and software device-tree settings on the exact replacement MPN.
Informations de conformité
The supplied search results do not contain explicit RoHS, REACH, lead-free, halogen-free, or conflict-minerals declarations. Compliance must be confirmed using the exact AMD product page, material declaration, or authorized-distributor documentation. AEC-Q100 is recorded as not applicable because this is an FPGA and SoC rather than an AEC-Q100-qualified automotive semiconductor category.
