XC7Z100-2FF900I vs XC7Z100-1FF900I Comparaison
Comparaison détaillée côte à côte de XC7Z100-2FF900I par AMD et XC7Z100-1FF900I par AMD. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | XC7Z100-2FF900I | XC7Z100-1FF900I |
|---|---|---|
| Marque | AMD | AMD |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Device Type | Zynq-7000 Kintex-7 programmable system-on-chip | — |
| Processor Subsystem | Dual ARM Cortex-A9 MPCore | — |
| Processor Clock Rating | 800 MHz | — |
| FPGA Logic Cells | 444K logic cells | 444K logic cells |
| FPGA Family | Kintex-7 | — |
| Boîtier | 900-FCBGA, 31 mm x 31 mm | — |
| Package Pin Count | 900 pins | — |
| Device Speed Grade | -2 | — |
| Temperature Grade | Industrial | — |
| Type de montage | Surface mount | Surface mount |
| Integrated Programmable Logic | 444K Kintex-7 logic cells | — |
| Debug Support | ARM CoreSight debug resources | — |
| Design Toolchain | AMD FPGA and SoC development toolchain; exact version [DATA_NEEDED: design toolchain version] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: minimum and maximum operating temperature] | [DATA_NEEDED: operating temperature range] |
| Number of High-Speed Transceivers | [DATA_NEEDED: transceiver count] | — |
| Maximum Transceiver Data Rate | [DATA_NEEDED: maximum transceiver data rate] | — |
| Programmable I/O Count | [DATA_NEEDED: programmable I/O count] | — |
| Memory Interface Details | [DATA_NEEDED: memory interface types and supported rates] | — |
| Power Supply Inputs | [DATA_NEEDED: supply rail names and voltage ranges] | — |
| Typical Power Consumption | [DATA_NEEDED: typical and maximum power consumption] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance declaration] | RoHS |
| REACH Status | [DATA_NEEDED: REACH compliance declaration] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free packaging declaration] | — |
| AEC-Q100 Qualification | Not applicable; this is an FPGA and SoC rather than an automotive-grade discrete component | — |
| Package Thermal Resistance | [DATA_NEEDED: package thermal resistance] | — |
| Product Type | — | Zynq-7000 system on chip |
| Processor Configuration | — | Dual Arm Cortex-A9 MPCore |
| Processor Operating Frequency | — | 667 MHz |
| FPGA Architecture | — | Kintex-7 |
| Debug and Trace | — | CoreSight |
| Package Type | — | 900-FCBGA |
| Package Dimensions | — | 31 x 31 mm |
| Package Ball Count | — | 900 balls |
| Device Family | — | Zynq-7000 |
| Architecture | — | Dual-core ARM Cortex-A9 with Kintex-7 programmable logic |
| Supply Voltage Range | — | [DATA_NEEDED: supply voltage range] |
| Maximum I/O Count | — | [DATA_NEEDED: maximum I/O count] |
| Block RAM Capacity | — | [DATA_NEEDED: block RAM capacity] |
| DSP Slice Count | — | [DATA_NEEDED: DSP slice count] |
| Manufacturer Qualification | — | [DATA_NEEDED: industrial or automotive qualification] |