XCKU5P-1FFVB676E - 280-I/O Kintex UltraScale+ FPGA | AMD
Référence : XCKU5P-1FFVB676E ✓ ActifXCKU5P-1FFVB676E Présentation
A Kintex UltraScale+ FPGA is a programmable semiconductor used to implement digital control, data processing, signal processing, networking, and embedded systems. Within the FPGA hierarchy, it combines configurable logic blocks, block RAM, DSP resources, programmable I/O, dedicated clocking, and high-speed serial transceivers. This balance makes the device useful when designers need substantial parallel processing resources while retaining the flexibility of reconfigurable hardware.
The XCKU5P-1FFVB676E provides 474,600 logic cells for control logic and complex digital pipelines, together with 1,824 DSP slices for filtering, modulation, correlation, fixed-point arithmetic, and other multiply-accumulate-intensive tasks. Its 17,280 Kb of block RAM provides on-chip storage for packet buffers, waveform data, lookup tables, and data-plane staging. The 280 I/O expand board connectivity without relying primarily on external serial links.
The Kintex UltraScale+ architecture uses a FinFET implementation to combine high logic density with performance and power efficiency. Its device-specific configuration, bitstream, package pinout, and power characteristics must be handled as one design target rather than as interchangeable generic FPGA parameters. UltraScale+ package pinout resources and AMD product documentation should be used to verify each ball assignment, differential-pair polarity, supply requirement, and configuration connection before schematic or PCB signoff.
Typical uses include industrial machine vision, high-throughput data acquisition, digital communications, radar and signal-processing front ends, network infrastructure, test equipment, and high-speed protocol bridges. The combination of DSP slices and block RAM makes the device suitable when algorithm behavior or system requirements may evolve faster than a fixed ASIC design cycle. Its 280 I/O also supports parallel sensors, converters, memory interfaces, and board-level control signals.
Design planning should account for the 676-ball FCBGA footprint, multilayer PCB construction, controlled-impedance routing, separate power distribution, decoupling, thermal management, and configuration-signal handling. Differential and high-speed interfaces require trace-length matching and reference-plane continuity, while the 27 x 27 mm package demands careful escape routing from its dense ball array. Prototype platforms can reduce hardware risk before a production board is committed.
This page combines the verified device identity, package and resource details with practical application guidance, same-package migration options, and engineering-focused design notes. The comparisons emphasize how speed grade, temperature grade, resource capacity, package, and qualification requirements affect replacement decisions rather than treating every Kintex UltraScale+ FPGA as interchangeable.
Alternatives de remplacement direct pour XCKU5P-1FFVB676E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XCKU5P-1FFVB676E (même facteur de forme et même empreinte) — différant par Logic Cells, Package, Mounting Type, Speed Grade, RoHS Status.
XCKU5P-2FFVB676E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCKU5P-3FFVB676E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCKU5P-1FFVB676I
✅ Remplacement direct ⚠️ Spécifications non vérifiéesContactez-nous pour le prix
Voir la fiche technique →XCKU5P-2FFVB676I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✗ Rupture de stock
$1660 / unité
Voir la fiche technique →XCKU5P-3FFVB676I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XCKU5P-1FFVB676E Valeurs maximales et caractéristiques électriques
| Device Type | Kintex UltraScale+ Field Programmable Gate Array |
| Logic Cells | 474,600 cells |
| User I/O | 280 I/O |
| Block RAM | 17,280 Kb |
| DSP Slices | 1,824 slices |
| Process Technology | FinFET |
| Speed Grade | -1 |
| Temperature Grade | Extended |
| Junction Temperature Range | 0°C to 100°C |
| Package Type | 676-FCBGA |
| Package Dimensions | 27 x 27 mm |
| Package Pin Count | 676 balls |
| Type de montage | Surface Mount |
| Product Family | Kintex UltraScale+ |
| Programmable Logic | FPGA |
Guide de configuration des broches du XCKU5P-1FFVB676E 676 balls
Configuration des broches du XCKU5P-1FFVB676E (boîtier 676 balls). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour XCKU5P-1FFVB676E.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
XCKU5P-1FFVB676E convient pour 6 applications: Industrial Machine Vision, High-Speed Data Acquisition, Digital Communications, Radar and Digital Signal Processing, Test and Measurement Equipment, Network Infrastructure and Protocol Bridging.
Industrial Machine Vision
The XCKU5P-1FFVB676E fits machine-vision systems that combine pixel capture, real-time filtering, feature detection, and interface control in one programmable device. Its 474,600 logic cells support parallel pipelines and control logic, while 1,824 DSP slices accelerate correlation, convolution, and arithmetic operations. The 280 I/O provide direct connections to image sensors, converters, memory, and industrial I/O. The 0°C to 100°C junction range supports extended-temperature industrial envelopes. Designers should implement image buffering in the 17,280 Kb block RAM, partition DSP-intensive kernels for predictable timing, and validate the FFVB676 power and thermal design against the completed sensor and I/O load.
Recommandé
High-Speed Data Acquisition
The XCKU5P-1FFVB676E is suitable for parallel data-acquisition systems that must capture, condition, and route high-volume digital samples with deterministic timing. The 280 I/O support wide parallel buses and multiple converter interfaces, while the large logic-cell count supports control sequencing, buffering, and timestamp functions. Its 1,824 DSP slices can implement digital downconversion, filtering, and scaling directly in FPGA fabric. The 17,280 Kb of block RAM is useful for staged sample buffers and programmable windows. A robust design should partition I/O capture, processing, and storage by clock domain, constrain timing-critical paths, and include thermal margin for sustained acquisition workloads.
Recommandé
Digital Communications
The XCKU5P-1FFVB676E can implement protocol engines, packet processors, channelizers, and digital front ends where flexibility and parallel throughput matter. Its 474,600 logic cells support control state machines and multi-interface logic, while 1,824 DSP slices handle filtering and symbol-rate processing. The 280 I/O allow parallel backplane, chip-to-chip, and configuration connections alongside serial links. Block RAM can hold packet queues, correlation sequences, and filter coefficients without external memory access on every cycle. Engineers should use the AMD device constraints and board-level timing analysis to close setup-and-hold requirements, while separating noisy transceiver supplies from sensitive fabric rails where the power architecture permits.
Recommandé
Radar and Digital Signal Processing
The XCKU5P-1FFVB676E suits radar, sonar, and communications signal-processing chains that require parallel channels, high sample throughput, and reconfigurable algorithms. The 1,824 DSP slices provide substantial multiply-accumulate capacity for matched filters, digital downconversion, FFT-related pipelines, and adaptive processing. The 17,280 Kb of block RAM supports coefficient storage, circular buffers, and staged sample histories, while 280 I/O simplify connection to converters and digital interfaces. The extended-temperature junction specification supports designs operating across a wider environmental range than a standard commercial grade. Critical deployments should verify clock-jitter budgets, power sequencing, and sustained thermal performance in the final enclosure.
Recommandé
Test and Measurement Equipment
The XCKU5P-1FFVB676E can serve as the programmable core of test, measurement, and instrumentation equipment requiring flexible sequencing and high-speed data paths. Its 474,600 logic cells can implement acquisition control, pattern generation, protocol engines, and digital signal processing, while 1,824 DSP slices support real-time numerical operations. The 280 I/O provide broad connectivity to source, capture, trigger, and interface modules. The 17,280 Kb block RAM enables local buffering and calibration data storage. Because the device sits in a dense FCBGA package, successful implementation depends on careful ball escape routing, controlled-impedance PCB construction, stable power delivery, and a thermal design that supports sustained instrument workloads.
Recommandé
Network Infrastructure and Protocol Bridging
The XCKU5P-1FFVB676E is appropriate for network adapters, protocol converters, traffic processors, and adaptive interface cards that benefit from reconfigurable packet handling. The large logic-cell pool supports protocol state machines, lookup functions, buffering control, and multiple concurrent data paths, while the 1,824 DSP slices accelerate classification, hashing, filtering, and traffic analytics. Its 280 I/O allow direct attachment to parallel network processors, memory, and board-level control logic, and the 17,280 Kb block RAM can support local packet queues. A production design should verify SerDes or external transceiver interfaces separately, maintain continuous reference planes on high-speed routes, and test reset, configuration, and error-recovery behavior across power states.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XCKU5P-1FFVB676E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XCKU5P-2FFVB676E | XCKU5P-3FFVB676E | XCKU5P-1FFVB676I | XCKU5P-2FFVB676I | XCKU5P-3FFVB676I |
|---|---|---|---|---|---|---|
| Package | 676-FCBGA, 27 x 27 mm | 676-FCBGA, 27 x 27 mm | 676-FCBGA, 27 x 27 mm | 676-FCBGA, 27 x 27 mm | 676-FCBGA, 27 x 27 mm | 676-FCBGA, 27 x 27 mm |
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Product Family | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ | Kintex UltraScale+ |
| Logic Cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells | 474,600 cells |
| User I/O | 280 I/O | 280 I/O | 280 I/O | 280 I/O | 280 I/O | 280 I/O |
| Block RAM | 17,280 Kb | 17,280 Kb | 17,280 Kb | 17,280 Kb | 17,280 Kb | 17,280 Kb |
| DSP Slices | 1,824 slices | 1,824 slices | 1,824 slices | 1,824 slices | 1,824 slices | 1,824 slices |
| Speed Grade | -1 | -2 | -3 | -1 | -2 | -3 |
| Temperature Designation | E extended temperature | E extended temperature | E extended temperature | I industrial temperature | I industrial temperature | I industrial temperature |
Principaux différenciateurs
- Lower -1 speed grade with the same FFVB676 package (vs XCKU5P-2FFVB676E)
- Extended-temperature E designation (vs XCKU5P-1FFVB676I)
- Resource-rich Kintex UltraScale+ implementation (vs XCKU5P-3FFVB676I)
Notes de conception
Design the PCB around the 676-ball FCBGA footprint and its 27 x 27 mm body dimensions. Use AMD's FFVB676 package data to define every ball location, pad stack, and via-in-pad requirement. High-density escape routing should be planned across multiple PCB layers, with short return paths and uninterrupted reference planes. Do not reuse a generic FCBGA footprint merely because both packages have 676 balls; package-specific mechanical drawings and ball maps take precedence.
Create the power tree from the AMD device datasheet rather than from generic FPGA conventions. Assign separate distribution paths for core and I/O supplies, place decoupling close to the corresponding package balls, and keep high-current connections with low loop impedance. Validate voltage sequencing, current transients, ripple, and power-plane capacity under the completed design. A 27 x 27 mm FCBGA can require substantial via arrays and plane transitions to distribute current without excessive voltage drop.
The device is specified for a 0°C to 100°C junction-temperature range, but that rating is not a design target and does not remove the need for a thermal path. Estimate worst-case junction temperature from actual ambient temperature, FPGA power, package thermal characteristics, board copper, airflow, and neighboring heat sources. Use thermal vias beneath the device where supported by the package design, and verify the completed assembly rather than relying only on PCB simulation. Margin should be retained for elevated ambient and sustained workloads.
Partition high-speed I/O, configuration paths, clock inputs, and sensitive fabric logic according to the device's supported interface constraints. Use controlled-impedance routing, symmetrical pair geometry, appropriate via transitions, and continuous reference planes. On dense escape routes, consider the electrical effect of via stubs and layer changes, then confirm them with the board stack-up and post-layout simulation. Configuration and clock nets require particular attention because errors can prevent reliable startup even when ordinary functional interfaces operate correctly.
Informations de conformité
The current device listings identify the exact FPGA, package, resource configuration, speed grade, and temperature grade but do not state the requested compliance attributes. The E suffix denotes the extended-temperature product option and must not be interpreted as an automotive qualification.