XCKU5P-2FFVB676I - Kintex UltraScale+ FPGA | AMD | 474K Logic Cells
MPN: XCKU5P-2FFVB676I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $202.74 | $202.74 |
| 10 | $190 | $1,900.00 |
| 100 | $175 | $17,500.00 |
| 500 | $160 | $80,000.00 |
| 1,000 | $150 | $150,000.00 |
Drop-in alternatives for XCKU5P-2FFVB676I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XCKU5P-1FFVB676I
✅ Drop-In📋 Reference alternative (not in catalog)
XCKU5P-2FFVB676C
✅ Drop-In📋 Reference alternative (not in catalog)
XCKU5P-2FFVB676I
✅ Drop-In✓ 99,999 In Stock
$150 / Unit
View Datasheet →XCKU5P-2FFVB676I
✅ Drop-In✓ 99,999 In Stock
$150 / Unit
View Datasheet →XCKU5P-2FFVB676I
✅ Drop-In✓ 99,999 In Stock
$150 / Unit
View Datasheet →XCKU5P-2FFVB676I Maximum Ratings & Electrical Characteristics
| Family | Kintex UltraScale+ |
| Logic Cells | 474600 |
| Number of I/Os | 280 |
| Block RAM (bits) | 41984000 |
| Package | 676-BBGA, FCBGA |
| Operating Temperature | -40°C to +100°C |
| Core Voltage | 825 mV to 876 mV |
| Maximum Clock Frequency | 725 MHz |
| Clock Management | MMCM, PLL |
| Mounting Type | Surface Mount |
| Number of Terminals | 676 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Speed Grade | -2 |
| RoHS Status | Compliant |
XCKU5P-2FFVB676I Pin Configuration
| Pin A1 | IO_L1P_T0_00 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0_00 — User I/O bank 0, differential pair N |
| Pin B1 | IO_L2P_T0_00 — User I/O bank 0, differential pair P |
| Pin B2 | IO_L2N_T0_00 — User I/O bank 0, differential pair N |
| Pin C1 | VCCINT — Core logic power supply |
| Pin C2 | GND — Ground |
| Pin D1 | VCCAUX — Auxiliary power supply |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0_00 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0_00 — User I/O bank 0, differential pair N |
| Pin F1 | IO_L4P_T0_00 — User I/O bank 0, differential pair P |
| Pin F2 | IO_L4N_T0_00 — User I/O bank 0, differential pair N |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCKU5P-2FFVB676I is suitable for 6 applications: Networking and Communications, Data Center Acceleration, Video Processing, Aerospace and Defense, Test and Measurement, Wireless Communications.
Networking and Communications
The XCKU5P-2FFVB676I is ideal for networking applications such as switches, routers, and network interface cards. Its high logic density (474,600 cells) and support for high-speed transceivers enable implementation of complex packet processing, traffic management, and protocol handling. The device's 280 I/Os allow connection to multiple PHYs and memory interfaces. With a maximum clock frequency of 725 MHz, it can handle high-throughput data paths. The industrial temperature range ensures reliable operation in network equipment deployed in harsh environments. According to AMD, the Kintex UltraScale+ family provides the best price/performance/watt balance, making it cost-effective for high-end networking.
Recommended
Data Center Acceleration
In data centers, the XCKU5P-2FFVB676I can be used for workload acceleration, including AI inference, database acceleration, and video transcoding. Its 474,600 logic cells and 41,984,000 bits of block RAM provide ample resources for implementing custom accelerators. The device supports PCIe Gen3/4, enabling high-bandwidth host connectivity. The low power consumption of the 16nm FinFET process is critical for dense server deployments. The industrial temperature grade allows operation in data center environments with elevated temperatures. AMD's UltraScale+ architecture supports partial reconfiguration, enabling dynamic updates to acceleration functions without downtime.
Recommended
Video Processing
The XCKU5P-2FFVB676I is well-suited for video processing applications such as broadcast equipment, video surveillance, and medical imaging. Its high logic density enables implementation of complex video codecs, image processing pipelines, and frame buffers. The 280 I/Os can interface with multiple video ADCs/DACs and memory devices. The device's clock management (MMCM, PLL) supports various video clocking requirements. The industrial temperature range is beneficial for outdoor surveillance cameras. With support for high-speed transceivers, it can handle uncompressed video streams over SDI or Ethernet. The low power consumption is advantageous for portable or fanless video equipment.
Recommended
Aerospace and Defense
The XCKU5P-2FFVB676I is suitable for aerospace and defense applications including radar, electronic warfare, and secure communications. Its industrial temperature range (-40°C to +100°C) meets the requirements for harsh military environments. The high logic density and DSP capabilities enable complex signal processing algorithms. The device supports partial reconfiguration, allowing in-field updates for evolving mission requirements. The 676-ball FCBGA package provides robust thermal and mechanical performance. AMD's UltraScale+ family is widely used in defense systems due to its reliability and long-term availability. The device's security features, such as AES bitstream encryption, protect intellectual property.
Recommended
Test and Measurement
The XCKU5P-2FFVB676I is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high logic density and high-speed transceivers enable high-bandwidth data acquisition and generation. The 280 I/Os can interface with high-speed ADCs and DACs. The device's clock management supports precise timing and synchronization. The industrial temperature range ensures stable operation in benchtop and field instruments. The low power consumption is beneficial for portable test equipment. AMD's UltraScale+ architecture provides the performance needed for real-time signal processing and triggering.
Recommended
Wireless Communications
The XCKU5P-2FFVB676I is used in wireless base stations and software-defined radios. Its high logic density and DSP capabilities enable implementation of baseband processing, channel coding, and beamforming. The device supports high-speed serial interfaces for connecting to RF transceivers. The industrial temperature range is suitable for outdoor base station equipment. The low power consumption is critical for energy-efficient operation. AMD's Kintex UltraScale+ family offers the best price/performance/watt balance, making it cost-effective for wireless infrastructure. The device's partial reconfiguration allows dynamic updates to support multiple wireless standards.
Recommended
Recommended Products Summary
Engineering reference data for XCKU5P-2FFVB676I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCKU5P-1FFVB676I | XCKU5P-2FFVB676C |
|---|---|---|---|
| Package | 676-BBGA, FCBGA | 676-BBGA, FCBGA | 676-BBGA, FCBGA |
| Brand | AMD | AMD | AMD |
| Logic Cells | 474600 | 474600 | 474600 |
| Number of I/Os | 280 | 280 | 280 |
| Block RAM (bits) | 41984000 | 41984000 | 41984000 |
| Operating Temperature | -40°C to +100°C | -40°C to +100°C | 0°C to +85°C |
| Maximum Clock Frequency | 725 MHz | 600 MHz (estimated) | 725 MHz |
| Speed Grade | -2 | -1 | -2 |
Key Differentiators
- Higher speed grade (-2) enables faster clock frequencies up to 725 MHz (vs XCKU5P-1FFVB676I)
- Industrial temperature grade (-40°C to +100°C) for harsh environments (vs XCKU5P-2FFVB676C)
- Same package and pinout as other Kintex UltraScale+ devices (vs XCKU5P-1FFVB676I)
Design Notes
The XCKU5P-2FFVB676I requires multiple power rails: VCCINT (0.85V typical), VCCAUX (1.8V), and VCCO (depending on I/O banks). Use a dedicated power management IC to sequence these rails properly. Decouple each rail with a combination of bulk and ceramic capacitors, placing them close to the FPGA pins. Refer to the AMD power estimation tool (XPE) to calculate current requirements for your design.
The FPGA can dissipate significant power under heavy utilization. The 676-ball FCBGA package has a thermal resistance that requires a heatsink or forced airflow for high-performance applications. Use a thermal simulation to determine the junction temperature. Ensure the PCB has adequate copper planes for heat spreading. The industrial temperature grade allows operation up to 100°C, but junction temperature should be kept below 125°C for reliability.
For high-speed signals, follow the layout guidelines in UG583 (UltraScale+ PCB Design). Use controlled impedance traces for differential pairs and match trace lengths for high-speed interfaces. Place decoupling capacitors as close as possible to the FPGA power pins. Use a solid ground plane and avoid splitting it under the FPGA. For the 676-ball BGA, use via-in-pad or microvias to route signals efficiently.
Compliance Information
RoHS compliance is indicated by distributor listings. Other compliance details are not specified in the provided data.
