XDPE19283B0000XTMA1 - 8-Phase SVI3 Dual-Loop Controller | Infineon
Référence : XDPE19283B0000XTMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.65 | $2 325,00 |
| 1 000 | $4.1 | $4 100,00 |
XDPE19283B0000XTMA1 Présentation
A digital multiphase controller is a power-management IC that orchestrates multiple parallel buck converter phases to deliver high currents at low voltages with fast transient response. Within the broader hierarchy, the XDPE19283B sits as a multiphase controller -> DC-DC controller -> power management IC -> semiconductor. Such devices replace single-phase voltage regulators in CPU/GPU core rails where the load can swing from a few amps to over 100 A in microseconds, and where telemetry, fault handling, and adaptive voltage positioning are mandatory.
Key features include AMD SVI3 Rev 2.0 compliance, PMBus rev 1.3 serial interface support up to 1 MHz, flexible PWM phase ordering and phase shedding, and per-loop digital compensation. The integrated ARM Cortex-M0 core handles telemetry, fault logging, and configuration via PMBus, while the analog front end provides accurate current sensing and adaptive transient response. Loop multiplexing enables asymmetric rail configurations such as 6+2 for core + integrated graphics on AMD HEDT platforms.
Architecture-wise, the device combines two independent digital control loops that each manage a programmable number of phases. Per-phase current sharing and temperature balancing are handled in firmware, which lets the same silicon serve multiple platform form factors. The PMBus interface exposes telemetry for VIN, VOUT, IOUT, temperature, and fault status, and supports both AVS and dynamic load-line trim.
Typical applications include AMD SP3/SP5 socket core voltage rails, HEDT processor platforms, server memory termination, and high-current ASIC rails. Pair the controller with Infineon OptiMOS power stages such as TDA21462AUMA1 or TDA21525, plus an external divider and a PMBus-capable supervisor. The device is targeted at high-volume server OEMs, so expect long-term production support from Infineon. Ensure your PCB provides adequate copper and thermal vias beneath the exposed pad to keep junction temperature within limits under full phase count.
Alternatives de remplacement direct pour XDPE19283B0000XTMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XDPE19283B0000XTMA1 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Number of Phases, Output Voltage Range, Topology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XDPE19283B-0000
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XDPE12284C0000XUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.72 / unité
Voir la fiche technique →XDPE19283C0000XUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XDPP1140100BXUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.2 / unité
Voir la fiche technique →XDPP1148100BXUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.25 / unité
Voir la fiche technique →XDPE19283B0000XTMA1 Valeurs maximales et caractéristiques électriques
| Topologie | Digital dual-loop multiphase PWM controller |
| Number of Phases | Up to 8 phases (configurable 8+0, 7+1, 6+2, 4+4) |
| Plage de tension de sortie | 0.25 V to 2.8 V |
| Output Voltage Step | 5 mV/step |
| Processor Core | ARM Cortex-M0 |
| Compliance - CPU/V | AMD SVI3 Rev 2.0 |
| Compliance - PMBus | PMBus rev 1.3, up to 1 MHz |
| Interface | PMBus (I2C-compatible), 1 MHz max |
| Boîtier | 40-pin QFN |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Phase Shedding | Supported (per-loop, configurable) |
Configuration des broches de XDPE19283B0000XTMA1
| Broche 1 | PVCC — Power supply for gate drivers / analog |
| Broche 2 | BOOT1 — Bootstrap phase 1 |
| Broche 3 | UGATE1 — High-side gate drive phase 1 |
| Broche 4 | LGATE1 — Low-side gate drive phase 1 |
| Broche 5 | PWM1 — PWM output phase 1 |
| Broche 6 | FB1 — Loop 1 voltage feedback |
| Broche 7 | VSEN1 — Voltage sense Loop 1 |
| Broche 8 | GND — Ground |
| Broche 9 | ISEN1N — Current sense Loop 1 negative |
| Broche 10 | ISEN1P — Current sense Loop 1 positive |
| Broche 11 | REF — Reference voltage |
| Broche 12 | VOUT_SNS — Output voltage sense |
| Broche 13 | TSEN1 — Temperature sense |
| Broche 14 | SDA — PMBus data |
| Broche 15 | SCL — PMBus clock |
| Broche 16 | ADDR — PMBus address select |
| Broche 17 | EN — Enable input |
| Broche 18 | PGOOD — Power good output |
| Broche 19 | ALERT — PMBus alert |
| Broche 20 | NC — Not connected (per datasheet) |
| Broche 21 | PVCC — Power supply for gate drivers |
| Broche 22 | BOOT2 — Bootstrap phase 2 |
| Broche 23 | UGATE2 — High-side gate drive phase 2 |
| Broche 24 | LGATE2 — Low-side gate drive phase 2 |
| Broche 25 | PWM2 — PWM output phase 2 |
| Broche 26 | FB2 — Loop 2 voltage feedback |
| Broche 27 | VSEN2 — Voltage sense Loop 2 |
| Broche 28 | GND — Ground |
| Broche 29 | ISEN2N — Current sense Loop 2 negative |
| Broche 30 | ISEN2P — Current sense Loop 2 positive |
| Broche 31 | VDRV — Gate drive supply |
| Broche 32 | TSEN2 — Temperature sense Loop 2 |
| Broche 33 | PWM3 — PWM output phase 3 |
| Broche 34 | PWM4 — PWM output phase 4 |
| Broche 35 | PWM5 — PWM output phase 5 |
| Broche 36 | PWM6 — PWM output phase 6 |
| Broche 37 | PWM7 — PWM output phase 7 |
| Broche 38 | PWM8 — PWM output phase 8 |
| Broche 39 | VDDIO — Digital I/O supply |
| Broche 40 | EPAD — Exposed thermal pad (GND) |
Applications typiques
XDPE19283B0000XTMA1 convient pour 7 applications: AMD SP3/SP5 Server Core Rails, High-End Desktop (HEDT) Processors, Workstation GPU Power Rails, ASIC and Accelerator Card Rails, Server Memory and Termination Rails, Telecom and Networking Platforms, Industrial Embedded Compute.
AMD SP3/SP5 Server Core Rails
The XDPE19283B0000XTMA1 is purpose-built for AMD SVI3 Rev 2.0 core voltage rails on SP3 and SP5 socket server platforms. Its dual-loop 8-phase architecture handles the extreme load-line transients (sub-microsecond dI/dt) characteristic of EPYC-class processors. With PMBus rev 1.3 telemetry, platform management can read VOUT, IOUT, and temperature in real time for AVS loop closure. The 0.25 V to 2.8 V output range covers deep low-power states to turbo boost voltages. Pair with TDA21462AUMA1 DrMOS devices for an 8-phase 200 A+ solution.
Recommandé
High-End Desktop (HEDT) Processors
Workstation and high-end desktop AMD platforms benefit from the XDPE19283B0000XTMA1's flexible 6+2 or 7+1 phase configurations. Loop 1 powers VDDCR (CPU cores) at high current, while Loop 2 powers VDDCR_SOC or integrated graphics at lower current. The 5 mV voltage step resolution supports AVS commands that dynamically optimize per-workload voltage-frequency points. The 40-pin QFN package footprint is compact enough for ATX motherboard layouts while leaving room for phase doublers and discrete power stages.
Recommandé
Workstation GPU Power Rails
High-performance workstation GPUs such as AMD Radeon Pro and Instinct accelerators draw hundreds of amps at sub-1V levels. The XDPE19283B0000XTMA1's 8-phase capacity and adaptive transient response support these rails while PMBus telemetry reports back to system firmware for power capping. The 1 MHz PMBus speed allows fast telemetry polling for workload-aware power management. Designers should size the input capacitors per platform transient guidance and ensure adequate thermal vias under the QFN exposed pad.
Recommandé
ASIC and Accelerator Card Rails
AI training and inference ASICs often operate at 0.6-0.9 V core voltages with extremely fast transients. The XDPE19283B0000XTMA1's digital compensation and programmable loop bandwidth can be tuned via PMBus to match custom ASIC load profiles. Its 8+0 configuration delivers the bulk current, while per-phase telemetry enables predictive thermal management. The part's industrial-grade temperature support suits edge AI accelerator cards operating in non-datacenter environments with elevated ambient temperatures.
Recommandé
Server Memory and Termination Rails
Lower-power auxiliary rails such as DDR memory termination (typically 0.6 V VTT) or memory VPP can be derived from the XDPE19283B0000XTMA1's secondary loop. Using 2+0 or 4+0 configurations, the same controller that powers the CPU core can deliver a regulated secondary rail, reducing BOM count. However, dedicated DDR VTT regulators are usually more cost-effective for memory alone. The benefit emerges when consolidating CPU + memory rails on a single multiphase controller to reduce board area.
Recommandé
Telecom and Networking Platforms
Network processor SoCs in telecom and data-center switching equipment often require multiple high-current low-voltage rails. The XDPE19283B0000XTMA1 supports these via its dual-loop architecture, with each loop independently configurable for different rails (e.g., 4+4 or 6+2 topologies). PMBus telemetry integrates with platform BMC for remote power monitoring. Industrial-grade temperature rating allows deployment in NEBS-compliant telecom chassis. Validate thermal performance of the 40-pin QFN under worst-case airflow conditions.
Recommandé
Industrial Embedded Compute
Industrial PCs, edge servers, and ruggedized compute platforms use AMD embedded processors (e.g., Ryzen Embedded V3000) that require SVI3-compliant power. The XDPE19283B0000XTMA1's industrial temperature rating and PMBus programmability suit long-life industrial designs. Its compact 40-pin QFN enables dense motherboards for fanless or limited-cooling enclosures. Combine with industrial-grade Infineon power stages and TVS protection for IEC 61000-4 EMC compliance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XDPE19283B0000XTMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XDPE19283B-0000 | XDPE12284C0000XUMA1 | XDPE19283C0000XUMA1 | XDPP1140100BXUMA1 | XDPP1148100BXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | QFN-40 | QFN-40 - same | QFN-40 - same | QFN-40 - same | QFN-40 - same | QFN-40 - same |
| Topology | Dual-loop 8-phase | Dual-loop 8-phase | Dual-loop 8-phase (Intel VR13) | Dual-loop 8-phase | Programmable controller | Programmable controller |
| AMD SVI3 Compliance | Yes (Rev 2.0) | Yes (Rev 2.0) | No (Intel VR13) | Yes (Rev 2.0) | Configurable via firmware | Configurable via firmware |
| PMBus Interface | Rev 1.3, up to 1 MHz | Rev 1.3, up to 1 MHz | Rev 1.3 | Rev 1.3 | Rev 1.3 | Rev 1.3 |
| Processor Core | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 | ARM Cortex-M0 |
| Param Match (% to this_product) | 100 | 100 | 80 | 90 | 70 | 70 |
Principaux différenciateurs
- Built specifically for AMD SVI3 Rev 2.0 with dual-loop flexibility (vs XDPE12284C0000XUMA1 (Intel VR13 controller))
- Up to 8 phases with configurable 8+0/7+1/6+2/4+4 topologies (vs Single-loop 6-phase or 4-phase controllers)
- 1 MHz PMBus for fast telemetry and AVS (vs Industry-standard 400 kHz PMBus)
Notes de conception
The 40-pin QFN package dissipates power primarily through the exposed pad (EPAD). Solder the EPAD to a thermal copper pour with an array of thermal vias (typically 9-12 vias in a 3x3 to 4x4 grid, 0.3 mm drill, 1 mm pitch) to the internal ground plane. Under an 8-phase full load with all power stages active, the controller itself dissipates under 1 W, but the surrounding power stages drive the bulk thermal budget. Estimated: theta_JA on a standard 4-layer JEDEC board is approximately 35-40 C/W; design for ambient +20 C margin in server chassis with adequate airflow.
Place input bulk capacitors close to the power stage PVCC pins and the controller's PVCC/VDRV pins to minimize switching noise injection into the analog front end. Route the VSEN and ISEN differential pairs as tightly coupled traces with ground shielding; avoid crossing power plane cuts. Place the PMBus pull-up resistors near the controller's SDA/SCL pins and use a star topology if multiple PMBus devices share the bus. Decouple VDDP, VDDIO, and REF with 100 nF X7R ceramics plus 1 uF bulk caps per Infineon's reference layout.
Estimated: total loop inductance from each phase's input capacitors through the high-side MOSFET to output capacitors should be kept below 2 nH to meet transient response targets. Use 0402 or 0201 ceramic capacitors placed within 1 mm of the power stage VIN/VOUT pads. The feedback (VSEN) traces must connect at the output capacitor pad, not at the load, to avoid IR-drop errors; use a Kelvin sense connection. For multi-phase rails, keep phase switching nodes symmetric to minimize ground bounce.
The PMBus bus at 1 MHz is sensitive to capacitance and stub lengths. Keep the bus traces short (under 50 mm), avoid stubs by using daisy-chain topology, and isolate from switching node traces by 3W rule. If the controller and the BMC are on different boards, add a PMBus buffer (e.g., LTC4311 or PCA9306 equivalent). The ALERT pin is open-drain and requires a pull-up; route it carefully to avoid coupling into sensitive analog inputs like ISEN or TSEN.
Do not load firmware intended for a different XDPE variant - the SVI3 command GUIDs are platform-specific and a mismatch can cause AVS misbehavior or boot failure. Ensure the boot strap capacitors on each phase's BOOT pin are 100 nF X7R rated for at least 25 V. The PGOOD pin is open-drain; do not drive external loads above 5 mA directly from it. For multi-rail designs using both loops, configure phase count and AVS commands via PMBus BEFORE asserting EN to avoid startup glitches.
Informations de conformité
RoHS and REACH compliant per Infineon product page. Not AEC-Q100 qualified (industrial-grade, not automotive). Halogen-free status not confirmed in provided data - confirm with Infineon FAE if required.
