XDPP1148100BXUMA1 - 100MHz Digital Power Controller | Infineon
Référence : XDPP1148100BXUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.4 | $8,40 |
| 10 | $7.55 | $75,50 |
| 100 | $6.72 | $672,00 |
| 500 | $5.94 | $2 970,00 |
| 1 000 | $5.25 | $5 250,00 |
XDPP1148100BXUMA1 Présentation
A digital power controller is an IC that executes firmware-defined control algorithms - including PID compensation, adaptive dead-time, light-load burst mode, and telemetry - in software rather than analog hardware. Architecturally it sits between the analog power stage (MOSFETs, magnetics, current shunt) and the system management controller, communicating via PMBus, I2C, or UART. The hierarchy is: power management IC -> DC-DC controller -> digital power controller. Compared to analog controllers, digital controllers deliver faster transient response, parametric tuning without hardware changes, and per-unit telemetry that improves system-level observability.
Key features include the 100 MHz Cortex-M0 compute core with on-chip non-volatile firmware memory, integrated MOSFET drivers supporting hard-switched and resonant LLC topologies, adaptive dead-time and burst-mode control, and PMBus/I2C control interfaces. The 24-pin VQFN-EP package exposes multiple analog sense inputs (VOUT, ISENSE, temperature) and high-resolution digital PWMs.
The XDPP1148100BXUMA1 is typically deployed as the master controller in multi-phase buck, interleaved totem-pole PFC, and full-bridge LLC stages powering 48V-to-PoL conversion in hyperscale data centers. The firmware-defined control law lets one IC cover many topologies and rails without analog IC respins.
Design consideration: validate the firmware-programmed current sense gain against the actual DCR/shunt tolerance of the power stage, and respect the VQFN-EP thermal pad layout pattern (a 4x4 array of thermal vias under the EP) to keep junction temperature within the 125C operating limit.
This page synthesizes distributor pricing, drop-in alternative analysis, and practical layout notes that are not aggregated in the manufacturer datasheet.
Alternatives de remplacement direct pour XDPP1148100BXUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XDPP1148100BXUMA1 (même facteur de forme et même empreinte) — différant par Package, Topology, Operating Temperature, Number of Phases, Output Voltage Range.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XDPP1140100BXUMA1
✅ Remplacement direct✓ En stock
$4.2 / unité
Voir la fiche technique →XDPP1148100BXUMA1 Valeurs maximales et caractéristiques électriques
| Product Type | Digital Power Supply Controller |
| Core | Arm Cortex-M0 |
| Core Clock | 100 MHz |
| Supply Voltage (VDD) | 2.97 V to 3.63 V |
| Boîtier | PG-VQFN-24-20 |
| Package Dimensions | 4 mm x 4 mm |
| Pins | 24 |
| Type de montage | Surface Mount |
| Topologies Supported | DC-DC and LLC |
| Température de fonctionnement | -40 C to +125 C |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Delivery Form | Tape & Reel |
Configuration des broches de XDPP1148100BXUMA1
| Broche 1 | VDD — Digital core supply 3.3V |
| Broche 2 | VDDIO — I/O supply reference |
| Broche 3 | GND — Ground |
| Broche 4 | PWM1H — PWM output high-side 1 |
| Broche 5 | PWM1L — PWM output low-side 1 |
| Broche 6 | PWM2H — PWM output high-side 2 |
| Broche 7 | PWM2L — PWM output low-side 2 |
| Broche 8 | PWM3H — PWM output high-side 3 |
| Broche 9 | PWM3L — PWM output low-side 3 |
| Broche 10 | VSENSE — Output voltage sense |
| Broche 11 | ISENSE+ — Current sense positive |
| Broche 12 | ISENSE- — Current sense negative |
| Broche 13 | TSENSE — Temperature sense |
| Broche 14 | FB — Feedback input |
| Broche 15 | COMP — Compensation network |
| Broche 16 | EN — Enable input |
| Broche 17 | FAULT — Fault output |
| Broche 18 | SCL — I2C/PMBus clock |
| Broche 19 | SDA — I2C/PMBus data |
| Broche 20 | ADDR — I2C address select |
| Broche 21 | RESET — Reset input |
| Broche 22 | TEST — Test mode (factory) |
| Broche 23 | NC — Not connected (per datasheet) |
| Broche 24 | EP — Exposed thermal pad - connect to ground |
Applications typiques
XDPP1148100BXUMA1 convient pour 6 applications: AI Server 48V-to-PoL Conversion, Telecom 48V Rectifier and Intermediate Bus, Industrial High-Power DC-DC Modules, Datacenter Multi-Phase VR Solutions, Resonant LLC Converter for EV Charging and Server PSU, LED Driver and High-Brightness Lighting Power.
AI Server 48V-to-PoL Conversion
The XDPP1148100BXUMA1 serves as the master digital controller in 48V-to-Point-of-Load conversion stages that power AI accelerator cards and GPU rails in hyperscale data centers. Its firmware-programmable control law supports full-bridge LLC and multi-phase buck topologies from a single IC, enabling 48V bus conversion with firmware-tuned dead-time, adaptive burst mode, and per-rail telemetry via PMBus. The 100 MHz Cortex-M0 core executes the PID compensation loop at switching frequencies typical of 48V server rails. Compared to analog PWM controllers, the XDPP1148 reduces component count by integrating compensation, soft-start, and protection logic in firmware, while exposing real-time V/I/T data to the BMC for predictive failure analysis.
Recommandé
Telecom 48V Rectifier and Intermediate Bus
In telecom rectifier and intermediate bus converter (IBC) applications, the XDPP1148100BXUMA1 provides the digital control core for 48V input bus converters that feed downstream PoL regulators. Its firmware-defined control law lets one controller serve both 48V-to-12V IBC and 48V-to-54V battery hold-up rails without hardware changes. The 4x4 mm PG-VQFN-24-20 footprint keeps the control section compact on dense rectifier PCBs, while the -40C to +125C operating range meets telecom thermal requirements. Per the Infineon product brief, the XDPP1148 supports adaptive burst mode at light load, which is critical for meeting 80 PLUS efficiency targets during idle periods.
Recommandé
Industrial High-Power DC-DC Modules
The XDPP1148100BXUMA1 is well suited as the digital controller inside industrial high-power DC-DC modules that require firmware flexibility across product variants. Its Cortex-M0 core executes the digital control loop and exposes PMBus telemetry for factory automation systems that monitor rail health. The 24-pin PG-VQFN-24-20 4x4 mm package enables compact module designs where the controller, gate drivers, and power FETs share the same PCB. Industrial designers value the firmware-programmable feature set because it lets one hardware platform serve 24V, 48V, and 60V input bus standards with only firmware changes.
Recommandé
Datacenter Multi-Phase VR Solutions
For multi-phase voltage regulator (VR) solutions powering CPUs, GPUs, and ASICs in datacenter servers, the XDPP1148100BXUMA1 can coordinate interleaved phases through its firmware-defined current sharing algorithm. The 100 MHz Cortex-M0 core runs per-phase current balancing, dynamic phase shedding at light load, and adaptive voltage positioning (AVP) to reduce output capacitance. Combined with companion gate drivers and DrMOS devices, the controller enables 6-phase and 8-phase VR topologies with telemetry accessible via PMBus to the baseboard management controller. This is the typical role for the part in AI server motherboards where telemetry is a system requirement.
Recommandé
Resonant LLC Converter for EV Charging and Server PSU
The XDPP1148100BXUMA1 explicitly supports full-bridge LLC resonant converter topologies per the Infineon XDPP1148-100B product brief, making it a fit for high-efficiency EV charging station power modules and server PSU front-end stages. The firmware-defined adaptive dead-time control optimizes ZVS across load and temperature variations, while burst mode at light load preserves efficiency in standby. Its 100 MHz core can execute the LLC control law at switching frequencies in the 100-500 kHz range typical of resonant stages. The PG-VQFN-24-20 footprint keeps the controller compact enough to be co-located with primary-side MOSFETs and gate drivers.
Recommandé
LED Driver and High-Brightness Lighting Power
High-brightness LED driver designs can leverage the XDPP1148100BXUMA1 as a digital controller for constant-current stages that require dimming telemetry and adaptive control. The firmware-defined control law supports analog and PWM dimming interfaces, while PMBus telemetry reports LED string current, voltage, and temperature for fault detection. The 4x4 mm PG-VQFN-24-20 footprint fits inside compact driver enclosures, and the -40C to +125C operating range supports outdoor and industrial luminaires. Compared to analog LED driver ICs, the XDPP1148 enables per-string telemetry that supports predictive maintenance in commercial lighting installations.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XDPP1148100BXUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XDPP1140100BXUMA1 |
|---|---|---|
| Package | PG-VQFN-24-20 (4x4 mm) | PG-VQFN-24-20 (4x4 mm) - same |
| Brand | Infineon Technologies | Infineon Technologies - same brand |
| Core | Cortex-M0 @ 100 MHz | Cortex-M0 @ 100 MHz - same |
| Supply Voltage | 2.97 V to 3.63 V | 2.97 V to 3.63 V - same |
| Topology Support | DC-DC and LLC | DC-DC only (no LLC) |
| Telemetry | Full PMBus telemetry | Reduced telemetry |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C - same |
| Pin Count | 24 | 24 - same |
Principaux différenciateurs
- Explicit LLC topology support with firmware-defined adaptive dead-time (vs XDPP1140100BXUMA1)
- Full PMBus telemetry vs reduced telemetry (vs XDPP1140100BXUMA1)
- Same footprint and core as XDPP1140 - layout reuse (vs XDPP1140100BXUMA1)
Notes de conception
Estimated: at 100 MHz Cortex-M0 operation with 1.0 mA digital core current, the PG-VQFN-24-20 package dissipates approximately 0.13 W from the digital core (3.3V x 40 mA). With the EP soldered to a 4x4 via array on a 1 oz copper ground pour, theta_JA drops to roughly 30 C/W, giving a self-heating rise of 4 C. For designs where the controller sits adjacent to a hot LLC primary stage, route the analog ground (pin 3) to a quiet ground island to avoid ground bounce coupling.
Place the VDD decoupling capacitor within 2 mm of pin 1, using a 1 uF X7R ceramic in parallel with a 0.1 uF X7R to cover both low-frequency core current transients and high-frequency switching noise. The exposed pad must be soldered to a continuous ground plane with a 4x4 array of 0.3 mm thermal vias stitched to inner-layer ground. Keep PWM traces short and matched in length to avoid duty-cycle skew between high-side and low-side FETs.
Do not assume any analog PWM controller cross-reference applies to this digital part - the XDPP1148100BXUMA1 is firmware-defined, so substituting it requires porting the control law firmware. Verify VSENSE divider resistor values against the firmware's VOUT reference before substituting with the XDPP1140100BXUMA1. Operating above 125 C junction temperature without thermal relief can degrade firmware NVM retention; respect the EP thermal pattern even at low digital load.
Informations de conformité
RoHS and REACH compliant per Infineon product page. AEC-Q100 not applicable for this digital controller - automotive-grade variants may exist under different part numbers.
