מעגלים משולבים

תת-קטגוריות

📁 ADC/DAC 3,100+ מוצרים 📁 מעגלי מגבר 1,900+ מוצרים 📁 קודקי שמע 18 מוצרים 📁 רכיבי IC לאודיו 2 מוצרים 📁 שעון ותזמון 660+ מוצרים 📁 Comparator ICs 1 מוצרים 📁 DSP 1,100+ מוצרים 📁 מעגלי רכישת נתונים 2 מוצרים 📁 פוטנציומטרים דיגיטליים 4 מוצרים 📁 דרייברים ובקרים לתצוגה 1 מוצרים 📁 FPGA & CPLD 7,300+ מוצרים 📁 מעגלי ממשק 3,300+ מוצרים 📁 דרייברים ל-LED 1 מוצרים 📁 מעגלים לוגיים 460+ מוצרים 📁 מעגלי זיכרון 870+ מוצרים 📁 מיקרו-בקרים 20,000+ מוצרים 📁 מיקרו-מעבדים 4 מוצרים 📁 דרייברי מנוע 1 מוצרים 📁 אחר 1 מוצרים 📁 ממשקי חיישנים וגלאים 1 מוצרים 📁 מעגלים משולבים מתמחים 15 מוצרים 📁 מעגלי משולבים לווידאו 14 מוצרים

מוצרים (39,000+)

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx
XC3S200-4FTG256I

XC3S200-4FTG256I - Spartan-3 FPGA 200K Gates | Xilinx

The Xilinx XC3S200-4FTG256I is a Spartan-3 family field programmable gate array (FPGA) offering 200,000 system gates and 4,320 logic cells in a 256-ball FineLine BGA (FTG256) package, with a 1.2V core voltage, industrial temperature rating of -40C to +100C, and a -4 speed grade supporting internal performance up to approximately 630 MHz. A field programmable gate array is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O blocks that the designer configures after manufacturing. FPGAs sit within the broader programmable logic hierarchy: CLB -> FPGA -> programmable logic device -> digital IC. Unlike fixed-function ASICs, FPGAs allow field reprogramming, making them ideal for prototyping, low-to-medium volume production, and designs requiring in-service updates. Key features of the XC3S200 include 2,160 slices built on a 90nm process technology, 12 blocks of 18Kbit block RAM totaling 216 Kbits of embedded dual-port memory, four 18x18 hardware multipliers for DSP operations, a Digital Clock Manager (DCM) for clock deskew and frequency synthesis, and up to 173 user I/Os supporting multiple I/O standards such as LVTTL, LVCMOS, SSTL, and LVDS on bank-selectable VCCO rails. Technically, the Spartan-3 fabric uses a four-input lookup table (LUT) per slice logic cell with dedicated fast carry logic for arithmetic chains. The -4 speed grade denotes the fastest standard commercial/industrial timing bin of the Spartan-3 family. Configuration is performed via serial or parallel PROMs (Xilinx Platform Flash) in Master/Slave Serial or SelectMAP modes with JTAG boundary-scan support per IEEE 1149.1. Typical applications include industrial control and motor drive logic, communication protocol bridging, test and measurement instrumentation, and embedded coprocessing with the hardware multipliers for modest DSP tasks. The 17x17mm FTBGA footprint suits space-constrained boards requiring high I/O density. A key design consideration is power: the 1.2V core requires a dedicated regulator, and I/O bank VCCO supplies must match the connected logic standards; total power scales with clock frequency and toggle rates, so use the Xilinx power estimator early in design. This page synthesizes verified distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.

RFQ צור קשר
XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx
XC3S200-4PQ208C

XC3S200-4PQ208C - 200K Spartan-3 FPGA | AMD / Xilinx

The AMD / Xilinx XC3S200-4PQ208C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 480 configurable logic blocks, and 221,184 RAM bits in a 208-pin PQFP package. It operates from a 1.2 V core supply and is specified for the commercial temperature range of 0°C to 85°C. A field-programmable gate array is a semiconductor whose digital logic, memory, and I/O paths are configured after manufacture. Within the product hierarchy, the XC3S200-4PQ208C is an FPGA, then a programmable-logic device, and ultimately a semiconductor. Compared with fixed-function logic ICs, an FPGA lets engineers implement parallel processing, control, communications, and signal-generation functions in one reconfigurable device while retaining the same package and pinout across design revisions. The supplied product data identifies 141 I/O, 4,320 logic cells, 480 CLBs, 221,184 RAM bits, and 200,000 system gates. The “-4” speed designation and an associated listing report 630 MHz performance, while the commercial “C” suffix identifies the specified temperature grade. Its 208-pin PQFP package exposes substantially more device I/O than the smaller 100-pin Spartan-3A options, making it suitable for designs with wider external buses or more peripheral connections. The XC3S200-4PQ208C fits industrial control, communications infrastructure, embedded instrumentation, video processing, test equipment, and legacy embedded systems. A practical design can use its programmable logic for parallel data acquisition, protocol conversion, signal conditioning, and supervisory control while retaining configuration data in external nonvolatile flash. Engineers should verify every power rail, configuration interface, and high-speed I/O constraint against the complete Spartan-3 documentation before layout release. Power and termination design remain central to reliable FPGA implementation. Provide the specified core and I/O supplies, route each supply through its documented decoupling network, and use a configuration scheme that matches the board’s flash and control logic. Because the supplied excerpts do not provide full electrical limits, pin assignments, or power-budget data, those details require confirmation from the manufacturer’s official Spartan-3 documentation before schematic completion. This page consolidates verified distributor specifications, same-package family comparisons, commercial availability references, and application-specific engineering guidance. It distinguishes the XC3S200-4PQ208C from smaller Spartan-3 packages and higher-density PQFP208 devices, helping engineers determine whether the device’s logic, memory, I/O, and thermal requirements align with an existing 208-pin PCB design.

RFQ צור קשר
XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-4PQ208I

XC3S200-4PQ208I - 200K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4PQ208I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 141 user I/O, and a stated 630 MHz performance figure, supplied in a 208-pin PQFP package. The device operates from a 1.2 V core supply and is built on 90 nm CMOS process technology. Its -4 speed designation identifies a performance grade, while the PQ208 suffix denotes the 208-pin plastic quad flat package and I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable semiconductor in which digital logic, interfaces, and system functions are configured after manufacture. Within the product hierarchy, an FPGA is a semiconductor and a programmable logic device. The Spartan-3 family targets cost-sensitive designs requiring more flexibility than fixed-function logic, while providing configurable logic blocks, dedicated arithmetic resources, block RAM, and programmable I/O within one integrated device. The XC3S200-4PQ208I combines 480 configurable logic blocks with 4,320 logic cells and 141 user I/O according to the supplied manufacturer-family data. Its 200,000-system-gate count describes the family device's logic-equivalent capacity rather than a fixed gate count. The 630 MHz figure likewise requires careful interpretation because achievable system performance depends on the selected design, timing constraints, clocking, I/O standards, routing, and the associated Xilinx toolchain. The 90 nm Spartan-3 architecture supports integration of control logic, data acquisition, communications glue logic, state machines, and modest parallel-processing functions. Reconfigurability allows design revisions to be implemented in the FPGA bitstream rather than through a PCB respin. Dedicated block RAM can buffer sampled or packet data, while programmable I/O can connect the device to external clocks, data buses, transceivers, displays, and industrial interfaces subject to voltage and timing constraints. Typical uses include industrial automation, programmable logic controllers, motor-control and sensor-processing systems, embedded communications, instrumentation, and cost-sensitive consumer or control electronics. The 208-pin PQFP provides more I/O than a small FPGA package, making it useful where parallel external buses, control signals, or multiple interfaces must coexist with the Spartan-3 logic fabric. Design planning should begin with the AMD/Xilinx Spartan-3 datasheet and the appropriate ISE or Vivado-era design flow for the installed device family. Verify the exact pinout, supported I/O standards, configuration requirements, decoupling, clock topology, and exposed thermal and power constraints on the selected package before layout release. This page consolidates verified distributor specifications, pricing references, same-family drop-in candidates, and practical selection considerations for engineers evaluating the XC3S200-4PQ208I.

RFQ צור קשר
XC3S200-4PQG208I - 200K Gate Spartan-3 FPGA, 208-Pin PQFP | AMD
XC3S200-4PQG208I

XC3S200-4PQG208I - 200K Gate Spartan-3 FPGA, 208-Pin PQFP | AMD

The AMD (Xilinx) XC3S200-4PQG208I is a Spartan-3 Field-Programmable Gate Array (FPGA) delivering 200,000 system gates and 4,320 logic cells in a 208-pin PQFP (BFQFP) package, with 141 user I/O pins, a 630 MHz internal clock and a 1.2 V core supply built on 90 nm CMOS technology. The -4 suffix denotes the 4 ns speed grade and the I suffix denotes the extended industrial temperature grade. A field-programmable gate array is a reconfigurable digital integrated circuit whose logic fabric, interconnect and I/O blocks are defined by a bitstream loaded from a serial configuration memory. Spartan-3 sits in the low-cost FPGA tier of the hierarchy FPGA > programmable logic > reconfigurable semiconductor, aimed at volume cost-sensitive designs rather than maximum performance. Key features of this device include 4,320 logic cells organized as 480 configurable logic blocks, 4,320 flip-flops, 20 dedicated block RAM of 18 Kbit each, and 20 dedicated 18x18 multiplier blocks for DSP-style arithmetic. The fabric delivers 630 MHz performance on the -4 speed grade while consuming only 1.2 V at the core, which simplifies thermal design in industrial enclosures. Technically the device combines a 90 nm CMOS process with a selectively-bonded 200,000-gate architecture, 141 user I/O, four 6 Mbit block RAM resources scaled to the 4320-cell configuration, and dedicated multiplier/adder logic. Configuration is by bitstream from standard SPI or parallel PROG flash, and the device supports readback, boundary scan (JTAG) and MultiBoot reconfiguration for field updates. Typical applications include industrial automation and PLC control logic, motor drive and servo sequencing, sensor signal pre-processing, industrial networking gateways, embedded display control, and low-cost instrumentation front ends where a 208-pin PQFP avoids fine-pitch BGA assembly costs. A key design consideration is that the Spartan-3 family is a mature, mature-node technology: verify supply continuity and any migration path to a newer family before starting a long-volume program, and reserve PCB footprint space for the PQFP thermal and pin-1 orientation requirements. This page brings together the manufacturer and distributor specification set, a qualified drop-in alternative list, and practical design notes covering configuration, decoupling, JTAG access and footprint handling that are not consolidated in a single datasheet.

RFQ צור קשר
XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx
XC3S200-4TQ144C

XC3S200-4TQ144C - 200K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S200-4TQ144C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 97 I/Os, a 1.2 V core supply, and a 144-pin TQFP package. It is a -4 speed-grade device specified for a commercial operating temperature range of 0°C to 85°C. The configurable logic and dedicated input/output resources make it a practical FPGA platform for embedded control, parallel data processing, industrial automation, communication interfaces, and cost-sensitive custom digital systems. An FPGA is a user-programmable semiconductor in the broader integrated-circuit hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, programmable interconnect, memory resources, and I/O blocks into a device whose digital behavior can be defined after manufacture. The Spartan-3 architecture is part of the FPGA and programmable-logic-device family, offering a practical balance between logic capacity, I/O availability, device cost, and design flexibility. The XC3S200-4TQ144C provides 192 adaptive logic modules, which are organized into 4,320 logic cells. Its 97 available I/Os allow connections to external memory, sensors, communications transceivers, display controllers, and general-purpose digital peripherals. The verified family data identifies a maximum frequency of 725 MHz for the -4 device, while the exact AC timing limits for each I/O standard must be selected from the manufacturer datasheet. A 1.2 V core supply is typical for this 90 nm Spartan-3 generation, with auxiliary supply requirements depending on the selected I/O standards. The TQFP-144 package is a surface-mount plastic quad flat package that offers substantially more I/O than a compact QFP, while remaining easier to assemble and inspect than a large BGA. Its 144 leads include power, ground, configuration, clock, and user I/O functions. Exact lead assignments, configuration pins, and dedicated behavior depend on the package pinout and device datasheet, so board designers should use the official pin table rather than infer assignments from another package variant. Typical uses include industrial automation controllers, motor and motion-control logic, low-cost instrumentation, data acquisition, protocol bridging, educational FPGA platforms, and compact embedded systems that benefit from parallel hardware acceleration. The Spartan-3 device can implement finite-state machines, DSP-oriented datapaths, parallel-to-serial conversion, and interface control concurrently, reducing reliance on multiple fixed-function components. The primary design consideration is timing closure. Engineers should establish the target clock, external memory interface, I/O standards, and pin assignments early, then use the Xilinx synthesis, implementation, and timing-analysis flow. Decoupling, ground-plane continuity, clock routing, and I/O standard compatibility should be reviewed against the manufacturer guidance before schematic release. This page combines verified device specifications, commercial availability data, same-package replacement candidates, and practical selection guidance. It also distinguishes confirmed values from parameters that still require review in the complete manufacturer datasheet, helping engineers avoid treating incomplete distributor metadata as a complete design specification.

RFQ צור קשר
XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP
XC3S200-4TQ144I

XC3S200-4TQ144I - 200K Gate Spartan-3 FPGA | AMD | TQFP

The AMD XC3S200-4TQ144I is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic elements, 221,184 bits of embedded RAM, and 97 I/O pins in a 144-pin TQFP package. The -4 speed grade is specified for operation up to 630 MHz, while the I suffix denotes the extended industrial-temperature option. The device uses a 90 nm process and operates from a 1.14 V to 1.26 V core supply. A Spartan-3 FPGA belongs to the configurable-logic hierarchy: FPGA > programmable logic device > field-programmable gate array > semiconductor. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA combines configurable logic blocks, block RAM, programmable I/O, dedicated clocking resources, and embedded hard processors in one reconfigurable device. This allows interface logic, control functions, and parallel data processing to be consolidated on a single PCB. The XC3S200-4TQ144I provides 4,320 four-input LUT-based logic elements and 221,184 embedded RAM bits. Verified listings identify 1,920 adaptive logic modules and 480 LAB/CLB resources for this device. Its 97 I/O pins support board-level connectivity, and the 144-lead TQFP package provides a surface-mount form factor compatible with conventional PCB assembly and inspection processes. The 90 nm Spartan-3 architecture combines programmable logic with dedicated block RAM and programmable interconnect. It is intended for cost-sensitive embedded systems where parallel processing, flexible interfaces, and field reconfiguration provide more value than a fixed logic implementation. The 1.14 V to 1.26 V core range reflects the device's internally regulated core operation, while external I/O requirements remain part of the complete board power architecture. Typical uses include industrial control, embedded communications, instrumentation, data acquisition, display interfaces, and compact embedded processing systems. Its 4,320 logic elements and 221,184 RAM bits make it appropriate for protocol bridging, parallel-to-serial conversion, control-plane logic, and modest algorithmic workloads. Designs requiring substantially greater logic density or memory bandwidth should use a larger FPGA family. Designers should verify the exact pinout, configuration interface, I/O standards, clock requirements, and decoupling recommendations against the manufacturer datasheet before layout release. Because the TQFP package has fine-pitch leads, PCB assembly and inspection require suitable paste, stencil, placement, and inspection processes. Legacy-device supply status and configuration-memory interface compatibility also deserve review before new production commitments. This page consolidates verified distributor specifications, same-family drop-in candidates, practical design guidance, and parameter-level comparisons. It distinguishes confirmed electrical and packaging facts from information that could not be extracted from the supplied web records, helping engineers evaluate the XC3S200-4TQ144I without relying on ambiguous distributor summaries.

RFQ צור קשר
XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP
XC3S200-4VQ100C

XC3S200-4VQ100C - 200K Spartan-3 FPGA | AMD | 100-VQFP

The AMD/Xilinx XC3S200-4VQ100C is a Spartan-3 Field Programmable Gate Array (FPGA) with 200,000 system gates, 63 user I/O pins, and a 100-pin VQFP package. It operates from a 1.2 V FPGA supply and is specified for a 0 °C to 85 °C operating-temperature range. The device is intended for embedded programmable-logic applications where moderate logic density, surface-mount packaging, and a broad I/O count are more important than the very high performance of a large FPGA. An FPGA is a semiconductor whose digital logic, interconnect, and I/O behavior are configured after manufacture. The XC3S200-4VQ100C belongs to the Spartan-3 FPGA family, placing it in the broader hierarchy of programmable-logic device, FPGA, and semiconductor. Its 200,000 system gates provide a practical platform for control logic, interface bridging, signal conditioning, and embedded state-machine designs. The 100-pin VQFP package also supports conventional PCB assembly and inspection processes. The -4 speed designation identifies the device performance grade, while VQ100 identifies the 100-pin VQFP package and C identifies the commercial temperature grade. The listed electrical characteristics include 63 user I/O pins, a 1.14 V to 1.26 V core-supply range, and a 0 °C to 85 °C operating range. These figures define the principal design constraints for voltage regulation, thermal planning, signal-interface design, and industrial or commercial equipment. Typical uses include industrial control and automation modules, communications-interface adapters, embedded test equipment, and low-to-medium complexity digital systems. The FPGA can implement parallel logic, state machines, counters, protocol front ends, and control functions in one configurable device. Engineers should confirm that the selected design does not require more logic resources, I/O, clocking, or memory than the available device resources provide. The most important design consideration is ensuring that the 1.2 V core rail is generated with adequate tolerance and decoupling, while all connected I/O structures remain compatible with the target board voltage levels. Because this is a surface-mount VQFP package, solderability, pin-1 orientation, assembly profile, and thermal performance should be reviewed against the selected PCB footprint and manufacturing process. This page consolidates distributor availability, verified device parameters, package information, and practical FPGA selection guidance. It also distinguishes exact drop-in alternatives from upgrade candidates so engineers can assess PCB reuse without confusing package compatibility with complete functional equivalence.

RFQ צור קשר
XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD
XC3S200-4VQ100I

XC3S200-4VQ100I - 200K Gate Spartan-3 FPGA | AMD

AMD XC3S200-4VQ100I is a Spartan-3 field-programmable gate array with 200000 system gates, 4320 logic elements, a 1.2 V supply, and a 100-pin TQFP package. The device combines programmable logic, block RAM, and dedicated multiplier resources in a compact 14 mm × 14 mm surface-mount package. Its industrial-oriented ordering suffix supports use in embedded control, communications, instrumentation, and industrial automation systems where deterministic programmable logic is required. A Spartan-3 FPGA is a reconfigurable digital semiconductor in the FPGA and CPLD product hierarchy. Unlike a fixed-function microcontroller or application-specific integrated circuit, an FPGA allows engineers to define parallel logic, state machines, interfaces, and data-processing functions in hardware. Its configurable interconnect routes signals among logic cells, dedicated block RAM, multipliers, and general-purpose I/O, making the device suitable for designs requiring deterministic timing and flexible hardware architecture. The XC3S200-4VQ100I provides 200000 system gates and 4320 logic elements according to distributor listings. The family-level product information also identifies 12 block RAMs, 12 multipliers, and 4 digital clock managers for designs requiring embedded memory, dedicated arithmetic, and clock-management resources. Its 1.2 V core supply and 100-pin TQFP package provide a practical balance between capability, I/O access, and board footprint. The “-4” portion identifies the device speed grade, while “VQ100” identifies the 100-pin package configuration and “I” identifies the industrial temperature grade. These ordering codes allow procurement teams to distinguish devices that otherwise belong to the same Spartan-3 family. Because FPGA designs depend on the configuration file, device speed, pinout, memory resources, and supported I/O standards, engineers should verify the exact ordering code against the AMD/Xilinx datasheet and board constraints before substitution. Typical uses include industrial control logic, low-latency communication interfaces, data acquisition, embedded signal processing, test equipment, and general-purpose embedded systems. The 100-pin package is particularly useful where a larger FPGA would be unnecessary and where external SDRAM or a high-pin-count BGA package would add unnecessary board complexity. Its integrated resources can reduce external logic-component count while retaining software-side reconfiguration flexibility. The primary design consideration is package-level resource and signal-integrity verification. The 100-TQFP footprint requires exact land-pattern, pin-orientation, and power-decoupling review before layout release. Engineers should also account for configuration memory, configuration interface, clocking, I/O voltage limits, unused pins, and startup behavior in the complete FPGA design rather than treating the FPGA only as a collection of logic blocks. This product page consolidates verified distributor specifications, package information, ordering-code details, sourcing links, and engineering guidance. It also distinguishes a genuine same-footprint replacement from a merely similar FPGA family member and records unknown technical values explicitly for engineers to confirm in the manufacturer datasheet.

RFQ צור קשר
XC3S200-4VQG100C - 200K Spartan-3 FPGA | AMD Xilinx
XC3S200-4VQG100C

XC3S200-4VQG100C - 200K Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S200-4VQG100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 I/Os, and a 1.2 V core operating from 0°C to 85°C. The device is packaged in a 100-pin VTQFP package and uses 90 nm FPGA technology. A field-programmable gate array, or FPGA, is a programmable semiconductor used to implement digital logic, control functions, signal processing, and interface logic. Within the semiconductor hierarchy, an FPGA is a configurable logic device that combines programmable logic blocks, programmable interconnect, and input/output resources. The Spartan-3 family was designed for cost-sensitive applications requiring substantial digital functionality without the complexity of a large processor system. The XC3S200-4VQG100C provides 4,320 logic cells, 221,184 gates, and 63 user I/Os. Its speed designation is -4, while the device is identified as a commercial-temperature grade part through the C suffix. The 100-pin VTQFP package provides a compact surface-mount option for boards requiring substantial logic density without moving to a larger fine-pitch or ball-grid-array package. The device is based on 90 nm FPGA technology and is specified at a 1.2 V core voltage. Within the Spartan-3 architecture, programmable logic blocks implement combinational and sequential functions, while programmable routing connects those functions and the available I/O resources. The 4,320-cell configuration supports designs involving parallel data processing, state machines, protocol bridging, control logic, and moderate-width data acquisition. Typical applications include industrial automation, communications equipment, consumer electronics, embedded control, video-processing subsystems, and general-purpose digital interface logic. The 63-I/O configuration is particularly relevant to designs that connect parallel buses, control peripherals, capture external signals, or bridge communication modules. A complete design still requires suitable configuration memory, decoupling, clocking, and I/O voltage planning. For PCB implementation, preserve the pin arrangement and exposed package geometry of the 100-pin VTQFP footprint, and follow the manufacturer pin-description table when assigning I/O standards. Confirm that every external interface uses a supported voltage, that configuration pins are terminated correctly, and that power-supply sequencing matches the device requirements before releasing the design for production. This product page combines the key Spartan-3 device characteristics, package information, replacement analysis, application guidance, and practical design notes. It is intended to accelerate component selection, PCB planning, firmware preparation, and lifecycle review for engineers working with the AMD Xilinx Spartan-3 FPGA family.

RFQ צור קשר
XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA
XC3S200-5FT256C

XC3S200-5FT256C - 200K Gate 1.2V FPGA | AMD | 256-LBGA

The AMD XC3S200-5FT256C is a Spartan-3 field-programmable gate array with 200,000 system gates, 192 logic cells, and a 1.2 V supply in a 256-LBGA package. The -5 speed designation identifies the device performance grade, while the FT256C suffix identifies the lead-free commercial package variant. Its operating temperature range is 0°C to 85°C, making it suitable for cost-sensitive embedded systems that require programmable logic without the resources of a larger FPGA. A field-programmable gate array is a semiconductor whose digital logic and interconnect are configured after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, which includes CPLDs, mask-programmed devices, and application-specific programmable logic. The Spartan-3 architecture combines configurable logic, memory resources, dedicated input/output structures, and programmable interconnect, allowing a designer to implement multiple control, interface, datapath, and signal-processing functions in one device. The XC3S200-5FT256C provides 50,000 system gates according to one distributor listing and 200,000 system gates according to Mouser and Partstack. The verified sources also report 192 logic cells, a 1.2 V FPGA supply, a 256-LBGA package, 256 terminals, and a square package shape. These source differences should be resolved against the applicable AMD Spartan-3 family data sheet before final design release. Because the device belongs to the Spartan-3 generation, engineers should treat it as a legacy programmable-logic platform and validate toolchain availability, configuration method, I/O standards, timing, and sourcing before beginning a new production design. The operating range of 0°C to 85°C distinguishes it from extended-temperature variants. Its 256-ball land-grid-array package also requires a PCB footprint and assembly process capable of handling fine-pitch balls, while configuration storage, clocking, decoupling, and I/O voltage planning remain central implementation concerns. Typical uses include industrial control and factory automation, embedded instrumentation, communications interfaces, display and video control, consumer products, and general-purpose digital signal processing. The Spartan-3 family was specifically positioned for high-volume, cost-sensitive consumer electronic applications, but individual designs still require complete timing, thermal, signal-integrity, and configuration verification. The principal design caution is that a replacement FPGA must match the package, ball assignment, supported I/O standards, voltage requirements, configuration interface, and timing constraints. A device with the same family name or logic density is not automatically pin-compatible. Migration decisions should therefore use AMD pinout data, device-generation constraints, and design-tool checks rather than relying only on distributor similarity labels. This page consolidates the verified distributor and manufacturer references for the XC3S200-5FT256C, distinguishes verified characteristics from parameters requiring confirmation, and provides migration, sourcing, and application guidance that is not present in a basic distributor listing.

RFQ צור קשר
XC3S200-5FTG256C - Spartan-3 FPGA 200K Gates 256-LBGA | AMD
XC3S200-5FTG256C

XC3S200-5FTG256C - Spartan-3 FPGA 200K Gates 256-LBGA | AMD

The AMD XC3S200-5FTG256C is a Spartan-3 Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,320 logic cells, 1.2 V core supply, and a 256-LBGA package. It is designed for cost-sensitive programmable-logic applications that require a dense, low-power FPGA in a surface-mount package. A Field Programmable Gate Array is a reconfigurable digital integrated circuit containing configurable logic blocks, programmable interconnect, and input/output blocks. FPGA terminology follows a hierarchy from programmable logic device to field-programmable gate array, providing designers with hardware parallelism that can implement control logic, data acquisition, signal processing, and communication functions without relying on a fixed-function ASIC. The XC3S200-5FTG256C combines 200,000 system gates with 4,320 logic cells and supports a 725 MHz maximum operating frequency according to its device listing. The -5 speed designation identifies the device speed grade, while the FTG256C package code identifies the lead-free 256-ball surface-mount package and commercial temperature grade. The device operates from a 1.2 V core supply and is specified for 0 to 85 C operation. The Spartan-3 architecture provides programmable logic, block RAM, dedicated multipliers, and general-purpose I/O in a single device. These resources support parallel datapath designs such as protocol bridges, industrial controllers, video timing systems, and embedded network equipment. Because the device is a mature 90 nm FPGA, design flows should follow the Spartan-3 toolchain and the configuration requirements documented for the platform. Typical applications include industrial automation, motor and motion control, telecommunications line-card support, data acquisition, test equipment, and embedded control platforms. The 256-LBGA package offers a high pin count for parallel interfaces, but it requires careful PCB layout with short escape routes, solid power distribution, and decoupling close to every supply pin. For new designs, verify the available configuration PROM and programming cable before committing the layout, because configuration memory availability can constrain production schedules. A complete migration should also be checked for I/O standard, timing, and configuration-pin compatibility rather than package similarity alone. This page consolidates device specifications, package details, verified source links, practical application guidance, and drop-in alternatives that are not collected in a single manufacturer datasheet excerpt.

RFQ צור קשר
XC3S200-5PQG208C - 200K Gate Spartan-3 FPGA | AMD
XC3S200-5PQG208C

XC3S200-5PQG208C - 200K Gate Spartan-3 FPGA | AMD

The AMD XC3S200-5PQG208C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 configurable logic elements, 141 user I/O pins, and 221,184 RAM bits in a 208-pin PQFP package. It uses a 1.2 V core supply, a 90 nm process technology, and a -5 speed grade for designs requiring up to 725 MHz performance. A field-programmable gate array, or FPGA, is a programmable logic semiconductor whose configurable lookup tables, flip-flops, interconnects, block RAM, and I/O resources can be tailored after manufacture. An FPGA belongs to the broader programmable-logic hierarchy, alongside complex programmable logic devices, and provides parallel hardware implementation for control, interface, signal-processing, and data-transfer functions. The Spartan-3 family targets cost-sensitive embedded systems that need more flexibility than fixed logic without the complexity of larger devices. The XC3S200-5PQG208C combines a mid-density Spartan-3 fabric with 141 user I/O in a surface-mount PQFP-208 package. Its 4,320 configurable logic elements provide substantial parallelism, while 221,184 RAM bits support on-chip buffering and data storage. The 141 available I/O pins make the device particularly useful for legacy parallel buses, control interfaces, display or sensor links, and industrial equipment requiring numerous external connections. The -5 designation identifies the performance grade used in the part number. Published device information lists the maximum performance figure as 725 MHz, making this grade appropriate for designs whose timing budget cannot tolerate the slower -4 grade. The C suffix denotes the commercial-temperature qualification shown for the device, with an operating junction-temperature range from 0°C to 85°C. Typical uses include industrial automation, embedded control, video timing, general-purpose interface bridging, low-cost instrumentation, and FPGA-based prototype platforms. The large PQFP footprint is easier to inspect and rework than very dense BGAs, which can simplify prototype assembly, laboratory bring-up, and field servicing where high pin counts remain manageable. When laying out the board, follow the manufacturer pinout and decoupling guidance rather than assigning signals from a generic 208-pin footprint. Account for configuration-interface access, programming pins, supply sequencing, clock requirements, and I/O standards. Because the -4 and -5 parts share a package, timing closure must be revalidated when changing speed grades even when the PCB remains unchanged. This page combines the device specifications, package details, compatible Spartan-3 replacements, and implementation guidance needed to plan a board revision or evaluate a second source. It also distinguishes speed-grade and temperature-grade substitutions from higher-density devices that may use the same mechanical package.

RFQ צור קשר
XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx
XC3S200-5VQ100C

XC3S200-5VQ100C - 200K Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S200-5VQ100C is a Spartan-3 field-programmable gate array with 200,000 system gates, 4,320 logic cells, 63 user I/O pins, and 221,184 RAM bits, supplied in a 100-pin TQFP package. It operates from a 1.2 V supply and is specified for a 0 to 85 °C operating temperature range. A field-programmable gate array is a programmable digital semiconductor that combines configurable logic, programmable interconnect, and memory resources in one device. In the broader semiconductor hierarchy, an FPGA belongs to programmable logic devices and provides a hardware alternative to implementing a fixed function in an application-specific integrated circuit. The Spartan-3 family was designed for cost-sensitive embedded, industrial, consumer, and communication systems. The XC3S200-5VQ100C provides 4,320 logic cells and 221,184 RAM bits for parallel datapaths, control logic, state machines, and interface conditioning. Its 63 user I/O pins provide connections to external memory, sensors, converters, communication transceivers, and display or control peripherals. The -5 speed designation identifies the device's performance grade, while the commercial C temperature designation corresponds to the stated 0 to 85 °C range. The device uses a 1.2 V core supply, making power-supply design important in compact embedded systems. Available details confirm 200,000 system gates, 4,320 logic cells, 63 I/O pins, 221,184 RAM bits, and a 100-TQFP package. Additional detailed information such as exact I/O standards, configuration interface characteristics, and recommended operating limits is not present in the supplied verified records and must be confirmed from the manufacturer datasheet before design release. Typical uses include industrial controllers, embedded control systems, video and image-processing front ends, communication equipment, and consumer electronics. In each case, the Spartan-3 architecture permits logic and memory functions to be updated in the field, reducing the need for a custom ASIC in moderate-volume designs. Designers should preserve the manufacturer's recommended power and decoupling arrangement, validate every I/O voltage and bank configuration, and account for configuration-pin requirements during power-up. Because the supplied records do not include a complete verified pin table, the package drawing is represented by the generic library key rather than an invented pinout. This page combines the verified distributor specifications, packaging information, source links, and drop-in alternatives. It also distinguishes directly comparable speed-grade parts from larger-package or functionally similar devices that cannot replace the target without PCB changes.

RFQ צור קשר
XC3S2000-4FG900I - 2M-Gate Spartan-3 FPGA | AMD Xilinx
XC3S2000-4FG900I

XC3S2000-4FG900I - 2M-Gate Spartan-3 FPGA | AMD Xilinx

The AMD Xilinx XC3S2000-4FG900I is a Spartan-3 field-programmable gate array with 2,000,000 system gates, 46,080 logic cells, 565 I/O, and a 1.2 V supply in a 900-ball BGA package. The -4 speed designation places it in the device family’s -4 performance grade, while the I suffix identifies the industrial temperature option. A field-programmable gate array is a programmable digital semiconductor in which configurable logic blocks, programmable interconnect, and input/output resources implement digital systems. An FPGA belongs to the broader hierarchy of programmable logic devices, alongside CPLDs, and provides substantially greater logic capacity. The Spartan-3 architecture combines configurable logic, block RAM, dedicated DSP resources, programmable I/O, and on-chip support for clocking and configuration. The XC3S2000-4FG900I’s headline resources are 2,000,000 system gates, 46,080 logic cells, 565 I/O, and a 900-ball BGA package. Its 1.2 V core supply suits low-voltage digital systems where board-area efficiency and high I/O density are priorities. The large ball-grid array also supports dense connections between programmable resources and external circuitry without relying on a larger leaded package. Within the Spartan-3 family, the -4 speed grade provides a defined balance between logic performance and device organization. Exact maximum clock rates depend on the selected design, I/O standard, speed grade, timing constraints, and tool version. Because an FPGA’s usable performance is determined by the routed critical path rather than a single headline frequency, timing closure must be completed with the appropriate synthesis and implementation constraints. Typical uses include network-interface control, industrial automation, communications equipment, embedded video processing, instrumentation, and general-purpose digital signal-processing systems. A design requiring parallel interfaces, substantial logic density, moderate-to-high-speed serial links, and deterministic embedded control can benefit from combining programmable logic, block RAM, DSP, and dedicated I/O in one device. A 900-ball BGA requires careful PCB planning, including a multilayer board with controlled-impedance routing, via access beneath the device, adequate power and ground distribution, and assembly-process compatibility. Designers should also verify configuration logic, memory-interface topology, I/O standards, voltage tolerances, thermal performance, and pin constraints in the manufacturer datasheet before schematic capture and layout release. This product page consolidates the device’s principal architecture, package, and application information with engineering-focused comparison data and design guidance. It is intended to help engineers confirm fit, plan the PCB, and assess Spartan-3 alternatives without treating package similarity alone as proof of drop-in compatibility.

RFQ צור קשר
XC3S200A-4FT256I - 200K Spartan-3A FPGA | AMD Xilinx
XC3S200A-4FT256I

XC3S200A-4FT256I - 200K Spartan-3A FPGA | AMD Xilinx

The AMD Xilinx XC3S200A-4FT256I is a Spartan-3A field-programmable gate array with 4,032 configurable logic cells, approximately 200,000 logic gates, 195 user I/Os, and 294,912 RAM bits in a 256-ball FT256 BGA package. It uses 90 nm fabrication technology, operates from a 1.2 V core, and is identified with a 667 MHz maximum device speed grade. A field-programmable gate array is a programmable logic device whose digital functions are established by loading a configuration bitstream rather than permanently connecting transistors. The Spartan-3A family belongs to the FPGA hierarchy, combining programmable logic, dedicated memory resources, digital signal-processing capability, and general-purpose I/O. This makes the device suitable for designs that benefit from hardware parallelism, reconfigurability, short development cycles, and integration of multiple digital functions on one device. The XC3S200A provides 4,032 logic cells and 195 user I/Os, providing substantial connectivity for control logic, interfaces, arithmetic pipelines, and embedded state machines. Its 294,912 RAM bits provide dedicated block storage without consuming the same resources needed for general combinational logic. The -4 suffix denotes a performance speed option, while the I suffix identifies the industrial temperature grade. The 256-ball FT256 package supports compact, high-density board layouts through ball-grid-array interconnect. The XC3S200A architecture is based on 90 nm CMOS technology and a 1.2 V core supply. Its logic is organized into configurable slices containing combinational and sequential resources, while dedicated block RAM supports higher-density storage than distributed RAM alone. Dedicated multipliers and digital signal-processing resources can accelerate filtering, transforms, and fixed-point arithmetic when the design and synthesis toolchain use them appropriately. Typical applications include industrial control, communications interfaces, data acquisition, instrumentation, embedded signal processing, and general-purpose digital prototyping. Its 195 I/Os are useful for parallel sensor interfaces, display or control peripherals, high-speed communication logic, and system bus coordination. The FPGA architecture is especially helpful where parallel processing, reconfigurable logic, or deterministic digital control must be consolidated into a compact implementation. A key design consideration is the complete Spartan-3A power, configuration, clocking, and decoupling plan. Board design must provide the specified core and I/O supplies, a valid configuration path, compatible clocking, and clean power delivery to the FT256 package. Because the device is a mature programmable platform, toolchain version and legacy bitstream compatibility should also be confirmed before an update to production. This page consolidates the device identity, package details, application guidance, design considerations, and technically constrained replacement information into an engineering-focused reference. It emphasizes the limits of package and temperature substitution so that a proposed replacement is reviewed as a true board-level decision rather than selected from a family name alone.

RFQ צור קשר
XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx
XC3S200A-4FTG256I

XC3S200A-4FTG256I - 200K Gate Spartan-3A FPGA, 195 I/O | AMD/Xilinx

The AMD/Xilinx XC3S200A-4FTG256I is a Spartan-3A family Field Programmable Gate Array (FPGA) with 200,000 system gates, 4,032 logic cells, and 195 user I/Os in a 256-ball FineLine Thin-profile BGA (FTG256) package at industrial temperature grade (I suffix). Built on 90nm CMOS technology with a 1.2V core, the device targets cost-sensitive, high-volume digital logic applications. An FPGA (Field Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardware blocks such as block RAM and multipliers. Within the broader semiconductor taxonomy, FPGAs sit alongside ASICs and CPLDs as reconfigurable logic; the Spartan-3A family is Xilinx's low-cost, high-volume segment designed for consumer, industrial, and communications glue-logic applications. Key specifications of the XC3S200A-4FTG256I include 448 Configurable Logic Blocks (CLBs), 288 Kbits of block RAM, up to 667 MHz maximum operating frequency (speed grade -4), dedicated 18x18 hardware multipliers for DSP, and a Digital Clock Manager (DCM) block for clock synthesis. The FTG256 package measures 17x17 mm and uses a 1.0 mm ball pitch. Architecturally, the Spartan-3A integrates CLBs arranged in rows and columns, surrounded by IOBs (I/O blocks), with block RAM columns interleaved, four DCMs, and dedicated multiplier blocks. The device supports multiple I/O standards including LVTTL, LVCMOS, LVDS, and differential HSTL/SSTL for direct interface to external memories and high-speed peripherals. Typical applications include industrial control and machine vision, consumer electronics display controllers, communications protocol bridges, low-cost video processing, motor control, and educational/hobbyist development boards. The wide operating temperature range (-40C to +100C industrial grade) also suits factory automation and outdoor equipment. Designers should pay attention to the FTG256 ball-pinout for PCB layout: a 256-ball BGA with 1.0 mm pitch requires 4-6 layer PCB design with microvia or via-in-pad technology for reliable assembly. Use Xilinx ISE WebPACK or the modern AMD Vivado/Vivado Lab Edition for configuration bitstream generation. Power estimation should be performed with the Xilinx Power Estimator (XPE) tool before finalizing thermal management. This page consolidates current distributor pricing, verified pin-compatible drop-in alternatives in the Spartan-3A family, and practical design notes - practical context not found in the bare manufacturer datasheet.

RFQ צור קשר
XC3S200A-4VQ100I - 200K Gate Spartan-3A FPGA | AMD
XC3S200A-4VQ100I

XC3S200A-4VQ100I - 200K Gate Spartan-3A FPGA | AMD

The AMD Xilinx XC3S200A-4VQ100I is a Spartan-3A field-programmable gate array with 4,032 logic cells, 294,912 system gates, 68 I/O, and a maximum advertised clock frequency of 667 MHz. The device is manufactured using 90 nm FPGA technology, operates from a 1.2 V core supply, and is packaged in a 100-pin TQFP for surface-mount PCB assembly. An FPGA is a programmable-logic semiconductor that combines configurable logic, memory, and digital input/output resources on one integrated circuit. The Spartan-3A family belongs to the FPGA hierarchy, where programmable logic provides a hardware implementation path for control, interface, signal-processing, and communication functions. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reconfigured during design, debug, or upgrade phases. The XC3S200A-4VQ100I combines a 200K-gate device class with 4,032 logic cells and 68 available I/O. Its -4 speed designation identifies a performance grade, while the industrial-temperature suffix supports use in industrial environments. The 100-pin TQFP package provides a compact, leaded surface-mount option for designs using conventional PCB assembly and inspection processes. The Spartan-3A architecture integrates programmable logic blocks, dedicated block RAM resources, digital signal-processing capability, and programmable I/O structures. These resources allow parallel data paths, state machines, protocol interfaces, and control functions to be implemented in hardware. The 667 MHz maximum frequency is a headline device figure and should be treated as a timing-class reference rather than a guaranteed operating frequency for every routed design. Typical uses include industrial control systems, embedded instrumentation, legacy video and communications interfaces, peripheral controllers, and general-purpose digital logic platforms. Its 68 I/O provide connectivity for buses, status signals, clocks, resets, and external converters. The 1.2 V core architecture also makes careful rail design and decoupling essential when integrating the FPGA with modern mixed-signal or processor-based systems. PCB design should follow the manufacturer pinout and package information, with particular attention to supply pins, configuration pins, clock inputs, and exposed requirements for the selected board revision. Verify speed, temperature, and fitment requirements before committing a design to production. This product page combines the core Spartan-3A device data with package-aware alternatives, comparison parameters, and practical replacement guidance intended to accelerate engineering review and sourcing decisions.

RFQ צור קשר
XC3S250E-4VQ100C - 250K Gate Spartan-3E FPGA | AMD
XC3S250E-4VQ100C

XC3S250E-4VQ100C - 250K Gate Spartan-3E FPGA | AMD

The AMD XC3S250E-4VQ100C is a Spartan-3E field-programmable gate array with 250,000 system gates, 5,508 logic cells, 66 user I/O pins, and a 572 MHz maximum clock frequency in a 100-pin TQFP package. Designed for cost-sensitive programmable-logic applications, it combines 221,184 RAM bits with 612 logic array blocks and is manufactured using 90 nm CMOS technology at a 1.2 V core voltage. A field-programmable gate array is a semiconductor whose digital logic can be configured after fabrication. An FPGA belongs to the programmable-logic device hierarchy, where configuration memory, programmable logic blocks, block RAM, and programmable I/O implement parallel hardware functions. The Spartan-3E family targets consumer, communications, industrial, and embedded systems where a small FPGA provides more flexibility than fixed logic without the cost of the largest devices. The XC3S250E-4VQ100C provides 250,000 system gates, 5,508 configurable logic elements, 612 logic array blocks, and 221,184 total RAM bits. Its 66 user I/O pins support external interfaces, while the -4 speed grade is associated with a maximum clock frequency of 572 MHz. The 100-pin TQFP package uses a 0.5 mm pitch, allowing conventional surface-mount assembly while keeping the device physically smaller than many larger FPGA packages. The device is based on 90 nm CMOS technology and operates from a 1.2 V core supply. Its architecture supports parallel datapaths, control logic, communication interfaces, and general-purpose embedded processing implemented as programmable logic. Configuration data establishes the interconnection and logic functions, allowing one board design to support multiple firmware or configuration revisions without changing the PCB. Typical uses include industrial control, networking equipment, video and display interfaces, consumer electronics, test systems, and embedded protocol bridges. Its 66 I/O pins are useful for designs requiring a moderate number of external connections, while the 221,184-bit RAM resource can support buffering, packet storage, and state-machine data. The 572 MHz maximum clock supports demanding datapaths when device utilization and routing permit the target frequency. PCB design should reserve the Spartan-3E configuration interface, provide a stable 1.2 V supply, and follow the manufacturer's decoupling and pinout guidance. Designers migrating from another FPGA should treat the device as an obsolete architecture and verify timing, I/O standards, configuration behavior, and tool-chain compatibility before committing new production hardware. This product overview consolidates the core Spartan-3E architecture, pin and package information, application guidance, and confirmed same-package alternatives. It also highlights the migration considerations engineers should evaluate before selecting this legacy FPGA for an existing or new design.

RFQ צור קשר
XC3S400-4FG320C - 400K-Gate Spartan-3 FPGA | AMD Xilinx
XC3S400-4FG320C

XC3S400-4FG320C - 400K-Gate Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S400-4FG320C is a Spartan-3 field-programmable gate array with 400,000 system gates, 221 I/O, and a 1.2 V operating voltage, packaged in a 320-ball fine-pitch BGA. The -4 suffix identifies its device speed grade, while the commercial C suffix denotes the grade category indicated in the manufacturer part number. It is designed for cost-sensitive embedded systems requiring configurable logic, parallel processing, and flexible interface support. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic can be configured after manufacture. An FPGA sits above fixed-function logic in the hardware hierarchy: it combines programmable logic blocks, block RAM, programmable I/O, and dedicated configuration resources on one device. Unlike a microcontroller that executes firmware from nonvolatile memory, an FPGA implements digital circuits directly in its fabric, allowing parallel operation, deterministic latency, and custom hardware interfaces. The Spartan-3 XC3S400 provides 400,000 system gates, 221 user I/O, 294,912 flip-flops, and 8,064 configurable logic blocks. Its 1.2 V core voltage supports low-voltage, power-conscious digital designs. The device is particularly useful where several parallel datapaths must operate simultaneously or where interface timing must be controlled precisely by dedicated hardware rather than shared processor instructions. The XC3S400 architecture provides combinational and sequential logic resources, distributed and block memory, and programmable input/output structures. Distributed RAM supports small data buffers and lookup tables, while block RAM provides larger on-chip storage without external memory access. Dedicated clock-management and configuration resources allow the FPGA to implement counters, state machines, packet filters, arithmetic pipelines, bus bridges, and embedded control functions in parallel. Typical applications include industrial control and data acquisition, communications infrastructure, embedded vision, signal processing, and cost-sensitive consumer equipment. Its 221 I/O make it suitable for parallel sensors, converters, memory interfaces, displays, and communications transceivers. Designers can also partition the fabric into independent processing engines, allowing acquisition, filtering, and protocol handling to proceed concurrently. For a new design, verify device speed requirements, pin-bank voltage limits, configuration memory interface, clock topology, and termination requirements before committing the PCB. A migration to another Spartan-3 speed grade can preserve the package and pinout, but timing constraints and power behavior should be revalidated with the appropriate timing constraints. This page combines the confirmed device specifications, package characteristics, traceable source links, drop-in family alternatives, and practical engineering guidance to support component selection, schematic review, and legacy design maintenance.

RFQ צור קשר
XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx
XC3S400-4FG320I

XC3S400-4FG320I - 400K Gate Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FG320I is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, 294,912 RAM bits, and 221 user I/Os, packaged in a 19 mm × 19 mm 320-pin fine-pitch ball grid array. It operates from a 1.2 V core supply and is identified by the -4 performance grade and I industrial temperature designation. A field-programmable gate array, or FPGA, is a reconfigurable semiconductor in which digital logic and interconnects are programmed after manufacture. An FPGA belongs to the programmable-logic hierarchy, which combines parallel gate-level logic, block RAM, programmable I/O, and embedded processing resources. This combination allows one physical device to implement control logic, protocol interfaces, data acquisition, signal processing, or complete embedded systems without changing the printed circuit board. The XC3S400 provides 221 user I/Os for external buses, counters, serial links, memory interfaces, and mixed-signal control functions. Its 294,912 bits of block RAM support buffering, packet storage, lookup tables, and data-pipeline stages, while the -4 speed grade identifies its position within the Spartan-3 performance range. The industrial I suffix distinguishes it from commercial-temperature C variants. The 320-ball FBGA offers dense board connectivity but requires careful escape-routing, thermal analysis, and assembly control. Spartan-3 devices combine dedicated arithmetic and logic resources with programmable interconnect and a large selection of I/O standards. The 8,064 logic cells allow concurrent datapath and control operations, while block RAM avoids extensive use of logic for storage-heavy functions. Because the I/O count is fixed at 221 for the XC3S400, system planning must reserve enough pins for clocks, configuration access, power, ground, and high-speed interfaces. Typical uses include industrial automation, programmable logic controllers, sensor acquisition, motor-control interfaces, embedded communications, test equipment, and cost-sensitive control systems. The FPGA is especially useful where parallel logic, deterministic timing, configurable I/O, and field-updateable firmware must coexist in a compact package. Its 1.2 V core supply also allows modern low-voltage designs to consolidate multiple logic functions. PCB implementation should use the manufacturer's pinout and recommended layout guidance rather than a generic BGA fanout. Decoupling must be placed directly at the supply and ground balls, unused configuration pins must be handled exactly as specified, and every power ball must connect to the appropriate plane or via array. The high pin count also makes inspection, solderability, and thermal cycling important production considerations. This page combines the device's principal architecture and package data with same-family migration options, application guidance, and design checks. It focuses on the decisions that materially affect a Spartan-3 design: logic capacity, RAM, I/O availability, speed grade, temperature grade, package migration, configuration stability, and PCB implementation.

RFQ צור קשר
XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx
XC3S400-4FG456C

XC3S400-4FG456C - 400K Spartan-3 FPGA | AMD Xilinx

AMD Xilinx XC3S400-4FG456C is a Spartan-3 field-programmable gate array with 400,000 system gates, 294,912 logic cells, 8,064 dedicated block RAM bits, 264 I/O sites, and a 456-BBGA package. It operates from a 1.2 V core supply and targets logic-intensive embedded systems requiring programmable combinational and sequential logic, dedicated memory, and a large general-purpose I/O complement. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. The XC3S400 belongs to the Spartan-3 FPGA hierarchy, which combines configurable logic, block RAM, programmable I/O, and dedicated arithmetic resources on one device. This position between fixed-function ASICs and microcontrollers makes it suitable when a design needs hardware-level parallelism, flexible interfaces, or product-specific logic that would be expensive to implement in silicon. The -4 designator identifies a Spartan-3 performance grade, while FG456 identifies the 456-ball fine-pitch BGA package and C identifies the commercial temperature designation. The 456-BBGA footprint supports a high pin count and dense board routing, making the device appropriate for industrial control, communications, instrumentation, embedded processing, and legacy platform designs that already use the Spartan-3 package. Its large I/O count can reduce the need for external interface logic when connecting the FPGA to buses, converters, memories, and control signals. The device includes 294,912 logic cells and 8,064 bits of dedicated block RAM. These resources allow parallel datapaths, state machines, protocol handling, data acquisition, and control functions to be implemented concurrently rather than executed sequentially by a general-purpose processor. Programming is performed through the Xilinx configuration flow, while the final configuration determines which interconnect and logic resources are active. Designers should preserve the exact 456-BBGA land pattern, power architecture, decoupling strategy, configuration interface, and I/O constraints when replacing another programmable device. Because this package contains many fine-pitch balls, assembly and inspection require qualified PCB manufacturing processes and appropriate BGA assembly capability. Any modernization should begin with a pin, configuration, I/O-standard, and timing comparison rather than assuming that a newer FPGA is automatically interchangeable. This product page combines the device identity, verified ordering information, package details, same-family replacement candidates, and practical implementation guidance. It supports faster sourcing decisions while keeping the distinction clear between exact package-compatible options and newer devices that require redesign. The Request a Quote form on this page is the appropriate route for current commercial terms, lead time, and availability. Engineers should also consult the Spartan-3 DS099 family data sheet and the exact device ordering information before releasing a new PCB layout.

RFQ צור קשר
XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD
XC3S400-4FG456I

XC3S400-4FG456I - 400K Gate Industrial Spartan-3 FPGA | AMD

AMD XC3S400-4FG456I is an industrial-grade Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 logic cells, and 264 user I/Os, packaged in a 456-ball FBGA. It uses 90 nm fabrication technology, supports a 1.14 V to 1.26 V core supply, and is specified for an industrial junction-temperature range of -40°C to +100°C. The -4 speed designation identifies its performance grade, while the I suffix identifies the industrial temperature option. A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor that combines programmable logic, flip-flops, memory blocks, and programmable I/O in one device. An FPGA belongs to the broader semiconductor and programmable-logic hierarchy. Unlike a fixed-function application-specific integrated circuit, an FPGA can be reprogrammed during development to implement control logic, interfaces, signal processing, and system functions without changing the printed circuit board. The Spartan-3 architecture provides substantial parallelism for cost-sensitive embedded systems. The XC3S400-4FG456I provides 400,000 system gates and 8,064 logic cells, allowing multiple datapaths, state machines, protocol engines, and control blocks to operate concurrently. Its 264 user I/Os support connections to external memory, converters, transceivers, and display or industrial peripherals. The 456-ball FBGA also provides a high pin count for designs requiring substantial parallel connectivity. Operating from a 1.14 V to 1.26 V core supply, the device is designed for low-voltage digital logic implementations. The 90 nm process generation balances programmable capacity with moderate system cost. This architecture is useful where fixed logic would be inflexible, where product variants require field updates, or where parallel hardware processing provides lower latency than a microcontroller-based software implementation. Typical applications include industrial control, telecommunications interface equipment, embedded video processing, instrumentation, data acquisition, and communication infrastructure. The 264 I/O count is particularly useful for parallel sensor acquisition and external bus interfaces, while the programmable logic can implement filters, protocol conversion, clocking, and real-time control functions. Existing Spartan-3 intellectual property can also support designs requiring established hardware interfaces. PCB design must address the fine-pitch BGA routing and power requirements carefully. Follow the Spartan-3 pinout, ball map, recommended decoupling, and PCB-layout guidance in the manufacturer datasheet. Confirm configuration pin states, clocking topology, bank supply requirements, and I/O standards before fabrication because these constraints determine whether a new board can be assembled and operated reliably. This page combines the manufacturer-family documentation with package, logic-capacity, I/O, temperature, application, and migration guidance. It also distinguishes verified same-package alternatives from broader FPGA upgrade paths that require board redesign, helping engineers assess replacement options without overlooking configuration, timing, and pin-compatibility constraints.

RFQ צור קשר
XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD
XC3S400-4FT256C

XC3S400-4FT256C - 400K Gate Spartan-3 FPGA | AMD

AMD XC3S400-4FT256C is a Spartan-3 field-programmable gate array with 400,000 system gates, 8,064 configurable logic cells, 173 I/O, and a 1.2 V core supply, housed in a 256-LBGA package. The -4 suffix identifies the performance grade, while FT256 identifies the 256-ball surface-mount package offered in the verified distributor records. A field-programmable gate array, or FPGA, is a semiconductor whose digital logic is configured after manufacture. An FPGA belongs to the programmable-logic hierarchy, combining configurable logic blocks, programmable I/O, embedded memory, dedicated hard multipliers, and clock-management resources. This makes the Spartan-3 family useful when engineers need hardware-level parallelism, rapid design changes, or compact implementation of complex digital systems without committing to a custom application-specific integrated circuit. The verified listing identifies 400,000 system gates and 8,064 logic cells for the XC3S400 device. It provides 173 I/O in a 256-LBGA package and uses a 1.2 V core voltage. Related Spartan-3 data identifies 90 nm fabrication technology and a 630 MHz figure for the XC3S400-4FTG256C comparison variant; those values should not be transferred to XC3S400-4FT256C without confirmation from its own manufacturer datasheet. The device is suitable for parallel data processing, custom interface control, embedded signal processing, communications infrastructure, test equipment, and industrial control systems. Its 173 I/O permit substantial board-level connectivity, while the 8,064-cell logic resource supports parallel datapaths and state machines. The FT256 package can also simplify component density compared with larger leaded packages, but it requires careful PCB layout, thermal analysis, and BGA assembly capability. The commercial -4 grade is intended for cost-optimized designs rather than the extreme operating range implied by an industrial temperature suffix. Before releasing a design, engineers should verify the exact I/O standards, supported memory interfaces, configuration requirements, power-up behavior, and package pinout against the manufacturer documentation for XC3S400-4FT256C. A critical design consideration is that the FT256 package requires exact land-pattern, solder-mask, paste, via, and assembly-process control. Power rails and decoupling should be implemented according to the manufacturer's guidance, while configuration and programming interfaces should be checked for signal-integrity and termination requirements before layout signoff. This page consolidates verified distributor pricing, same-footprint Spartan-3 alternatives, application guidance, and design cautions that are not presented together on a manufacturer product page. It also distinguishes confirmed target-device facts from parameters that remain unavailable in the supplied source data.

RFQ צור קשר
XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx
XC3S400-4FT256I

XC3S400-4FT256I - 400K Gates Spartan-3 FPGA | Xilinx

The Xilinx XC3S400-4FT256I is a Spartan-3 field-programmable gate array providing 400,000 system gates, 8,064 logic cells, and 173 user I/Os in a 256-ball FTBGA package. The device operates from a 1.14 V to 1.26 V core supply, uses 90 nm process technology, and is specified for industrial-temperature operation from 0 °C to 85 °C. Its -4 speed grade supports operation up to 630 MHz according to the compared manufacturer-family specification in the provided web data. A field-programmable gate array is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured after fabrication. The Spartan-3 family belongs to the FPGA and programmable-logic hierarchy, providing configurable logic resources rather than a fixed instruction set. The XC3S400-4FT256I is intended for designs requiring substantial parallel logic, control, communications, or signal-processing functions while using a single highly integrated package. The main device characteristics include 400,000 system gates, 8,064 logic cells, 173 user I/Os, a 256-ball FTBGA package, and a 1.2 V nominal core supply. The listed family comparison identifies 90 nm technology and a 630 MHz performance figure for the XC3S400-4FT256I. Its industrial temperature range and lead-free package information make it relevant to industrial control, communications equipment, and embedded systems, although current availability and lifecycle status should be confirmed before new production commitments. The FTBGA package provides a dense connection arrangement for high-density programmable-logic designs. The 173 user I/Os can be assigned to digital interfaces, control signals, communications links, or mixed external circuitry, while the FPGA fabric allows parallel functions to be implemented with deterministic hardware timing. Unlike a microcontroller with a fixed peripheral architecture, the XC3S400-4FT256I allows system functions and interfaces to be defined during configuration, making it suitable for custom protocols, accelerators, and legacy system control logic. Typical applications include industrial automation controllers, communications equipment, embedded control systems, test and measurement platforms, and signal-processing modules. In these systems, the FPGA can implement parallel interfaces, protocol conversion, timing and sequencing functions, and custom hardware processing. The 400,000-system-gate density is substantially larger than small CPLDs, supporting multi-module designs while keeping the implementation in one programmable device. The primary design consideration is package-level integration. A 256-ball FTBGA requires careful PCB layout, via and escape-routing planning, thermal management, and assembly-process control. The core supply and I/O supply requirements, configuration interface, clocking, decoupling, and termination must follow the Spartan-3 device documentation. Because the XC3S400-4FT256I is associated with a discontinued-product notice in the provided AMD support result, engineers should preserve the exact MPN in legacy designs and evaluate any replacement against pinout, voltage, timing, and configuration compatibility. This product record combines verified distributor and manufacturer-search information with practical design guidance for industrial FPGA implementations. It highlights the density, logic-cell count, I/O count, package, voltage, temperature range, and source links while clearly separating confirmed data from specifications that require confirmation from the manufacturer datasheet.

RFQ צור קשר