XC3S200-4VQG100C - 200K Spartan-3 FPGA | AMD Xilinx
MPN: XC3S200-4VQG100C ✓ פעילXC3S200-4VQG100C סקירה
A field-programmable gate array, or FPGA, is a programmable semiconductor used to implement digital logic, control functions, signal processing, and interface logic. Within the semiconductor hierarchy, an FPGA is a configurable logic device that combines programmable logic blocks, programmable interconnect, and input/output resources. The Spartan-3 family was designed for cost-sensitive applications requiring substantial digital functionality without the complexity of a large processor system.
The XC3S200-4VQG100C provides 4,320 logic cells, 221,184 gates, and 63 user I/Os. Its speed designation is -4, while the device is identified as a commercial-temperature grade part through the C suffix. The 100-pin VTQFP package provides a compact surface-mount option for boards requiring substantial logic density without moving to a larger fine-pitch or ball-grid-array package.
The device is based on 90 nm FPGA technology and is specified at a 1.2 V core voltage. Within the Spartan-3 architecture, programmable logic blocks implement combinational and sequential functions, while programmable routing connects those functions and the available I/O resources. The 4,320-cell configuration supports designs involving parallel data processing, state machines, protocol bridging, control logic, and moderate-width data acquisition.
Typical applications include industrial automation, communications equipment, consumer electronics, embedded control, video-processing subsystems, and general-purpose digital interface logic. The 63-I/O configuration is particularly relevant to designs that connect parallel buses, control peripherals, capture external signals, or bridge communication modules. A complete design still requires suitable configuration memory, decoupling, clocking, and I/O voltage planning.
For PCB implementation, preserve the pin arrangement and exposed package geometry of the 100-pin VTQFP footprint, and follow the manufacturer pin-description table when assigning I/O standards. Confirm that every external interface uses a supported voltage, that configuration pins are terminated correctly, and that power-supply sequencing matches the device requirements before releasing the design for production.
This product page combines the key Spartan-3 device characteristics, package information, replacement analysis, application guidance, and practical design notes. It is intended to accelerate component selection, PCB planning, firmware preparation, and lifecycle review for engineers working with the AMD Xilinx Spartan-3 FPGA family.
חלופות תחליף ישיר עבור XC3S200-4VQG100C — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC3S200-4VQG100C (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, System Gates.
XC3S200-4VQG100I
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
XC3S200-5VQG100C
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
XC3S200-7VQG100C
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
XC3S200-2VQG100C
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
XC3S200-3VQG100C
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
XC3S200A-4VQG100C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC3S200-4VQG100C דירוגים מרביים ומאפיינים חשמליים
| Device Type | FPGA |
| FPGA Family | Spartan-3 |
| System Gates | 200,000 gates |
| Total Gates | 221,184 gates |
| Logic Cells | 4,320 cells |
| User I/O | 63 I/Os |
| תדר שעון מקסימלי | 630 MHz |
| Core Supply Voltage | 1.2 V |
| Process Technology | 90 nm |
| Package Type | 100-pin VTQFP |
| Package Pin Count | 100 pins |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | 0°C to 85°C |
| Speed Grade | -4 |
| Temperature Grade | Commercial |
| Programmability | Field-programmable logic |
מדריך תצורת פינים של XC3S200-4VQG100C 100 pins
תצורת פינים עבור XC3S200-4VQG100C (מארזת 100 pins). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC3S200-4VQG100C.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC3S200-4VQG100C מתאים עבור 6 יישוםs: Industrial Automation and Control, Communications Interface Equipment, Embedded Data Acquisition, Video Timing and Interface Logic, Consumer and Embedded Products, Programmable Test and Measurement.
Industrial Automation and Control
The XC3S200-4VQG100C fits compact industrial control boards that require configurable logic for sensor conditioning, sequencing, interlocks, and actuator coordination. Its 4,320 logic cells provide substantial capacity for parallel control paths and finite-state machines, while 63 user I/Os allow multiple external devices to be connected without immediately moving to a larger package. The 1.2 V core and 90 nm Spartan-3 architecture are appropriate for a cost-sensitive embedded control platform. Design the system around the specified 0°C to 85°C commercial range and validate timing against the -4 speed grade. Configuration storage, clock distribution, I/O voltage levels, and isolation requirements should be evaluated for each industrial enclosure.
מומלץ
Communications Interface Equipment
The AMD Xilinx XC3S200-4VQG100C can implement communications framing, buffering, protocol conversion, and supervisory state logic in a 100-pin VTQFP package. Its 4,320 logic cells are suitable for multiple parallel channels or a configurable control plane, and the 63 I/Os can connect transceivers, status indicators, and configuration registers. Using programmable logic allows channel behavior to be modified without changing the PCB for every product revision. The design should account for the -4 timing rating, the 1.2 V core supply, and the commercial 0°C to 85°C range. External line drivers or transceivers must provide the appropriate interface voltage, impedance, isolation, and signal-integrity performance for the deployed communications standard.
מומלץ
Embedded Data Acquisition
XC3S200-4VQG100C is appropriate for parallel data-acquisition and digital signal-conditioning systems that need programmable timing rather than a fixed-function converter. The FPGA can implement counters, trigger logic, data alignment, digital filtering, and interface state machines within its 4,320 logic cells. Its 63 user I/Os provide connections for sampled data, control signals, clocks, and status reporting, while the 630 MHz maximum clock specification defines the headline device performance class. Actual throughput depends on the implemented logic, I/O standards, routing, clocking, and timing margins. Use the manufacturer pin-description table to assign dedicated clock and configuration pins, and design the analog front end separately so sensor noise and converter characteristics do not limit the programmable digital stage.
מומלץ
Video Timing and Interface Logic
The XC3S200-4VQG100C can support timing generation, pixel and line counting, data alignment, test-pattern insertion, and auxiliary interface control in cost-sensitive video products. Its programmable architecture allows a compact 100-pin VTQFP implementation instead of a collection of fixed timing devices, while 4,320 logic cells accommodate parallel datapaths and control sequences. Video performance remains dependent on I/O timing, external memory or transceiver behavior, and the selected -4 speed grade. Engineers should use the exact manufacturer pin table to identify clock-capable and configuration pins, preserve the package footprint, and verify that external interface voltage levels are supported. A full image-processing pipeline may require additional logic resources, so system-level synthesis should determine whether the 4,320-cell limit is sufficient.
מומלץ
Consumer and Embedded Products
The Spartan-3 XC3S200-4VQG100C supports cost-sensitive consumer and embedded products that need configurable control, display sequencing, keypad handling, or accessory-interface logic. A single 100-pin device can combine several discrete controllers, reducing component count while retaining programmable field updates. The 63-I/O resource count is useful for external controls and status signals, and the 4,320 logic cells allow meaningful parallel processing rather than only a basic state machine. The commercial temperature range and 1.2 V core operation suit many indoor products, although final reliability depends on the enclosure, power quality, and applied load. Validate configuration startup behavior, brownout recovery, thermal performance, and accessory compatibility before mass production.
מומלץ
Programmable Test and Measurement
XC3S200-4VQG100C can implement sequencers, pattern generators, digital capture logic, and instrument-control interfaces in a compact 100-pin package. Its programmable nature permits measurement sequences and stimulus patterns to be changed through configuration updates rather than additional hardware. The 4,320 logic cells and 63 I/Os can support parallel acquisition and control functions, while the listed 630 MHz maximum clock provides a basis for evaluating synchronous timing. For a practical instrument, use the exact manufacturer pinout to identify clock-capable pins and check whether the intended I/O standard is compatible with the 1.2 V core environment. Signal conditioning, input protection, clock jitter, and output drive must be handled externally when the measured signals exceed the FPGA's direct I/O capabilities.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC3S200-4VQG100C — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC3S200-4VQG100I | XC3S200-5VQG100C | XC3S200-7VQG100C | XC3S200-2VQG100C | XC3S200-3VQG100C | XC3S200A-4VQG100C |
|---|---|---|---|---|---|---|---|
| Brand | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx | AMD Xilinx |
| Package | 100-pin VTQFP | 100-pin VTQFP - same | 100-pin VTQFP - same | 100-pin VTQFP - same | 100-pin VTQFP - same | 100-pin VTQFP - same | 100-pin TQFP - same package family |
| FPGA Family | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3 | Spartan-3A |
| Logic Cells | 4,320 cells | 4,320 cells | 4,320 cells | 4,320 cells | 4,320 cells | 4,320 cells | 4,032 cells |
| User I/O | 63 I/Os | 63 I/Os | 63 I/Os | 63 I/Os | 63 I/Os | 63 I/Os | 68 I/Os |
| Speed Grade | -4 | -4 | -5 | -7 | -2 | -3 | -4 |
| Temperature Grade | Commercial, 0°C to 85°C | Industrial suffix; exact range not stated | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Commercial, 0°C to 85°C | Commercial suffix; exact range not stated |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
מבדילים עיקריים
- Original Spartan-3 resource configuration (לעומתXC3S200A-4VQG100C)
- Commercial-temperature ordering option (לעומתXC3S200-4VQG100I)
- Exact -4 speed-grade alignment (לעומתXC3S200-3VQG100C)
- Broader user I/O count in the Spartan-3A alternative (לעומתXC3S200A-4VQG100C)
הערות תכנון
Use the exact XC3S200-4VQG100C manufacturer pin-description table to assign configuration, clock, power, ground, and user I/O nets. Keep the 100-pin VTQFP footprint and pad geometry unchanged when creating or revising the PCB. In particular, verify which pins are clock-capable or dedicated configuration functions before assigning them to ordinary user logic. Incorrect treatment of these pins can prevent configuration or reduce the usable I/O count even when the nominal 63-user-I/O resource remains unchanged.
Plan the 1.2 V core rail with placement and decoupling based on the manufacturer's power-supply recommendations and the final switching activity. Separate core and I/O supply paths where required, and use multiple supply pins and ground connections as directed for the package. Estimated: core power equals 1.2 V multiplied by the actual core current, while total board demand also includes I/O current, configuration devices, and external circuitry; the final power-supply rating requires measured or datasheet-based current limits.
Do not substitute a related ordering code without checking the package, speed grade, temperature suffix, and FPGA family. XC3S200A-4VQG100C uses the same 100-pin package family but has 4,032 logic cells and 68 I/Os, compared with 4,320 logic cells and 63 I/Os for XC3S200-4VQG100C. Likewise, changing from -4 to another speed grade or from C to I affects timing or environmental requirements. Re-run synthesis, place-and-route, timing analysis, and pinout checks for every proposed substitution.
Clock and high-speed interface routing should use short paths, continuous reference planes, and topology appropriate to the implemented Spartan-3 I/O standard. Avoid routing sensitive signals through areas where switching outputs or configuration activity could disturb return paths. Because the 630 MHz figure is a maximum device-level clock specification rather than a guaranteed board-level interface rate, verify each implemented path with static timing analysis and appropriate signal-integrity validation.
מידע על תאימות
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status require confirmation from the current manufacturer material declaration or product documentation.
