BSC9132NXN7KNKB - 2x1GHz e500 Processor SoC | NXP
MPN: BSC9132NXN7KNKB ✓ פעילBSC9132NXN7KNKB סקירה
A system-on-chip, or SoC, integrates multiple processing engines, memory interfaces, and specialized accelerators into one semiconductor. The BSC9132 belongs to the NXP QorIQ Qonverge processor hierarchy, combining general-purpose Power Architecture and StarCore DSP processing within a communications-oriented network processor. Its heterogeneous architecture allows real-time signal processing and control workloads to execute alongside network and protocol processing without requiring several discrete processors on the same board.
The BSC9132 combines two e500 cores, two StarCore SC3850 cores, and MAPLE-B2P baseband acceleration processing elements. Verified listings identify DDR3 and DDR3L memory support, a 780-ball FCBGA package, and an industrial temperature grade covering -40C to +105C. These features make the device relevant to cellular infrastructure and embedded communications systems where deterministic DSP processing, general-purpose control, and accelerated baseband handling must coexist in a compact package.
The processor arrangement is significant for network equipment. The e500 cores can manage control-plane, Ethernet, and protocol-related work, while the StarCore cores address high-throughput DSP tasks and MAPLE-B2P elements accelerate suitable baseband operations. The package integrates this heterogeneous computing fabric into a 23 x 23 mm-class FCBGA device, requiring a multilayer PCB, careful power delivery, and high-density escape routing for its 780 terminals.
Typical deployments include small-cell base stations, enterprise VoIP platforms, smart-grid controllers, military and defense communications equipment, and industrial communication systems. In each case, the device combines CPU and DSP resources in one package, reducing board-level processor count while retaining specialized real-time processing capability. DDR3 and DDR3L support also allows designs to select memory according to cost, density, and system-availability constraints.
The principal design consideration is that this is a complex mixed-signal and high-pin-count communication processor, not a general-purpose microcontroller. Board layout must provide clean power rails, properly terminated DDR memory routing, a compatible ball-grid land pattern, and adequate thermal management across the 780-terminal FCBGA. Software support for the e500, StarCore, and MAPLE acceleration paths must also be validated for the selected application.
This page consolidates verified manufacturer and distributor information, explicitly identifies unavailable electrical details, and distinguishes the supplied ordering variants from confirmed drop-in alternatives. That practical context supports procurement, footprint review, thermal planning, and initial architecture selection beyond a basic catalog description.
חלופות תחליף ישיר עבור BSC9132NXN7KNKB — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם BSC9132NXN7KNKB (אותו גורם צורה וטביעת רגל) — שונים ב Package, Operating Temperature, DSP Cores, Ethernet, Product Type.
BSC9132NXE7KNKB
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←BSC9132NSN7KNKB
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←BSC9132NSE7KNKB
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←BSC9132NXN7MNMB
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←BSC9132NSN7MNMB
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←BSC9132NXN7KNKB דירוגים מרביים ומאפיינים חשמליים
| Product Type | QorIQ Qonverge network system-on-chip |
| Manufacturer | NXP Semiconductors |
| CPU Core Count | 2 e500 cores |
| CPU Architecture | 32-bit Power Architecture e500 |
| e500 Listed Clock | 1 GHz per core |
| DSP Core Count | 2 StarCore SC3850 cores |
| DSP Listed Clock | 1 GHz per core |
| Baseband Accelerator | MAPLE-B2P baseband acceleration processing elements |
| Physical Address Width | 36 bit |
| Supported Memory | DDR3 and DDR3L |
| מארז | 780-pin FCBGA |
| Package Dimensions | 23 x 23 mm |
| Terminal Count | 780 terminals |
| Terminal Form | Ball |
| Package Shape | Square |
| טווח טמפרטורת פעולה | -40C to +105C |
| Temperature Grade | Industrial |
| סוג הרכבה | Surface mount |
| Packaging | Tray |
מדריך תצורת פינים של BSC9132NXN7KNKB square
תצורת פינים עבור BSC9132NXN7KNKB (מארזת square). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור BSC9132NXN7KNKB.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
BSC9132NXN7KNKB מתאים עבור 6 יישוםs: Small-Cell Base Stations, Enterprise VoIP Platforms, Smart-Grid Control Equipment, Military and Defense Communications, Industrial Communication Gateways, Enterprise Network Infrastructure.
Small-Cell Base Stations
The BSC9132NXN7KNKB fits small-cell base stations because it combines two e500 cores with two StarCore SC3850 DSP cores and MAPLE-B2P acceleration in one 780-pin FCBGA. The e500 complex can support network and control tasks while the DSP complex handles real-time radio-related processing. A 2x1GHz-listed core configuration and DDR3 or DDR3L support provide a consolidated platform for compact radio equipment. The primary design trade-off is board complexity: a 23 x 23 mm BGA, multilayer routing, external memory, and several supply rails require careful reference-design validation.
מומלץ
Enterprise VoIP Platforms
BSC9132NXN7KNKB is suitable for enterprise VoIP platforms that combine packet processing, control, and real-time media functions. Two 32-bit e500 cores can support networking and protocol workloads, while the two listed 1GHz StarCore SC3850 cores provide dedicated DSP capacity for speech and audio processing. Integrating these engines in one QorIQ Qonverge SoC can simplify synchronization compared with separate CPU and DSP packages. DDR3 and DDR3L memory options allow system architects to balance availability and capacity, although software partitioning, thermal design, and the 780-terminal package remain significant implementation considerations.
מומלץ
Smart-Grid Control Equipment
The BSC9132NXN7KNKB supports smart-grid controller designs that need general-purpose processing alongside deterministic signal handling. Its two e500 cores can address communications, supervisory logic, and control-plane tasks, while the two StarCore SC3850 cores and MAPLE-B2P elements provide heterogeneous processing for data-intensive signal functions. The stated -40C to +105C industrial temperature range supports demanding equipment environments. System integrators must still validate conducted immunity, surge exposure, thermal rise, functional safety, and regulatory requirements at the complete equipment level rather than treating the processor rating as a system certification.
מומלץ
Military and Defense Communications
BSC9132NXN7KNKB can serve as the processor foundation for military and defense communication equipment requiring CPU, DSP, and accelerator resources in one package. The e500 cores provide a general-purpose execution environment, the StarCore cores support high-throughput real-time processing, and MAPLE-B2P elements address appropriate baseband acceleration workloads. Its listed industrial temperature range covers -40C to +105C, but military suitability depends on the exact NXP ordering code, screening level, radiation environment, export controls, and program-specific qualification. Developers should avoid inferring military qualification from the general-purpose part number alone.
מומלץ
Industrial Communication Gateways
BSC9132NXN7KNKB is applicable to industrial communication gateways that must aggregate protocol processing, control logic, and real-time data handling. The two e500 cores can divide networking, configuration, and supervisory workloads, while the two listed 1GHz StarCore SC3850 cores can accelerate signal-related processing without requiring a separate DSP device. DDR3 and DDR3L support provides flexibility when selecting available memory components for long-life industrial programs. The processor package demands a dense multilayer PCB, controlled power sequencing, robust thermal design, and comprehensive software validation for deterministic gateway behavior.
מומלץ
Enterprise Network Infrastructure
BSC9132NXN7KNKB can support enterprise network infrastructure equipment that processes mixed control and high-throughput real-time traffic. Its heterogeneous arrangement of two e500 CPU cores, two StarCore SC3850 DSP cores, and MAPLE-B2P acceleration provides flexible partitioning for packet handling, protocol work, and specialized traffic processing. The 780-terminal FCBGA and DDR3 or DDR3L interface place it in the class of processors requiring careful signal-integrity and memory-layout work. Compared with a simpler microcontroller, it offers much greater parallel processing capacity but demands a substantially more complex board, power system, boot flow, and software-maintenance process.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור BSC9132NXN7KNKB — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | BSC9132NXE7KNKB | BSC9132NSN7KNKB | BSC9132NSE7KNKB | BSC9132NXN7MNMB | BSC9132NSN7MNMB |
|---|---|---|---|---|---|---|
| Package | 780-pin FCBGA | 780-pin FCBGA | 780-pin FCBGA | 780-pin FCBGA | 780-pin FCBGA | 780-pin FCBGA |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
מבדילים עיקריים
- Integrated heterogeneous processor complex (לעומתBSC9132NXE7KNKB)
- No separate CPU and DSP packages required for the listed workload (לעומתBSC9132NXN7MNMB)
- Industrial temperature coverage (לעומתBSC9132NSN7KHKB)
- DDR3 and DDR3L memory choice (לעומתBSC9132NSE7KNKB)
הערות תכנון
Treat the 780-terminal FCBGA as a high-density, multilayer-routing problem. Obtain the exact NXP ball map, land pattern, via-in-pad guidance, and assembly drawings before committing a PCB footprint. Route the DDR3 or DDR3L interface as a matched-length, continuously referenced memory topology and maintain the clearances specified by the family design guide. Do not derive a footprint from generic FCBGA rules because escape-routing requirements depend on the exact 23 x 23 mm ball map.
The supplied sources do not provide voltage rails, current limits, sequencing rules, or power dissipation, so the power tree must be designed from the exact BSC9132 ordering-code documentation. Separate noisy DDR and I/O supply paths where the reference design permits, use local high-frequency decoupling at each supply ball, and validate power-up and power-down ordering against the processor requirements. Do not reuse the processor clock rating as a proxy for consumed power because memory traffic, accelerator loading, and I/O activity materially change the result.
Plan thermal management around the complete 23 x 23 mm FCBGA rather than an individual hot region, because the available data does not identify thermal hotspots or junction ratings. Use the manufacturer's thermal model to estimate worst-case CPU, StarCore, MAPLE, DDR, and I/O activity. Preserve thermal-via access beneath the package, verify the board stack-up, and measure junction or case temperatures in the final enclosure. Conservative margins are appropriate because system airflow, copper area, and adjacent heat sources are not specified in the source data.
Do not assume that parts with similar BSC9132 names are automatically interchangeable without checking the exact order-code table. Sample-status markers, temperature grades, processor revisions, and suffix fields can change qualification even when the package remains a 780-pin FCBGA. For every proposed substitute, compare pin assignments, supply rails, boot configuration, DDR interface limits, clock configuration, software image support, and lifecycle status. Preserve the verified source documents alongside the released BOM for future traceability.
מידע על תאימות
The supplied verified data identifies an industrial temperature grade of -40C to +105C but does not explicitly provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Current NXP compliance documentation for the exact ordering code is required.
