EP1S60F1020C6 - Stratix FPGA 57120 Cells 1020-BGA | Intel / Altera
MPN: EP1S60F1020C6 ✗ סוף ייצורEP1S60F1020C6 סקירה
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be electrically configured to implement arbitrary digital logic after PCB assembly. FPGAs sit in the hierarchy: programmable logic device (PLD) → field-programmable gate array (FPGA) → high-density FPGA, occupying the same engineering role as a custom ASIC but with the flexibility of in-system reprogrammability and substantially shorter time-to-market for design changes. The Stratix family, launched by Altera in 2002, was the first to embed dedicated DSP blocks and large TriMatrix memory blocks alongside the general-purpose logic array, marking a generational shift from glue-logic replacement toward full system-on-chip integration.
Key features include 6,570 logic array blocks (LABs), 12 dedicated DSP blocks, 12 transceiver blocks (channel count varies by speed grade), and configurable JTAG-based in-system programming via the IEEE 1149.1 boundary-scan interface. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, HSTL, LVDS, and PCI, with per-pin dynamically controlled impedance and slew rate. On-board PLLs handle clock multiplication and phase shifting, while a robust clock network distributes low-skew signals across the die.
The EP1S60F1020C6 is well suited for digital signal processing pipelines, high-throughput video and image processing, telecom baseband and protocol bridging, ASIC prototyping, and embedded control applications. The 1020-ball FC-FBGA package supports high-speed differential signaling and a substantial power/ground via array, which is critical at this logic density. Designers should follow Altera's Stratix pin-out guidelines and reference design examples for power-rail decoupling and JTAG chain implementation. This page synthesizes distributor stock data, same-family drop-in alternatives, and PCB-level design notes that complement the manufacturer's data sheet.
חלופות תחליף ישיר עבור EP1S60F1020C6 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP1S60F1020C6 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Speed Grade, Family, Operating Temperature, Process Technology.
EP1S60F1020C5N
✅ Drop-In✗ אזל מהמלאי
$2050 / יחידה
הצג גיליון נתונים ←EP1S60F1020C5
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1S60F1020C7N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1S60F1020
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1S40F1020C6
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP1S60F1020C6 דירוגים מרביים ומאפיינים חשמליים
| Family | Stratix |
| Series | EP1S60 |
| Logic Elements | 57,120 |
| Logic Array Blocks (LABs) | 6,570 |
| Embedded Memory Bits | 5,215,104 |
| Maximum User I/O Pins | 773 |
| DSP Blocks | 12 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 450.05 MHz |
| מארז | 1020-ball FC-FBGA, 33 × 33 mm, 1 mm pitch |
| סוג הרכבה | Surface Mount (BGA) |
| טמפרטורת פעולה | 0 °C to +85 °C (Commercial) |
| Speed Grade | C6 |
מדריך תצורת פינים של EP1S60F1020C6 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch
תצורת פינים עבור EP1S60F1020C6 (מארזת 1020-ball fc-fbga, 33 × 33 mm, 1 mm pitch). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור EP1S60F1020C6.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
EP1S60F1020C6 מתאים עבור 6 יישוםs: Telecom Baseband Processing, High-Throughput Video and Image Processing, ASIC Prototyping and Emulation, Industrial Control and Embedded Computing, Test and Measurement Instrumentation, Military and Aerospace Legacy Systems.
Telecom Baseband Processing
The EP1S60F1020C6's 57,120 logic elements and 12 dedicated DSP blocks deliver the gate count and multiply-accumulate throughput needed for early-generation telecom baseband and protocol-bridging designs. Its 5,215,104 bits of embedded TriMatrix memory buffer packet streams and intermediate DSP results without external SRAM, reducing board complexity. The 1020-ball FBGA package supports the high I/O count required to drive multiple standard telecom interfaces in parallel. Per the Stratix Family Data Sheet typical applications, this device fits cleanly into TDM-to-Ethernet bridges, channelized voice processing, and backhaul aggregation cards where deterministic latency and high DSP throughput are non-negotiable.
מומלץ
High-Throughput Video and Image Processing
The 12 dedicated DSP blocks combined with 5.2 Mbits of internal memory make the EP1S60F1020C6 well suited for SD/HD video processing pipelines, image pre-processing, and real-time video analytics. Designers can implement motion estimation, color-space conversion, and overlay blending directly in the fabric without external frame buffers in many cases. The 1020-ball FBGA exposes the LVDS and LVTTL I/O needed to drive parallel video buses and DVI/HDMI bridges. Use the device's PLL resources to derive the precise pixel clocks required by broadcast video standards, while the JTAG-based configuration supports rapid firmware iteration during product bring-up.
מומלץ
ASIC Prototyping and Emulation
With 57,120 logic elements and abundant TriMatrix memory, the EP1S60F1020C6 was a workhorse for ASIC and ASSP prototyping in the 130 nm design era, providing the density required to map large ASIC RTL blocks into a single FPGA. Multiple EP1S60 devices can be tiled across a multi-FPGA prototyping board to validate ASIC-class designs before tape-out. The 1020-ball FBGA's high I/O count enables high-fidelity partitioning between multiple FPGAs in such an array. JTAG-based configuration simplifies fast bitstream swapping during regression runs.
מומלץ
Industrial Control and Embedded Computing
The EP1S60F1020C6's commercial temperature range (0 °C to +85 °C), high logic density, and broad I/O standard support make it a fit for industrial controllers, machine-vision processing cards, and embedded computing modules. Its 130 nm CMOS core draws predictable power and is supported by mature Quartus II tool flows, simplifying long-life industrial product maintenance. The 1020-ball FBGA exposes PCI, LVDS, and LVTTL interfaces commonly used for backplane connectivity in industrial PCs and PLCs. Industrial-grade EP1S60F1020I6 variants exist for -40 °C to +100 °C operation if the application requires it.
מומלץ
Test and Measurement Instrumentation
Engineers building protocol analyzers, logic analyzer backends, and high-speed data acquisition cards leverage the EP1S60F1020C6's 57,120 logic elements to implement pattern generation, real-time compression, and trigger logic in a single device. The 12 DSP blocks support on-chip FFT and digital filtering pre-processing, reducing the burden on the host processor. The 1020-ball FBGA package provides sufficient I/O for parallel LVDS acquisition channels and trigger fanout. Mature Quartus II design flows allow test-equipment vendors to maintain long product lifecycles for their installed base.
מומלץ
Military and Aerospace Legacy Systems
Long-lifecycle aerospace, defense, and avionics programs continue to support EP1S60F1020C6 in deployed fielded systems where the bill of materials is frozen and re-qualification of new silicon is cost-prohibitive. The 1020-ball FC-FBGA's robust thermal mass and the Stratix family's documented reliability make it suitable for ruggedized board designs. Specialty distributors continue to franchise this part for defense sustainment programs. Note that the part is commercial-temperature graded; for full MIL-grade operation, a flight-grade screened variant must be sourced separately.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP1S60F1020C6 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP1S60F1020C5N | EP1S60F1020C5 | EP1S60F1020C7N | EP1S60F1020 | EP1S40F1020C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1020-BGA (FBGA), 33 × 33 mm | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same | 1020-BGA (FBGA) - same |
| Logic Elements | 57,120 | 57,120 (same die) | 57,120 (same die) | 57,120 (same die) | 57,120 (same die) | 41,250 (-28%) |
| Embedded Memory Bits | 5,215,104 | 5,215,104 (same die) | 5,215,104 (same die) | 5,215,104 (same die) | 5,215,104 (same die) | 3,423,744 (-34%) |
| Speed Grade | C6 | C5N (slower) | C5 (slower) | C7N (lower power) | C6 (default) | C6 (same speed grade) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) | Commercial (0 to 85 °C) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
מבדילים עיקריים
- Original Stratix family — long-standing tool-chain maturity (לעומתEP1S40F1020C6)
- C6 speed grade targets higher fMAX (לעומתEP1S60F1020C7N)
- Lead-free terminal finish (לעומתEP1S60F1020C5)
הערות תכנון
The EP1S60F1020C6 requires a multi-rail power architecture: 1.5 V core, plus per-bank VCCIO rails for each I/O bank (typically 1.5 V, 1.8 V, 2.5 V, 3.3 V depending on I/O standard). Place bulk decoupling (10 µF to 47 µF tantalum or polymer) within 25 mm of each power pin and high-frequency 0.1 µF X7R ceramic within 2 mm of every VCC pin. Estimated ICC core current at full utilization can exceed 2 A; size the 1.5 V regulator with at least 30 % margin and route the sense pin directly to the device's VCC pin to absorb PCB IR drop.
Estimated: at full utilization with 50 % toggle rate the 1020-ball FBGA can dissipate 5-8 W, producing a junction temperature rise of 15-25 °C above ambient with the standard 4-layer JEDEC test board. Use at least a 6-layer PCB with a continuous inner ground plane and follow Altera's thermal via array under the BGA (at least 9 thermal vias per cm² of die area). For chassis-mounted designs with restricted airflow, attach a small heatsink with thermal interface material rated for the 0.85 mm-thick BGA package height.
Routing escape from a 1020-ball FC-FBGA at 1 mm pitch requires microvia or via-in-pad technology on a high-density-interconnect PCB stackup. Use a 0.4 mm finished pad with 0.15 mm drill microvias, 0.25 mm via capture pad, and staggered fanout in the outer layer. Maintain 50 Ω single-ended and 100 Ω differential characteristic impedance for LVDS/LVPECl pairs. Stitch the BGA's GND ball perimeter to inner ground planes every 5 mm to provide a low-impedance return path for high-speed signals.
Configuration mode pins (MSEL0..MSEL2) must be tied to the correct VCCPD rail level — most commonly 3.3 V — for Fast Passive Parallel (FPP) or Active Serial (AS) configuration modes; mismatched levels cause silent configuration failure. The JTAG chain order (TDI → EP1S60 → TDO) must be unique to the device boundary-scan length, otherwise downstream devices report IDCODE errors. Always load the Quartus II programming object file (.pof) for AS configuration or .sof for JTAG, and never mix them.
מידע על תאימות
RoHS, REACH, lead-free, halogen-free and conflict-mineral data are lot-dependent for this obsolete part; obtain a signed manufacturer/distributor certificate of compliance per shipment. The 'N' suffix variants (e.g. EP1S60F1020C5N) are explicitly lead-free; base parts (without 'N') were originally SnPb. AEC-Q100 is not applicable — this is a commercial-grade FPGA.
