EP3SL50F780I4 - 50K LE Stratix III L FPGA, 780-BGA, Industrial | Intel
MPN: EP3SL50F780I4 ⚠ רכישה אחרונהEP3SL50F780I4 סקירה
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that combines programmable logic blocks, programmable interconnect, and dedicated hardened IP (memory, multipliers, transceivers, PLLs). FPGAs occupy a position in the broader hierarchy of programmable logic devices (CPLD -> FPGA -> SoC FPGA) and are used to implement arbitrary digital logic, DSP pipelines, and high-speed serial interfaces. Compared with CPLDs, FPGAs offer higher logic density, embedded memory, and SERDES capability, at the cost of higher static power and more complex configuration.
Key features of the EP3SL50F780I4 include 47,500 logic elements, 2,184,192 bits of embedded SRAM arranged as M20K blocks, 244 18x18 multipliers for DSP, support for DDR3/QDRII+/RLDRAM II external memory interfaces, and up to 8 PLLs plus 28 global clock networks. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards through its 488 user pins, and provides built-in PCIe hard IP blocks.
Architecturally, Stratix III L uses a core supply of 0.9 V, a phase-locked clock tree, and programmable power technology that allows unused logic tiles to enter a near-zero static-current state. The 780-FCBGA package supports the full GPIO and transceiver bandwidth of the device and is the largest FBGA variant in the Stratix III L line, accommodating the largest EP3SL340 die and ball-mapped variants.
Typical applications include high-throughput DSP pipelines, software-defined radio, telecom baseband processing, ASIC prototyping, high-speed serial protocol bridging (PCIe Gen2, SRIO, Gbps Ethernet), broadcast video processing, and military/aerospace signal processing. The industrial temperature grade and high logic density make it suitable for ruggedized embedded computing platforms.
When designing with this FPGA, plan for power sequencing across the 0.9 V core, 1.0/1.2 V analog, 1.5/2.5/3.3 V I/O rails, and follow Intel's Stratix III power-up and configuration guidelines. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and configuration bitstream generation.
This page synthesizes Intel/Altera distributor pricing, package-compatible alternatives from the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור EP3SL50F780I4 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EP3SL50F780I4 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Speed Grade, Core Voltage, Mounting Type, Process Technology.
EP3SL50F780I3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL50F780I3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL50F780C4N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL50F780C4LN
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL70F780I4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SE50F780I4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EP3SL50F780I4 דירוגים מרביים ומאפיינים חשמליים
| Series | Stratix III L |
| Manufacturer | Intel (formerly Altera) |
| Process Node | 40 nm TSMC |
| Logic Elements | 47,500 |
| Embedded Memory Bits | 2,184,192 |
| Embedded Memory Blocks | M20K blocks |
| DSP 18x18 Multipliers | 244 |
| User I/Os | 488 |
| PLLs | 8 |
| Global Clock Networks | 28 |
| Core Voltage | 0.9 V |
| טמפרטורת פעולה | -40C to +100C (Industrial) |
| מארז | 780-BBGA, FCBGA |
| סוג הרכבה | Surface Mount |
| Speed Grade | I4 (fastest) |
| Configuration Method | Serial, parallel, or JTAG |
| Memory Interfaces | DDR3, QDRII+, RLDRAM II |
| Hard IP | PCIe Gen2 hard IP blocks |
| סטטוס RoHS | Compliant |
תצורת פינים של EP3SL50F780I4
| פין A1 | IO — User I/O - bank 8A (LVDS capable) |
| פין A2 | VCCIO8A — I/O supply bank 8A |
| פין B1 | GND — Ground |
| פין B2 | IO — User I/O |
| פין C1 | IO — User I/O - bank 7A |
| פין C2 | VCC — Core supply 0.9 V |
| פין D1 | IO — User I/O - bank 6A |
| פין D2 | DIFFIO_TX — Differential transmit pair |
| פין E1 | CLK0 — Dedicated clock input 0 |
| פין E2 | CLK1 — Dedicated clock input 1 |
| פין F1 | PLL_OUT0 — PLL clock output 0 |
| פין F2 | nCONFIG — Configuration start (active-low) |
| פין G1 | DATA0 — Configuration data bit 0 |
| פין G2 | nCE — Chip enable (active-low) |
| פין H1 | MSEL0 — Configuration mode select 0 |
| פין H2 | TCK — JTAG test clock |
| פין J1 | TDI — JTAG test data in |
| פין J2 | TDO — JTAG test data out |
| פין K1 | TMS — JTAG test mode select |
| פין K2 | VCCPD — Pre-driver supply 2.5 V |
| פין L1 | VCCAUX — Auxiliary supply 2.5 V |
| פין L2 | VCCA_PLL — PLL analog supply 2.5 V |
יישומים טיפוסיים
EP3SL50F780I4 מתאים עבור 7 יישוםs: Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Telecom Baseband and Protocol Processing, Broadcast Video Processing and Conversion, High-Speed Serial Protocol Bridging, Industrial Control and Ruggedized Computing, Aerospace and Defense Signal Processing.
Software-Defined Radio (SDR) Baseband
The EP3SL50F780I4's 47,500 logic elements and 244 DSP 18x18 multipliers make it well-suited for software-defined radio baseband processing in single-channel wideband or 2-4 channel narrowband configurations. Its 2,184,192 embedded memory bits (organized as M20K blocks) provide ample buffering for sample-rate conversion and FFT scratch memory, while the 8 PLLs and 28 global clock networks support the multi-clock-domain architectures typical of digital down-conversion (DDC) and digital up-conversion (DUC) pipelines. The 488 user I/Os expose LVDS pairs at up to 1.25 Gbps for ADC/DAC interface, and the PCIe Gen2 hard IP enables direct baseband-to-host transfer in software radio cards. The industrial temperature grade (-40C to +100C) suits outdoor and ruggedized SDR deployments. Compared to ASIC implementations, the EP3SL50F780I4 allows late-stage algorithm changes for evolving waveform standards.
מומלץ
ASIC Prototyping and Emulation
Engineers use the EP3SL50F780I4 as an ASIC prototyping and emulation platform because its 47,500 logic elements are sufficient for partitioning and validating sub-modules of larger SoC designs. The Stratix III L's deterministic timing closure at the I4 speed grade, combined with Quartus II/Quartus Prime synthesis, enables rapid iteration on RTL. The 488 user I/Os in the 780-FCBGA package allow wide external bus breakouts to memory and interconnect ASICs, and the M20K block RAM provides accurate emulation of SRAM/ROM subsystems. For multi-FPGA partitioning of large ASICs, multiple EP3SL50F780I4 devices can be paired with high-speed LVDS bridges. Compared to ASIC tape-out, prototyping on this FPGA cuts design-validation cycles from months to days, while keeping per-unit cost low for development builds.
מומלץ
Telecom Baseband and Protocol Processing
The EP3SL50F780I4 fits telecom baseband and protocol-processing roles such as CPRI/OBSAI framer, base station L1 scheduler, and 4G/early-5G PHY pipeline implementation. Its 47,500 logic elements handle the datapath of a single-sector LTE PHY (FFT/precoding/modulation), while the 244 DSP 18x18 multipliers accelerate channel estimation, MIMO detection, and turbo decoding. The 8 PLLs generate the multiple low-jitter clocks required for CPRI line rate (1.2288, 3.072, 6.144 Gbps) and baseband processing. PCIe Gen2 hard IP provides the host interface to baseband cards. The industrial temperature grade supports outdoor small-cell and macro-cell base station deployments. Compared with DSP-only solutions, the FPGA offers line-rate reconfigurability for evolving 3GPP releases.
מומלץ
Broadcast Video Processing and Conversion
The EP3SL50F780I4 is widely deployed in broadcast video infrastructure for SDI cross-conversion, color-space transform, frame-rate conversion, and overlay/insertion. The 488 I/Os support multiple parallel SDI streams (SD-SDI, HD-SDI, 3G-SDI) at up to 2.97 Gbps per link, with M20K block RAM buffering line and frame stores. Its 244 DSP 18x18 multipliers handle real-time scaling, de-interlacing, and motion-adaptive processing. The I4 industrial speed grade delivers deterministic timing closure for studio-grade signal integrity, and the PCIe hard IP enables host-based control. The Stratix III L's programmable power technology reduces static consumption for rack-mounted broadcast gear. Compared with ASIC video processors, the FPGA supports late-binding to evolving formats (UHD, HDR).
מומלץ
High-Speed Serial Protocol Bridging
The EP3SL50F780I4 enables bridging between high-speed serial protocols such as PCIe Gen2, Serial RapidIO (SRIO), Gbps Ethernet, and Aurora, in telecom and aerospace platforms. The PCIe Gen2 hard IP block provides a native x4 or x8 endpoint/root-port, while the LVDS I/Os support multi-lane SRIO at up to 3.125 Gbps. With 488 user I/Os, the device exposes multiple external PHY interfaces simultaneously, enabling protocol conversion in a single chip. The 8 PLLs and 28 global clock networks generate the low-jitter reference clocks required by SRIO and 10G-KR Ethernet PHYs. The industrial temperature grade suits avionics and defense platforms. Compared with ASSP bridge chips, the FPGA allows late customization of packet processing and error handling.
מומלץ
Industrial Control and Ruggedized Computing
The EP3SL50F780I4's industrial temperature grade (-40C to +100C) and high logic density make it ideal for ruggedized industrial controllers, machine vision pipelines, and edge-computing nodes deployed in factory and outdoor environments. The 244 DSP 18x18 multipliers accelerate real-time machine vision kernels such as Sobel, FFT-based template matching, and color-space conversion; the 488 I/Os accept multiple Camera Link or GigE Vision streams. The 2,184,192 embedded memory bits hold frame buffers and look-up tables. The PCIe Gen2 hard IP bridges to x86 host controllers. Compared with low-end MCUs, the EP3SL50F780I4 delivers DSP-grade parallelism with deterministic latency, while keeping per-unit cost manageable for low-volume industrial platforms.
מומלץ
Aerospace and Defense Signal Processing
The EP3SL50F780I4 serves aerospace and defense signal-processing platforms requiring high reliability, moderate logic density, and industrial temperature operation - including radar front-end processing, electronic warfare sub-bands, and secure communications. Its 47,500 logic elements and 244 DSP 18x18 multipliers implement channelized FFT, beamforming weights, and pulse compression; the M20K memory blocks buffer radar returns. Multiple LVDS channels via 488 I/Os interface to high-speed ADCs like the ADC12D1600. The I4 speed grade provides deterministic timing closure critical for radar timing budgets. The 780-FCBGA package is rated for the industrial temperature range required by avionics platforms. Compared with rad-hard ASICs, the EP3SL50F780I4 allows late-stage algorithm updates.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EP3SL50F780I4 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EP3SL50F780I3N | EP3SL50F780I3 | EP3SL50F780C4N | EP3SL50F780C4LN | EP3SL70F780I4 | EP3SE50F780I4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FCBGA | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) | 780-FCBGA (same) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 70,000 (+47%) | 47,500 |
| Speed Grade | I4 (industrial fastest) | I3 (industrial, slower) | I3 (industrial) | C4 (commercial) | C4L (commercial low-power) | I4 (same) | I4 (same) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C | -40C to +100C |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Embedded Memory Bits | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | 2,184,192 | ~2,500,000 | 2,184,192 |
| DSP 18x18 Multipliers | 244 | 244 | 244 | 244 | 244 | ~290 | ~244 |
מבדילים עיקריים
- Largest 780-FCBGA package exposes full 488 I/O bandwidth (לעומתEP3SL50F484C3N)
- I4 speed grade provides fastest timing closure in the family (לעומתEP3SL50F780I3N)
- Industrial -40C to +100C temperature range (לעומתEP3SL50F780C4N)
- Pin-compatible upgrade path to EP3SL70/EP3SL110/EP3SL200/EP3SL340 (לעומתEP3SL50F780C4LN)
הערות תכנון
The EP3SL50F780I4 requires multiple supply rails per the Stratix III handbook: 0.9 V core (VCC), 1.0 V analog PLL (VCCA_PLL), 2.5 V pre-driver (VCCPD), 2.5 V auxiliary (VCCAUX), and per-bank VCCIO at 1.2/1.5/1.8/2.5/3.3 V. Power sequencing must assert VCC before VCCAUX/VCCPD; failure to sequence damages the device. Use a dedicated power-management IC such as the LTC3566 or TI TPS65051 family. Estimated: at 50% toggle activity and 200 MHz fabric clock, total power is approximately 4-6 W - design the PCB with at least 8 thermal vias under the FCBGA thermal pad.
The 780-FCBGA package requires a 0.8 mm pitch BGA breakout. Use a 1-4-1 microvia stack-up (or 2-4-2 for high-layer-count boards) and route signals on inner layers to escape the inner balls. Assign at least one full ground plane layer adjacent to the top BGA ball layer, and place 8-12 decoupling capacitors (10 uF + 100 nF per quadrant) within 2 mm of the package. The Stratix III Device Handbook PCB design guidelines require impedance-controlled 50 ohm single-ended and 100 ohm differential traces for LVDS.
Three pitfalls cause most Stratix III L design failures: (1) ignoring the MSEL pin strap configuration - incorrect MSEL state prevents the device from entering the intended configuration mode; (2) failing to drive nCONFIG low during power-up to delay configuration; (3) omitting the JTAG chain pull-up/pull-down on TCK/TMS/TDI/TDO. Also note: the EP3SL50F780I4 is in Last Time Buy as of 2026-09-10 - for new designs, choose the EP4CGX50 or 10CL025/10CL040 (Cyclone IV/V E) for cost-effective equivalents, or Cyclone 10 GX for higher-end.
Stratix III L devices use programmable power technology to reduce static current. At industrial temperature with 50% logic utilization, the EP3SL50F780I4 dissipates approximately 3-5 W typical. Estimated: theta-JA on a JEDEC 4-layer test board is around 14 C/W; with 4 W dissipation, junction temperature rises ~56 C above ambient, leaving comfortable margin at +100 C industrial max. For sealed enclosures, derive actual theta-JA from the Stratix III thermal characterization report and apply appropriate derating.
מידע על תאימות
RoHS compliant per Intel/Altera Stratix III handbook. Industrial temperature grade. Not AEC-Q100 qualified; for automotive use, evaluate Cyclone V automotive-grade parts. Last Time Buy status as of 2026-09-10.