LPC1823JET100E - 180MHz Cortex-M3 MCU | NXP Semiconductors
MPN: LPC1823JET100E ✓ פעילLPC1823JET100E סקירה
An Arm Cortex-M3 microcontroller is a 32-bit reduced-instruction-set processor core used in embedded systems. Cortex-M3 devices belong to the broader microcontroller hierarchy, combining a processor core, flash memory, SRAM, peripheral controllers, and interrupt handling in one integrated circuit. This integration lets embedded products execute firmware while communicating with sensors, actuators, human interfaces, storage devices, and external networks through dedicated hardware peripherals.
The LPC1823JET100E provides 512 kB flash for program storage, 104 kB SRAM for working memory, and an operating frequency up to 180 MHz. Its 100-ball TFBGA-100 package supports compact surface-mount PCB layouts. NXP describes the LPC18xx family as pin- and software-compatible with many related devices, allowing engineers to reuse software and consider family variants when product requirements change. Detailed electrical, peripheral, and environmental limits are available in the linked manufacturer documentation.
The device uses the Arm Cortex-M3 architecture, whose efficient instruction set and hardware interrupt handling are suitable for real-time embedded control. Its combination of flash, SRAM, and processing speed allows more application code and data to remain on-chip than in smaller general-purpose microcontrollers. This can reduce external memory requirements in networking, industrial-control, communications, and embedded-processing equipment, subject to the complete peripheral configuration of the selected device.
Typical uses include industrial automation equipment, USB-connected embedded systems, communications controllers, and compact control platforms. In each case, the MCU can execute control logic while its on-chip memory stores firmware and working data. Engineers should verify the required USB, Ethernet, CAN, LCD, storage, and other peripheral functions against the exact LPC1823 configuration before selecting it for a design.
A critical design consideration is BGA assembly and inspection. The 100-ball TFBGA-100 footprint requires a compatible land pattern, controlled reflow, and appropriate solder-joint inspection because hidden joints are not visually accessible after assembly. Firmware should also be validated for the exact LPC1823 peripheral set because related LPC18xx devices can differ in memory and integrated interfaces.
This product page consolidates verified manufacturer and distributor information, exact pricing references, same-package family alternatives, and practical design considerations. It also distinguishes confirmed LPC1823JET100E attributes from parameters that still require confirmation from the full NXP datasheet, helping engineers make evidence-based sourcing and design decisions.
חלופות תחליף ישיר עבור LPC1823JET100E — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם LPC1823JET100E (אותו גורם צורה וטביעת רגל) — שונים ב Architecture, Package, Product Type.
LPC1837JET100E
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LPC1827JET100E
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LPC1822JET100E
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LPC1815JET100E
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
LPC1812JET100E
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←LPC1823JET100E דירוגים מרביים ומאפיינים חשמליים
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M3 |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory | 512 kB |
| SRAM | 104 kB |
| Architecture | 32-bit |
| Program Memory Type | Flash |
| מארז | 100-ball TFBGA, 9 x 9 mm |
| סוג הרכבה | Surface mount |
| Product Variant | LPC1823JET100E |
| Core Variant | LPC18xx |
| Manufacturer | NXP Semiconductors |
מדריך תצורת פינים של LPC1823JET100E 100-ball tfbga, 9 x 9 mm
תצורת פינים עבור LPC1823JET100E (מארזת 100-ball tfbga, 9 x 9 mm). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור LPC1823JET100E.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
LPC1823JET100E מתאים עבור 6 יישוםs: Industrial Automation Controller, USB-Connected Embedded System, Communications Gateway, High-Speed Data Acquisition, Human-Machine Interface Controller, Portable Instrumentation Equipment.
Industrial Automation Controller
The LPC1823JET100E fits compact industrial automation and machine-control platforms because its 180 MHz Arm Cortex-M3 core provides real-time processing capability while 512 kB of flash holds application firmware and 104 kB of SRAM supports working data. The MCU can sit between sensors and actuators, executing control logic and coordinating communications without requiring external memory for every design. The TFBGA-100 package also supports dense, mixed-signal equipment layouts. Before production use, engineers must verify the required timers, communication interfaces, operating-temperature limits, and industrial qualification in the official datasheet.
מומלץ
USB-Connected Embedded System
LPC1823JET100E is appropriate for a USB-connected embedded product when the exact LPC1823 configuration includes the required USB controller and resources. Its 180 MHz Cortex-M3 performance can manage protocol processing, control logic, and user-interface tasks, while 104 kB of SRAM reduces the need for external buffering. Engineers should reserve USB routing space on the 100-ball TFBGA footprint and confirm transceiver, power, impedance, and firmware requirements. Compared with a smaller microcontroller, the verified 512 kB flash and 104 kB SRAM provide more room for protocol stacks and application code.
מומלץ
Communications Gateway
The LPC1823JET100E can serve as the processing element in a compact communications gateway, where its 180 MHz Cortex-M3 core handles packet processing and the 512 kB flash accommodates firmware, protocol configuration, and update data. Its 104 kB SRAM provides space for buffers while data is transferred among serial or network interfaces. A gateway design should verify that the selected LPC1823 device contains every required UART, USB, Ethernet, CAN, or other peripheral and that software drivers support the exact model. The small TFBGA-100 body helps reduce board area, although careful escape routing and thermal verification are essential.
מומלץ
High-Speed Data Acquisition
LPC1823JET100E is suitable for high-speed data-acquisition front ends when its 180 MHz processing rate and 104 kB SRAM can service the required sampling and buffering workload. The 512 kB flash provides local storage for firmware, configuration, and calibration parameters, while the Arm Cortex-M3 core can execute real-time signal processing. Designers should verify the available ADC, timer, DMA, and external interface resources against the exact LPC1823 datasheet because related LPC18xx models can include different peripherals. PCB signal-integrity practices are especially important when sensor or communications traces are routed near the densely balled BGA device.
מומלץ
Human-Machine Interface Controller
LPC1823JET100E can manage a human-machine interface in industrial panels, instruments, and compact control consoles when the required display and input peripherals are present in the exact device. The 180 MHz Cortex-M3 core leaves performance headroom for graphical updates, menu logic, and communication tasks, while 104 kB of SRAM supports display and input buffers. The 512 kB flash is useful for storing interface firmware, fonts, and configuration data. Because LPC18xx family members can differ in LCD, Ethernet, USB, and CAN resources, engineers must confirm the exact peripheral list before assigning this part to an HMI design.
מומלץ
Portable Instrumentation Equipment
LPC1823JET100E can support portable test and measurement equipment that needs substantial on-chip memory in a compact package. Its 180 MHz Arm Cortex-M3 performance enables responsive control and data processing, while 512 kB of flash and 104 kB of SRAM allow calibration, acquisition, and buffering code to reside locally. The 9 x 9 mm TFBGA-100 package is useful for reducing overall instrument footprint. Design work should still validate supply-voltage limits, power consumption, temperature range, analog-interface availability, and low-power modes from the official datasheet because those values were not present in the supplied excerpts.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור LPC1823JET100E — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | LPC1837JET100E | LPC1827JET100E | LPC1822JET100E | LPC1815JET100E | LPC1812JET100E |
|---|---|---|---|---|---|---|
| Package | TFBGA-100 (9 x 9 mm) | TFBGA-100 (9 x 9 mm) | TFBGA-100 (9 x 9 mm) | TFBGA-100 (9 x 9 mm) | TFBGA-100 (9 x 9 mm) | TFBGA-100 (9 x 9 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Processor Core | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 | Arm Cortex-M3 |
| Software Compatibility | Arm Cortex-M3 LPC18xx family | LPC18xx family; NXP states pin- and software compatibility with many family members | LPC18xx family; NXP states pin- and software compatibility with many family members | LPC18xx family; NXP states pin- and software compatibility with many family members | LPC18xx family; NXP states pin- and software compatibility with many family members | LPC18xx family; NXP states pin- and software compatibility with many family members |
| Advanced Peripheral Set | Select LPC18xx models include Ethernet, high-speed USB 2.0, LCD, and CAN; exact LPC1823 configuration requires datasheet confirmation | Related LPC18xx configuration; exact functions require datasheet confirmation | Related LPC18xx configuration; exact functions require datasheet confirmation | Related LPC18xx configuration; exact functions require datasheet confirmation | Related LPC18xx configuration; exact functions require datasheet confirmation | Related LPC18xx configuration; exact functions require datasheet confirmation |
מבדילים עיקריים
- Large verified on-chip memory (לעומתLPC1822JET100E)
- High processing performance (לעומתLPC1815JET100E)
- Compact 100-ball BGA integration (לעומתLPC1812JET100E)
הערות תכנון
Design the PCB land pattern from the official NXP TFBGA-100 package drawing rather than inferring it from the 9 x 9 mm body size. Confirm ball pitch, solder-mask definition, paste stencil apertures, via-in-pad requirements, and assembly tolerances with the selected package-qualified board stack-up. The dense 100-ball footprint also requires careful fanout for power, ground, high-speed interfaces, and debug signals.
Provide continuous ground-plane access beneath the BGA and distribute power and ground balls according to the manufacturer's layout guidance. The verified excerpts do not provide junction-temperature limits, power dissipation, or package thermal resistance, so no thermal-rise estimate can be made. Validate the final assembly with worst-case processor activity, ambient temperature, supply voltage, PCB copper, enclosure temperature, and neighboring heat sources using the full datasheet limits.
Separate sensitive analog or sensor paths from switching and digital return currents, and keep clocks and high-speed communications routes over continuous reference planes. Use the shortest practical connections for decoupling and provide low-impedance return paths under high-speed nets. Although the verified data confirms a 100-ball TFBGA package, it does not provide the pinout or I/O voltage classes; assign nets only after checking the official ball table.
Do not treat same-family similarity as proof of interchangeability. The supplied comparison pages establish that LPC1837JET100E, LPC1827JET100E, LPC1822JET100E, LPC1815JET100E, and LPC1812JET100E are related candidates, while NXP states that LPC18xx devices are pin- and software-compatible with many family members. Before substitution, compare the exact memory sizes, peripheral population, power pins, ball functions, electrical limits, and errata for both devices.
מידע על תאימות
The supplied excerpts do not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. These fields therefore remain unknown rather than being inferred from general NXP corporate policies.
