M2GL025-VF256I - 27,696-LES FPGA | Microchip Technology
MPN: M2GL025-VF256I ✓ פעילM2GL025-VF256I סקירה
An FPGA is a programmable semiconductor that combines configurable logic, memory, and I/O resources into a digital system that can be configured after manufacture. Within the product hierarchy, the M2GL025-VF256I is a low-density FPGA, a member of the IGLOO 2 family, and a member of the broader programmable-logic and semiconductor categories. Its flash configuration technology supports repeated programming and eliminates the need for a separate configuration PROM in many embedded designs.
Principal device attributes include 27,696 logic elements and 138 I/O positions. These resources support parallel datapath processing, peripheral bridging, protocol conversion, I/O expansion, and control-plane functions. The 1.2 V core supply is intended for modern low-voltage digital systems, while the -40°C to +100°C industrial temperature range supports harsher commercial and industrial environments than a typical consumer-temperature component.
The device is identified as a low-density IGLOO 2 FPGA, with approximately 1.13 Mbits of embedded memory reported for this member. That combination provides a practical balance between logic capacity and package size for control, communications, image-processing, and system-management designs. The 256-ball surface-mount package also supports dense connections to external memory, transceivers, sensors, and high-speed interface circuitry.
Typical uses include industrial control modules, serial-interface bridges, secure-connectivity controllers, video and image-processing front ends, and embedded communication equipment. Because configuration memory is integrated, the M2GL025-VF256I can consolidate several fixed-function logic devices into one programmable implementation while retaining the flexibility to update firmware after deployment.
PCB design requires careful assignment of power, ground, configuration, clock, and user I/O balls according to the IGLOO 2 pin-description document. Confirm the supported I/O standards, voltage-tolerance limits, bank restrictions, and decoupling requirements for the selected board configuration before schematic sign-off.
This product summary combines the manufacturer’s device positioning with practical guidance for FPGA selection, package-aware PCB implementation, qualification, and drop-in replacement planning.
חלופות תחליף ישיר עבור M2GL025-VF256I — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם M2GL025-VF256I (אותו גורם צורה וטביעת רגל) — שונים ב Logic Elements, Mounting Type, Package.
M2GL025-VF256
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←M2GL025-VFG256I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
M2GL025-VFG256
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
M2GL025-VF256I דירוגים מרביים ומאפיינים חשמליים
| Device Type | IGLOO 2 Low-Density Flash FPGA |
| Logic Elements | 27,696 LE |
| User I/O | 138 I/O |
| Embedded Memory | Approximately 1.13 Mbit |
| מתח אספקה פעיל | 1.2 V |
| Minimum Operating Temperature | -40 °C |
| Maximum Operating Temperature | +100 °C |
| Temperature Grade | Industrial, -40 °C to +100 °C |
| מארז | VFPBGA-256 |
| Package Description | 256-LFBGA |
| סוג הרכבה | SMD/SMT |
| FPGA Series | IGLOO 2 |
| Configuration Memory Type | Flash |
| Programmable Logic | 27,696 LE |
מדריך תצורת פינים של M2GL025-VF256I 256-lfbga
תצורת פינים עבור M2GL025-VF256I (מארזת 256-lfbga). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור M2GL025-VF256I.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
M2GL025-VF256I מתאים עבור 6 יישוםs: Industrial Control and Automation, Serial Interface Bridging, Communications Control Plane, Secure Connectivity and Authentication, Video and Image Processing Front Ends, Aerospace and Defense Support Electronics.
Industrial Control and Automation
The M2GL025-VF256I fits industrial control logic because it combines 27,696 logic elements with 138 user I/Os in a compact 256-ball VFPBGA package. Its specified -40°C to +100°C temperature range supports controllers deployed near motors, sensors, relays, and industrial communications equipment. Engineers can use the programmable logic for state machines, protocol conversion, timing, data acquisition, and supervisory functions while consolidating several fixed devices into one configurable implementation.
מומלץ
Serial Interface Bridging
The M2GL025-VF256I is suitable for bridging legacy and modern serial interfaces because 27,696 logic elements provide substantial parallel datapath capacity while 138 I/Os support multiple external connections. The 1.2 V core supply fits low-voltage embedded systems, and flash configuration permits protocol updates after deployment. Typical bridge functions include UART, SPI, I2C, parallel-to-serial conversion, clock-domain adaptation, and buffering between heterogeneous controllers.
מומלץ
Communications Control Plane
The M2GL025-VF256I can support communications control-plane tasks that require deterministic programmable logic, parallel data handling, and multiple I/O resources. Its 27,696 logic elements and 138 I/Os suit packet classification, filtering, header processing, line-card control, and system management. The -40°C to +100°C industrial range supports communications equipment operating in variable environmental conditions, while integrated flash configuration simplifies field update of protocol logic.
מומלץ
Secure Connectivity and Authentication
The M2GL025-VF256I is appropriate for secure-connectivity controllers that combine protocol handling with programmable security logic. With 27,696 logic elements, the device can implement packet inspection, cryptographic pre-processing, key-path control, authentication sequences, and interface conversion in parallel. Its 138 I/Os provide connectivity to sensors, transceivers, secure elements, and host processors, while its 1.2 V operating supply aligns with compact low-voltage security hardware.
מומלץ
Video and Image Processing Front Ends
The M2GL025-VF256I can serve as a compact image- or video-processing front end when a design requires parallel pixel movement, thresholding, filtering, and interface conversion. The 27,696 logic elements provide configurable datapath capacity, and 138 I/Os allow connection to image sensors, memory, and display or network interfaces. System designers should use the IGLOO 2 pin documentation to confirm supported I/O standards and clocking resources for the selected video timing and resolution.
מומלץ
Aerospace and Defense Support Electronics
The M2GL025-VF256I can support programmable support functions in aerospace, defense, and avionics-related equipment when its electrical and qualification requirements match the program. Its -40°C to +100°C industrial range, 27,696 logic elements, and 138 I/Os make it suitable for monitoring, data acquisition, signal conditioning, and control sequencers. According to Microchip’s IGLOO 2 product documentation, IGLOO 2 devices are used in aviation and defense markets, but program-specific qualification must be reviewed separately.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור M2GL025-VF256I — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | M2GL025-VF256 | M2GL025-VFG256I | M2GL025-VFG256 |
|---|---|---|---|---|
| Package | VFPBGA-256 | VFPBGA-256 | VFPBGA-256 | VFPBGA-256 |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Elements | 27,696 LE | 27,696 LE | 27,696 LE | 27,696 LE |
| User I/O | 138 I/O | 138 I/O | 138 I/O | 138 I/O |
| Operating Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| FPGA Series | IGLOO 2 | IGLOO 2 | IGLOO 2 | IGLOO 2 |
| Temperature Designation | I suffix, -40°C to +100°C | Non-I suffix | I suffix | Non-I suffix |
| Configuration Memory | Flash | Flash | Flash | Flash |
מבדילים עיקריים
- Documented industrial-temperature operation (לעומתM2GL025-VF256)
- Identical core FPGA resource count (לעומתM2GL025-VFG256I)
- High logic and I/O density in a 256-ball package (לעומתM2GL025-VFG256)
הערות תכנון
Assign all 256 VF256 balls from Microchip’s IGLOO 2 pin-description document rather than treating only the 138 user I/O positions as the complete footprint. Power, ground, configuration, clock, and reserved balls must also appear in the land pattern and schematic. Confirm the selected package drawing and ball-map revision during schematic review to prevent footprint, polarity, or supply-ball errors.
Follow the IGLOO 2 datasheet for core and I/O supply topology, sequencing, decoupling, and current limits. The device operates from a 1.2 V core supply, while I/O behavior depends on the assigned bank voltage and supported standards. Place the required bypass capacitors at their prescribed package locations and preserve a low-impedance power and ground plane to reduce simultaneous-switching noise.
The -40°C to +100°C rating specifies the device’s environmental operating envelope, but it does not remove the need for a thermal design. Estimate worst-case junction temperature from FPGA power, package thermal resistance, board copper, and ambient temperature. The 256-ball BGA can distribute heat through its perimeter and center balls, yet the PCB still needs adequate copper and vias to transfer heat away from the device.
Do not substitute another M2GL025 package or a competitor device based only on logic-element count. A valid footprint match must also preserve the 256-ball arrangement, power balls, configuration interface, I/O standards, and clock resources. Before releasing a replacement design, compile the original design with the alternate suffix and review timing, pin constraints, operating-temperature requirements, and configuration behavior.
מידע על תאימות
The manufacturer product page lists the M2GL025 family as In Production. Specific RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals declarations should be confirmed from the orderable-part documentation before qualification.
