M2GL060-1FG676 - 56.5K LEs, 676-BGA IGLOO2 FPGA | Microchip
MPN: M2GL060-1FG676 ✓ פעילM2GL060-1FG676 סקירה
A low-density FPGA is a programmable-logic device that uses configurable logic blocks and programmable interconnect resources to implement digital functions in hardware. Within the product hierarchy, the M2GL060 belongs to the IGLOO2 family of Microchip FPGAs and sits below higher-density programmable-logic devices in resource capacity. This makes it useful for designs that need flexible hardware implementation without the size, power, and complexity of a larger FPGA.
The principal device characteristics are 56,520 logic elements, 387 I/O positions, a 1.14 V to 2.625 V supply range, and a 676-BGA package. The M2GL060-1FG676 ordering code identifies the -1 speed grade and FG676 package configuration. Its surface-mount BGA construction supports compact PCB designs but requires careful escape-routing and manufacturing-process planning. Microchip lists the M2GL060 family as in production.
IGLOO2 devices combine programmable logic with embedded flash configuration memory, allowing the implementation of fixed functions while retaining field-update flexibility. The architecture is suitable for protocol bridges, interface conversion, I/O expansion, control logic, and secure connectivity. Engineering designs should use the IGLOO2 pin-description guide to confirm bank assignments, power requirements, and package-specific routing before schematic capture or PCB layout.
Typical uses include industrial control and monitoring modules, communications equipment, embedded system-management blocks, and compact embedded platforms where programmable logic must coexist with an application processor. The 676-BGA footprint provides a high pin count and dense routing access, making it appropriate for designs with numerous parallel connections. The product page identifies bridging, I/O expansion, conversion, system-management, and secure-connectivity use cases.
For implementation, assign the 1.14 V to 2.625 V operating range across all relevant power rails, confirm the 0 °C to 85 °C junction-temperature constraint, and validate every BGA ball assignment against the M2GL060 IGLOO2 pin-information document. Use Microchip-supported programming and configuration tools for design implementation. Confirm the exact MPN, package, temperature grade, and production status against the current manufacturer documentation before releasing a PCB.
This page consolidates the manufacturer family status, package information, electrical limits, ordering details, and engineering guidance for the M2GL060-1FG676. It also distinguishes a verified same-package M2GL060 alternative from other package options, helping designers determine when a footprint-compatible change is possible and when a new PCB layout is required.
חלופות תחליף ישיר עבור M2GL060-1FG676 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם M2GL060-1FG676 (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Package Type.
M2GL060-FG676
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←M2GL060-1FG676 דירוגים מרביים ומאפיינים חשמליים
| Device Type | IGLOO2 low-density field-programmable gate array |
| Number of Logic Elements | 56,520 LEs |
| Number of I/O Positions | 387 I/O |
| Supply Voltage Range | 1.14 V to 2.625 V |
| טווח טמפרטורת פעולה | 0 °C to 85 °C (TJ) |
| מארז | 676-BGA, 27 mm x 27 mm |
| Package Type | FBGA-676 |
| סוג הרכבה | Surface mount |
| Device Family | IGLOO2 |
| Architecture | Flash-based FPGA |
| Product Status | Active |
| Manufacturer Lead Time | 10 weeks |
| Packaging | Tray |
| סטטוס RoHS | RoHS non-compliant |
| Programmable Logic Cells | 56,520 cells |
| Product Function | Bridging, I/O expansion, conversion, system management, and secure connectivity |
| Maximum Supply Voltage | 2.625 V |
| Minimum Supply Voltage | 1.14 V |
מדריך תצורת פינים של M2GL060-1FG676 fbga-676
תצורת פינים עבור M2GL060-1FG676 (מארזת fbga-676). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור M2GL060-1FG676.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
M2GL060-1FG676 מתאים עבור 6 יישוםs: Industrial Control Logic, Communications Interface Bridging, I/O Expansion, Secure Connectivity, Embedded System Management, Data Acquisition Front End.
Industrial Control Logic
The M2GL060-1FG676 fits industrial control modules that need flexible hardware logic for signal conditioning, sequencing, interface translation, or supervisory functions. Its 56,520 logic elements provide substantial implementation capacity, while 387 I/O positions support connections to sensors, actuators, and embedded controllers. The 1.14 V to 2.625 V operating range must be integrated into the system power tree, and the 0 °C to 85 °C junction specification must be checked against the enclosure temperature. Programmable logic also allows field updates when control paths evolve without changing the PCB.
מומלץ
Communications Interface Bridging
The M2GL060-1FG676 is appropriate for communications equipment requiring bridging, protocol conversion, or parallel-to-serial interface adaptation. Its 387 I/O positions allow implementation of multiple control and data interfaces, and the 56,520 logic elements provide room for state machines, packet handling, and timing logic. Designers should use the IGLOO2 pin-information document to confirm I/O-bank assignments and voltage compatibility. The active lifecycle status and 10-week manufacturer lead time support planned industrial programs, while current allocation should be confirmed through a quotation.
מומלץ
I/O Expansion
The M2GL060-1FG676 can serve as an I/O expansion device when an embedded controller requires more external connections than its native interface count provides. With 387 I/O positions, the IGLOO2 device can consolidate discrete buffers, level translation control, interrupt aggregation, and peripheral multiplexing. The 676-BGA package keeps the external device count low but requires disciplined escape routing and manufacturing control. Validate each signal's bank voltage, direction, pull state, and timing against the official pin-description guide before layout.
מומלץ
Secure Connectivity
The M2GL060-1FG676 fits secure-connectivity implementations that require programmable protocol handling, link control, authentication sequencing, or data-path monitoring. Its 56,520 logic elements allow dedicated hardware logic to be combined with external security components without relying entirely on a software processor. Because security designs are sensitive to implementation details, use the current Microchip documentation to validate device features, configuration methods, and known design guidance. Confirm the exact -1 speed grade during timing closure and preserve the documented 1.14 V to 2.625 V supply limits.
מומלץ
Embedded System Management
The M2GL060-1FG676 can implement centralized board-management functions such as power sequencing, status monitoring, fault aggregation, and configuration routing. Its 387 I/O positions are useful for collecting alarms and driving supervisory signals across a multi-rail embedded system, while the programmable fabric permits revisions without a PCB respin. The 0 °C to 85 °C junction-temperature range and 1.14 V to 2.625 V supply limits must be included in the worst-case thermal and power analysis. Validate every control output during power-up, reset, and fault-injection testing.
מומלץ
Data Acquisition Front End
The M2GL060-1FG676 is suitable for data-acquisition modules that need digital control around analog signal chains. Its programmable logic can coordinate acquisition sequencing, digital filtering, trigger handling, and data capture, while 387 I/O positions provide broad control connectivity. External precision components remain necessary for conditioning the analog path. Use controlled-impedance routing, quiet return paths, and separated power distribution to prevent switching and high-speed activity from disturbing sensitive measurements. The device's supply and junction-temperature limits should be checked under the highest expected ambient and processing load.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור M2GL060-1FG676 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | M2GL060-FG676 |
|---|---|---|
| Package | 676-BGA | 676-BGA |
| Brand | Microchip Technology | Microchip Technology |
| Device Family | IGLOO2 | IGLOO2 |
| Logic Elements | 56,520 LEs | 56,520 LEs |
| I/O Positions | 387 I/O | 387 I/O |
| Supply Voltage Range | 1.14 V to 2.625 V | 1.14 V to 2.625 V |
| Speed-Grade Designation | -1 | No -1 designation in ordering code |
| Programmable Architecture | Flash-based FPGA | Flash-based FPGA |
| Mounting Type | Surface mount | Surface mount |
מבדילים עיקריים
- Explicit -1 speed-grade ordering designation (לעומתM2GL060-FG676)
- Same 676-BGA footprint preserves board reuse (לעומתM2GL060-FG676)
- Identical primary logic and I/O resources (לעומתM2GL060-FG676)
הערות תכנון
Treat the 676-BGA layout as a high-density escape-routing problem. Assign every ball from the FG676 pin table, preserve the manufacturer's recommended ball-grid geometry and courtyard, and verify escape paths before placing external components. Use the IGLOO2 Packaging and Pin Descriptions User Guide as the authoritative source for bank assignments and mechanical requirements.
Design the core supply for the documented 1.14 V to 2.625 V operating range and keep each rail within its applicable limits across startup, shutdown, and load transients. Place local bypass capacitors at the device power balls according to the manufacturer pin and layout guidance. Do not infer decoupling values from a generic FPGA example because the exact configuration and design flow must be followed.
Validate junction temperature under the highest expected ambient temperature and worst-case logic activity. The stated operating range reaches 85 °C junction temperature, which leaves little thermal margin in a high-temperature enclosure. Use the package thermal data and board construction from the manufacturer documentation to determine whether exposed copper, airflow, or additional thermal measures are required.
Do not treat a shared package name as proof of unconditional interchangeability. M2GL060-FG676 has the same 676-BGA format and the same stated logic and I/O resources, but its ordering code omits the -1 speed designation. Re-run timing analysis, confirm temperature and power requirements, and complete programming or migration checks before approving the substitution.
מידע על תאימות
The Microchip USA technical listing identifies the M2GL060-1FG676 as RoHS non-compliant. RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status for other variants are unknown.
