M2GL060-FG676I - 56.5K LEs Industrial FPGA | Microchip
MPN: M2GL060-FG676I ✓ פעילM2GL060-FG676I סקירה
An FPGA is a programmable semiconductor whose logic, interconnect, and I/O resources are configured after manufacture. In the device hierarchy, the M2GL060-FG676I belongs to the IGLOO 2 family, combines the low-density FPGA product class, and sits within the broader integrated-circuit and programmable-logic markets. This distinction matters because an FPGA can implement parallel control, protocol, interface, and signal-processing functions without changing the physical PCB when logic requirements evolve.
The device provides 56,520 logic elements and 387 I/O in a 676-ball BGA package. Its 1.14 V to 2.625 V operating-voltage range supports low-voltage digital core implementations, while the industrial temperature rating extends operation beyond typical commercial temperature conditions. The 676-BGA format provides a large ball count and fine interconnect pitch, enabling the high I/O density required by complex communications, industrial, and embedded-control systems.
The M2GL060-FG676I is a flash FPGA, allowing its configuration to be stored and restored without a separate external configuration device. Its architecture is intended for general-purpose logic functions rather than application-specific signal processing. Designers can use programmable logic for bus bridging, protocol conversion, I/O expansion, supervisory functions, and secure connectivity, provided that each interface is assigned to a compatible voltage bank and satisfies the device's timing and power requirements.
Typical deployments include industrial automation controllers, communications equipment, embedded system-management logic, and bridging subsystems. In these systems, the FPGA is useful when several parallel interfaces or protocol converters must be consolidated into one programmable device. A 387-I/O device also supports designs that need substantial external connectivity while preserving a single, high-density package.
PCB implementation requires careful BGA layout, power-plane planning, and high-speed routing discipline. Designers should follow the IGLOO 2 Packaging and Pin Descriptions User Guide for ball assignments, voltage-bank mapping, and mechanical dimensions. Configuration storage, clocking, decoupling, and JTAG access should be validated against the device programming and clocking guidance before release to production.
This product record combines the manufacturer device information, package characteristics, lifecycle status, and verified cross-reference findings with practical selection guidance. It supports engineers comparing the M2GL060-FG676I against other IGLOO 2 package variants while preserving the strict requirement that a drop-in alternative use the same 676-BGA footprint and remain pin-compatible.
חלופות תחליף ישיר עבור M2GL060-FG676I — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם M2GL060-FG676I (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Logic Elements, Package Type, Programmable Logic.
M2GL060-FGG676I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
M2GL060-FG676
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←M2GL060-FGG676
✅ Drop-In✓ במלאי
$180.4688 / יחידה
הצג גיליון נתונים ←M2GL060-FG676I דירוגים מרביים ומאפיינים חשמליים
| Device Type | IGLOO 2 low-density flash FPGA |
| Logic Elements | 56,520 logic elements |
| Number of I/O | 387 I/O |
| Supply Voltage Range | 1.14 V to 2.625 V |
| Core Supply Voltage | 1.2 V |
| Package Type | 676-pin FBGA |
| Package Family | BGA family |
| Terminal Count | 676 terminals |
| Package Shape | Square |
| סוג הרכבה | Surface mount |
| טווח טמפרטורת פעולה | -40°C to 100°C junction temperature |
| Temperature Grade | Industrial |
| Configuration Memory | Flash configuration memory |
| Programmable Logic | FPGA |
| Programming Interface | JTAG |
| Primary Applications | Bridging, I/O expansion, conversion, system management, secure connectivity |
| Product Status | In production |
מדריך תצורת פינים של M2GL060-FG676I square
תצורת פינים עבור M2GL060-FG676I (מארזת square). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור M2GL060-FG676I.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
M2GL060-FG676I מתאים עבור 6 יישוםs: Industrial Automation Control, Communications Protocol Bridging, I/O Expansion and Conversion, System Management and Security Control, Embedded Equipment Controller, Data Acquisition and Signal Conditioning.
Industrial Automation Control
The M2GL060-FG676I fits industrial automation control because it combines 56,520 logic elements with 387 I/O in an industrial-grade 676-pin FBGA package. It can consolidate parallel digital control, machine-interface logic, and supervisory functions without relying on several discrete programmable components. The 1.14 V to 2.625 V operating range supports low-voltage core designs, while the -40°C to 100°C junction-temperature specification addresses industrial thermal conditions. Engineers should allocate compatible I/O standards and voltage banks according to the pin-description guide, then validate timing against the selected device speed grade before production.
מומלץ
Communications Protocol Bridging
The M2GL060-FG676I is suitable for communications bridging because 56,520 logic elements provide substantial parallel-processing capacity and 387 I/O support multiple interfaces. It can implement compatible bus bridges, interface converters, and data-routing logic when the selected I/O standards operate within their assigned voltage banks. The 676-ball FBGA offers fine-pitch routing options for space-constrained communications equipment. Design work should include timing analysis, clock-domain planning, and careful BGA escape routing. Because the device is a flash FPGA, its configuration can also be stored persistently for field-updatable communication equipment.
מומלץ
I/O Expansion and Conversion
The M2GL060-FG676I is well suited to I/O expansion and signal-conversion tasks where a system needs many external connections managed by configurable logic. Its 387 I/O can serve as parallel digital ports, status collectors, latch arrays, and interface adapters, while 56,520 logic elements provide room for associated control functions. The 676-pin FBGA keeps the device compact relative to its I/O count but requires a high-density PCB footprint and disciplined escape routing. Confirm voltage-bank limits, drive-strength options, and I/O timing against the manufacturer documentation for each external interface.
מומלץ
System Management and Security Control
The M2GL060-FG676I can implement centralized system-management logic, including power-sequencing coordination, fault aggregation, state monitoring, and secure-connectivity functions. Its 56,520 logic elements provide enough parallel capacity to combine several supervisory functions, while the 387-I/O count supports sensors, status inputs, control outputs, and external interfaces. The industrial temperature grade is useful in equipment expected to operate outside typical commercial conditions. Security functions should be reviewed for the specific implementation threat model, and sensitive configuration data should be protected through Microchip's recommended device and programming procedures.
מומלץ
Embedded Equipment Controller
The M2GL060-FG676I works well as an embedded equipment controller when the design requires programmable timing, multiple digital interfaces, and field-reconfigurable behavior. Its flash-based configuration supports persistent logic across power cycles, while 56,520 logic elements can host control, monitoring, and interface logic in one device. The 676-pin FBGA provides substantial connectivity for embedded systems but makes component placement, power delivery, and thermal design important. Engineers should define the configuration memory update process and include recovery behavior for incomplete programming events before deploying the controller in production equipment.
מומלץ
Data Acquisition and Signal Conditioning
The M2GL060-FG676I can support data-acquisition front ends that require parallel sampling control, digital filtering, status monitoring, and interface conversion. Its 387 I/O permits numerous data and control connections, while the 56,520 logic elements can accommodate acquisition sequencing and preprocessing functions. The 1.14 V to 2.625 V device supply range suits low-voltage digital cores, although external analog front ends remain separate. Designers should evaluate timing skew, input thresholds, output standards, and pin-bank compatibility for each acquisition channel, especially where sensor outputs operate outside the FPGA's permitted I/O voltage ranges.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור M2GL060-FG676I — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | M2GL060-FGG676I | M2GL060-FG676 | M2GL060-FGG676 |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 676-pin FBGA | 676-pin FBGA | 676-pin FBGA | 676-pin FBGA |
| FPGA Family | IGLOO 2 | IGLOO 2 | IGLOO 2 | IGLOO 2 |
| Logic Elements | 56,520 logic elements | 56,520 logic elements | 56,520 logic elements | 56,520 logic elements |
| Number of I/O | 387 I/O | 387 I/O | 387 I/O | 387 I/O |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Supply Voltage Range | 1.14 V to 2.625 V | 1.14 V to 2.625 V | 1.14 V to 2.625 V | 1.14 V to 2.625 V |
| Configuration Memory | Flash | Flash | Flash | Flash |
| Order-Code Suffix | FG676I | FGG676I | FG676 | FGG676 |
מבדילים עיקריים
- High-density programmable logic in a single industrial-grade device (לעומתM2GL060-FGG676I)
- Industrial operating-temperature suitability (לעומתM2GL060-FG676)
- Persistent configuration in a 676-ball package (לעומתM2GL060-FGG676)
הערות תכנון
Implement the 676-ball FBGA on a multilayer PCB with short, symmetrical escape routes and an uninterrupted reference-plane arrangement beneath the device. Follow the package drawing for ball pitch, solder-mask definition, and land pattern rather than scaling a generic BGA footprint. The large I/O count makes escape routing congested, so assign high-speed interfaces to electrically favorable banks before fixing the external connector placement and board outline.
Partition the 1.14 V to 2.625 V supply requirements into core and I/O-bank rails according to the device documentation, then provide local decoupling at the associated balls. Use the pin-description tables to distinguish supply classes and prohibited connections. Validate steady-state and transient loading for the selected I/O configuration because simultaneous high-speed activity can change current demand beyond a design based only on average consumption.
Use the IGLOO 2 Packaging and Pin Descriptions User Guide as the controlling reference for ball assignments and voltage banks. Place configuration, clock, reset, and JTAG access for straightforward programming and debug. Keep sensitive or high-speed routing away from noisy switching nodes where practical, and maintain continuous return paths beneath routed signals to reduce coupling and crosstalk across the densely interconnected BGA footprint.
Do not substitute a different ball-count package merely because it belongs to the M2GL060 family. The M2GL060-FGG676I is documented as a complete replacement because its terminals and package are consistent with the target. Any other package requires a PCB and pinout review, while changes to the temperature-grade suffix require confirmation that the replacement remains suitable for the intended operating environment.
מידע על תאימות
The target is an industrial-grade FPGA, but no specific RoHS, REACH, lead-free, halogen-free, or conflict-minerals declaration was identified for this exact order code.