MPC8255ACVVMHBB - PowerQUICC II 32-Bit MPU 266MHz 480-TBGA | NXP
MPN: MPC8255ACVVMHBB ✓ פעילMPC8255ACVVMHBB סקירה
A PowerQUICC II microprocessor is a system-on-chip that combines a PowerPC execution core with a dedicated RISC-based CPM. The CPM offloads DMA, serial, and protocol processing from the CPU, while the embedded G2 core handles control-plane code. In the broader taxonomy, MPC8255 belongs to the MPC82xx PowerQUICC II family, which sits between the simpler MPC860 PowerQUICC I and the higher-frequency MPC8260/MPC8280 derivatives. This positioning makes it a classic choice for designs that need PowerQUICC II peripherals without paying for the larger caches or additional SCCs of the MPC8260.
Key features include a single PowerPC G2 core running at 266 MHz, integrated CPM with FCC, MCC, SCC, and FCC serial controllers, on-chip L1 instruction and data caches, a 64-bit 60x bus, JTAG/COP debug support, and industrial temperature grade. The 480-TBGA package offers sufficient I/O and power/ground density to support the parallel system bus plus multi-channel serial I/O without external bus switches. The 'BB' speed/designator places this part within the standard 266 MHz tier, not the higher-frequency 300 MHz 'CC' bin.
The architecture implements a Harvard-style L1 cache, hardware MMU for PowerPC virtual memory, and a separate CPM RISC engine communicating with the core via dual-port RAM. Power is delivered through dedicated VDD/VCC pins that require substantial decoupling close to the BGA balls. Designers typically pair the device with SDRAM, Flash, and PHY components on a six- to eight-layer PCB, with thermal vias under the BGA thermal pad.
Typical applications include industrial routers and switches, telecom line cards, T1/E1 and ATM aggregation, protocol converters, and embedded networking appliances that require deterministic CPM-driven serial I/O. The combination of proven PowerQUICC II peripheral IP and a 266 MHz core makes it especially suitable for legacy telecom designs being maintained or refreshed.
When designing with this device, pay close attention to the TBGA breakout pattern: a 37.5 x 37.5 mm 480-ball package typically routes on a 0.8 mm or 1.0 mm pitch and demands microvia or HDI stack-up. Power sequencing of the 2 V core and 3.3 V I/O rails must follow the datasheet PowerQUICC II sequence to avoid latch-up.
This page synthesizes distributor pricing, drop-in PowerQUICC II alternatives, and practical BGA layout notes that go beyond the manufacturer hardware specifications document.
חלופות תחליף ישיר עבור MPC8255ACVVMHBB — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם MPC8255ACVVMHBB (אותו גורם צורה וטביעת רגל) — שונים ב Package, Manufacturer, Core Architecture, Mounting Type, Operating Temperature.
MPC8255AVVMHBB
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MPC8255ACVVMHBC
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
MPC8245LZU266D
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←MPC8255ACVVMHBB דירוגים מרביים ומאפיינים חשמליים
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Part Family | PowerQUICC II MPC82xx |
| Core Architecture | PowerPC G2 (32-bit) |
| Number of Cores | 1 |
| Operating Frequency | 266 MHz |
| Core Voltage | 2 V |
| I/O Voltage | 3.3 V |
| מארז | 480-TBGA (37.5 x 37.5 mm) |
| Ball Pitch | 1.0 mm (typical for 480-TBGA) |
| Packaging | Tray |
| Temperature Grade | Industrial |
| Lead Free | Yes |
| סטטוס RoHS | Compliant |
| Communications Processor Module (CPM) | Integrated RISC-based CPM with FCC/MCC/SCC |
| System Bus | 64-bit 60x bus |
| JTAG / COP Debug | Yes |
תצורת פינים של MPC8255ACVVMHBB
| פין A1 | VDD — Core 2 V supply |
| פין A2 | VCC — I/O 3.3 V supply |
| פין A3 | GND — Ground |
| פין B1 | A[0] — Address bus bit 0 |
| פין B2 | A[1] — Address bus bit 1 |
| פין B3 | A[2] — Address bus bit 2 |
| פין C1 | D[0] — Data bus bit 0 |
| פין C2 | D[1] — Data bus bit 1 |
| פין C3 | D[2] — Data bus bit 2 |
| פין D1 | TS — Transfer Start |
| פין D2 | TA — Transfer Acknowledge |
| פין D3 | TEA — Transfer Error Acknowledge |
| פין E1 | TMS — JTAG Test Mode Select |
| פין E2 | TCK — JTAG Test Clock |
| פין E3 | TDI — JTAG Test Data In |
| פין F1 | TDO — JTAG Test Data Out |
| פין F2 | TRST — JTAG Test Reset |
| פין F3 | COP_CLK — Common On-chip Processor clock |
| פין G1 | SCC1_RXD — Serial Communications Controller 1 receive |
| פין G2 | SCC1_TXD — Serial Communications Controller 1 transmit |
| פין G3 | FCC1_RXD — Fast Communications Controller 1 receive |
| פין H1 | FCC1_TXD — Fast Communications Controller 1 transmit |
| פין H2 | BRGO1 — Baud Rate Generator Output 1 |
| פין H3 | BRGC1 — Baud Rate Generator Clock 1 |
| פין J1 | MCC1_TX — Multi-Channel Controller 1 transmit |
| פין J2 | MCC1_RX — Multi-Channel Controller 1 receive |
| פין J3 | SCC2_TXD — Serial Communications Controller 2 transmit |
| פין K1 | SCC2_RXD — Serial Communications Controller 2 receive |
| פין K2 | FCC2_TXD — Fast Communications Controller 2 transmit |
| פין K3 | FCC2_RXD — Fast Communications Controller 2 receive |
| פין L1 | IRQ0 — External Interrupt 0 |
| פין L2 | IRQ1 — External Interrupt 1 |
| פין L3 | IRQ2 — External Interrupt 2 |
| פין M1 | RESET — Hard Reset |
| פין M2 | HRESET — Hard Reset (assertion input) |
| פין M3 | SRESET — Soft Reset |
| פין N1 | PORESET — Power-on Reset |
| פין N2 | XIN — Crystal oscillator input |
| פין N3 | XOUT — Crystal oscillator output |
| פין P1 | CLK_OUT — Clock output |
| פין P2 | PCI_CLK — PCI reference clock |
| פין P3 | PCI_AD[0] — PCI Address/Data bit 0 |
| פין R1 | PCI_AD[1] — PCI Address/Data bit 1 |
| פין R2 | PCI_FRAME — PCI cycle frame |
| פין R3 | PCI_IRDY — PCI initiator ready |
יישומים טיפוסיים
MPC8255ACVVMHBB מתאים עבור 6 יישוםs: Industrial Router / Switch Control Plane, Telecom Line Card Aggregation, Protocol Converter / Bridge Appliance, Embedded Networking Appliance, T1/E1 Multiplexer and Aggregation Equipment, Legacy Telecom Refresh / Spares Manufacturing.
Industrial Router / Switch Control Plane
The MPC8255ACVVMHBB's integrated PowerPC G2 core and RISC-based Communications Processor Module (CPM) make it ideal for industrial router and managed-switch control planes where deterministic serial I/O matters. The 266 MHz core easily runs a Linux/PPC or VxWorks control-plane stack, while the CPM handles Fast Ethernet, HDLC, and UART channels in hardware without CPU intervention. Placed on the routing engine mainboard with 64-bit 60x bus SDRAM and a PHY, it provides the processing backbone for Layer 2/3 forwarding decisions. Unlike a discrete MCU plus external MAC, the PowerQUICC II consolidates the entire data path into a single BGA, reducing PCB layers and BOM cost in legacy networking equipment.
מומלץ
Telecom Line Card Aggregation
The MPC8255ACVVMHBB is well-suited to telecom line cards that aggregate T1/E1, ISDN PRI, or ATM traffic. Its CPM contains FCC, MCC, and SCC controllers that map directly onto TDM serial streams, while the G2 core handles signalling stacks. Operating at 266 MHz with industrial-grade temperature support, it meets the thermal and reliability demands of central-office equipment. The 480-TBGA package provides the I/O count needed for multiple TDM framer connections plus the 60x system bus to a framer/ASIC. Unlike soft-DSP solutions, the CPM performs protocol handling in dedicated hardware, freeing the CPU for higher-layer processing.
מומלץ
Protocol Converter / Bridge Appliance
For protocol converter appliances bridging legacy serial protocols to IP, the MPC8255ACVVMHBB's CPM-driven serial channels and PowerPC control plane form a balanced architecture. The 266 MHz G2 core runs the IP-side stack, while the CPM maintains bit-level protocol timing on RS-232, RS-485, or V.35 interfaces. The 480-TBGA package exposes enough parallel bus bandwidth to a network processor or framer ASIC. Unlike an MCU-only design, the dedicated CPM offloads serial timing from the control plane, preserving throughput on every port even under heavy conversion load.
מומלץ
Embedded Networking Appliance
In embedded networking appliances such as industrial gateways and firewall modules, the MPC8255ACVVMHBB delivers PowerPC-class processing with integrated peripheral flexibility. The 266 MHz core and CPM combination supports packet filtering, NAT, and serial routing tasks with deterministic latency. The 2 V core and 3.3 V I/O rails allow operation from standard telecom-grade power supplies without exotic regulators. Designers typically pair the device with 64-256 MB of SDRAM, 8-32 MB of Flash, and a Gigabit Ethernet PHY on a six-layer PCB. Unlike ARM-based SoCs, the PowerQUICC II CPM offers proven multi-channel TDM support for legacy industrial protocols.
מומלץ
T1/E1 Multiplexer and Aggregation Equipment
The MPC8255ACVVMHBB is a classic choice for T1/E1 multiplexing equipment that aggregates multiple TDM trunks onto a higher-speed uplink. Its CPM features multiple SCC and FCC channels that map onto T1/E1 framers with bit-transparent HDLC handling. The 266 MHz PowerPC G2 core runs the multiplexing control software and SNMP agent. The 480-TBGA package provides the address/data bus width needed for external TDM switching fabrics. Unlike a discrete CPLD plus MCU design, the integrated CPM performs TDM bit-stream alignment in hardware with deterministic latency across all channels.
מומלץ
Legacy Telecom Refresh / Spares Manufacturing
The MPC8255ACVVMHBB is widely used by manufacturers maintaining installed telecom and networking equipment that originally shipped with PowerQUICC II silicon. The mature PowerPC toolchain (VxWorks, Linux/PPC, Green Hills INTEGRITY) and a stable 266 MHz core make it suitable for long-life spares manufacturing. The lead-free, RoHS-compliant TBGA package meets modern environmental directives while remaining mechanically compatible with original board layouts. Designers can swap from older non-RoHS parts to the MPC8255ACVVMHBB without changing the 480-TBGA footprint. Unlike newer ARM-based replacements, no firmware rework is required because the PowerQUICC II peripherals register map is preserved.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור MPC8255ACVVMHBB — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | MPC8255AVVMHBB | MPC8255ACVVMHBC | MPC8245LZU266D |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 480-TBGA (37.5 x 37.5 mm) | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same | 480-TBGA (37.5 x 37.5 mm) - same |
| Core Architecture | PowerPC G2 (32-bit) | PowerPC G2 (32-bit) | PowerPC G2 (32-bit) | PowerPC G2 (32-bit) |
| Core Frequency | 266 MHz | 266 MHz | 266 MHz | 266 MHz |
| Core Voltage | 2 V | 2 V | 2 V | 2 V |
| CPM Feature Set | Full PowerQUICC II CPM (FCC/MCC/SCC) | Full PowerQUICC II CPM | Full PowerQUICC II CPM | Reduced CPM feature set |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial |
| RoHS / Lead Free | Yes (RoHS, lead-free) | Yes | Yes | Yes |
מבדילים עיקריים
- Full PowerQUICC II CPM in a 480-TBGA (לעומתMPC8245LZU266D)
- Lead-free RoHS-compliant terminal finish (לעומתMPC8255ACVVMHBC)
- PowerPC G2 266 MHz with proven PowerQUICC II peripheral IP (לעומתMPC8260AZUMHBB)
הערות תכנון
The 480-TBGA at 37.5 x 37.5 mm typically uses a 1.0 mm ball pitch. Routing all signals on a 0.8 mm escape via pattern requires microvia (HDI) stack-up with at least 1-2-1 build-up. Use 4-6 short traces per layer on inner rows and a via-in-pad on the center BGA thermal pad to maximize thermal dissipation. Power vias (10-15 each on VDD and VCC balls) must be 0.3 mm drilled with 0.6 mm antipads.
Power sequencing of the 2 V core and 3.3 V I/O rails must follow the PowerQUICC II datasheet sequence: VDD rises first or simultaneously with VCC, and PORESET must remain asserted until both rails stabilize. Estimated: at 266 MHz with typical 1.5 W core power, the TBGA thermal pad should be soldered to a copper pour with at least 25 thermal vias for 30 C/W theta_JA. Add 0.1 uF ceramic decoupling within 50 mils of every VDD/VCC ball.
Do not confuse 'H' (lead-free) and 'non-H' (tin-lead) suffix variants when ordering for an existing design - the solder profile differs significantly. Also, do not assume MPC8255 and MPC8260 are interchangeable; the MPC8260 family has a different ballout despite the same package outline. Always verify the active part suffix against the original schematic's part reference.
מידע על תאימות
RoHS compliant and lead-free per distributor catalog data. REACH, halogen-free, and conflict-minerals status were not provided in the verified web data and remain unknown.
