PIC18LF27J53-I/ML - 128KB Flash USB 8-bit MCU 28-QFN | Microchip
MPN: PIC18LF27J53-I/ML ✓ פעילPIC18LF27J53-I/ML סקירה
An 8-bit microcontroller (MCU) is a small, self-contained computing system on a single silicon die that integrates a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of peripheral blocks (timers, ADC, communication controllers, I/O). MCUs are the silicon building blocks of the embedded hierarchy: microcontroller -> embedded processor -> edge compute node -> IoT endpoint, and the PIC18 family sits in the mainstream 8-bit tier used for human-interface, motor-control, sensor-conditioning, and USB-connected consumer/industrial designs.
Key specifications include 128KB (64K x 16) Flash, 4KB SRAM, a 10-bit ADC with up to 12 channels, multiple timers, PWM, I2C/SPI/UART/USART/USB, deep-sleep nanoWatt XLP modes, and an operating voltage of 2.0 V to 3.6 V (LF variant). The 28-pin QFN footprint and industrial -40C to +85C temperature range suit compact, fan-less, USB-equipped designs such as HID peripherals, point-of-sale terminals, and low-cost data loggers.
The PIC18LF27J53 architecture combines a RISC-style 8-bit core with a 16-bit instruction path, hardware multiplier, C-friendly compiler support (XC8), and self-programming Flash for in-field firmware updates. Its deep-sleep current is in the nanoamp range, enabling years of standby operation from small coin-cell or Li-ion batteries.
Typical applications include USB Human Interface Devices (HID), sensor/IoT nodes, portable medical accessories, industrial control panels, low-cost instrumentation, and consumer devices that require a reliable USB stack with low active and standby power draw.
When designing with this part, plan the PCB layout to expose the exposed pad (EP) to a copper pour for thermal relief and ground return, place the 12 MHz external crystal (if used for USB accuracy) within a few millimeters of the OSC pins, and route the USB D+/D- pair as a 90-ohm differential with matched length to maintain USB compliance.
This page synthesizes distributor pricing, drop-in QFN-28 alternatives, and practical design notes not found in the manufacturer datasheet.
חלופות תחליף ישיר עבור PIC18LF27J53-I/ML — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC18LF27J53-I/ML (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Operating Temperature, Core Architecture, Timers.
PIC18F27J53-I/ML
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC18LF27J53T-I/ML
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC18LF26J53-I/ML
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC18LF27J13-I/ML
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC18LF26J50-I/ML
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
PIC18LF26K83-I/ML
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC18LF27J53-I/ML דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | PIC18 8-bit |
| Series | PIC18LF27J53 (PIC XLP 18J family) |
| Program Memory (Flash) | 128 KB (64K x 16) |
| RAM | 4 KB |
| Maximum CPU Speed | 48 MHz |
| Operating Voltage (LF) | 2.0 V to 3.6 V |
| I/O Pins | 22 (approx, varies by peripheral remap) |
| ADC | 10-bit, up to 12 channels |
| USB | USB 2.0 Full-Speed device, internal transceiver |
| Timers | Multiple 8-bit and 16-bit timers |
| Communication | UART, SPI, I2C, USB |
| טמפרטורת פעולה | -40 C to +85 C (Industrial, 'I') |
| מארז | 28-pin QFN (ML) 6x6 mm with exposed pad |
| סוג הרכבה | Surface Mount |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC18LF27J53-I/ML
| פין 1 | RA0 — GPIO / AN0 |
| פין 2 | RA1 — GPIO / AN1 |
| פין 3 | RA2 — GPIO / AN2 |
| פין 4 | RA3 — GPIO / AN3 |
| פין 5 | VDD — Positive supply (2.0-3.6V) |
| פין 6 | VSS — Ground reference |
| פין 7 | RA4 — GPIO / AN4 / SOSCO |
| פין 8 | RA5 — GPIO / AN5 / SOSCI |
| פין 9 | RA6 — GPIO / OSC2 |
| פין 10 | RA7 — GPIO / OSC1 |
| פין 11 | RB0 — GPIO / INT0 |
| פין 12 | RB1 — GPIO / INT1 |
| פין 13 | RB2 — GPIO / INT2 |
| פין 14 | RB3 — GPIO |
| פין 15 | RB4 — GPIO |
| פין 16 | RB5 — GPIO |
| פין 17 | RB6 — GPIO / PGC (ICD) |
| פין 18 | RB7 — GPIO / PGD (ICD) |
| פין 19 | VUSB — USB internal regulator output (3.3V) |
| פין 20 | D- — USB D- data line |
| פין 21 | D+ — USB D+ data line |
| פין 22 | RC0 — GPIO |
| פין 23 | RC1 — GPIO / T1OSI |
| פין 24 | RC2 — GPIO / T1OSO |
| פין 25 | RC3 — GPIO |
| פין 26 | RC4 — GPIO / D-/D+ selectable |
| פין 27 | RC5 — GPIO |
| פין 28 | RC6 — GPIO / TX |
| פין EP | EP — Exposed thermal pad - connect to VSS for thermal relief |
יישומים טיפוסיים
PIC18LF27J53-I/ML מתאים עבור 7 יישוםs: USB Human Interface Devices (HID), Portable Medical Accessories, Industrial Sensor Nodes & Data Loggers, Consumer Point-of-Sale Terminals, IoT Edge Sensor Hubs, Audio Control Surfaces & MIDI Controllers, Automotive Infotainment Accessories.
USB Human Interface Devices (HID)
The PIC18LF27J53-I/ML is purpose-designed for USB 2.0 Full-Speed HID peripherals such as keyboards, mice, game controllers, and custom input devices. Its integrated USB SIE and on-chip transceiver eliminate the external PHY, while 128 KB Flash comfortably holds Microchip's MCHPFSUSB HID stack plus application code. At 48 MHz the MCU meets USB Full-Speed timing without compromise. Place a 1.5 kohm pull-up on D+ for device detection. Power from the USB bus via an onboard 3.3V LDO, leveraging the LF variant's 2.0-3.6V operating range.
מומלץ
Portable Medical Accessories
Battery-powered medical accessories benefit from the PIC18LF27J53-I/ML's nanoWatt XLP deep-sleep mode, which drops current consumption into the nanoamp range. Combined with the 2.0 V minimum supply, the device runs directly from a single Li-ion or 2x AA cells for pulse oximeters, thermometers, and glucose-meter accessories. The 10-bit ADC captures analog sensor data, and 128 KB Flash stores USB CDC stack plus proprietary protocol layers. Use the exposed pad (EP) for thermal relief during continuous ADC sampling.
מומלץ
Industrial Sensor Nodes & Data Loggers
In factory automation, the PIC18LF27J53-I/ML serves as a 4-20 mA loop-powered or RS-485-connected sensor node. Its 10-bit ADC reads multiple analog channels (temperature, pressure, flow) while UART/SPI interfaces to external sensor front-ends. The industrial -40C to +85C temperature rating meets factory-floor requirements, and 128 KB Flash stores calibration tables plus logging firmware. The integrated USB allows factory calibration via direct PC connection without an external programmer.
מומלץ
Consumer Point-of-Sale Terminals
Low-cost POS terminals and barcode scanners leverage the PIC18LF27J53-I/ML for USB CDC (virtual COM port) or HID (keyboard emulation) communication with a host PC or tablet. The MCU's 48 MHz performance and USB Full-Speed capability ensure responsive barcode-to-keystroke translation. With 4 KB RAM, intermediate buffers are sufficient for typical barcode data. The 28-QFN (ML) footprint enables thin, handheld scanner form factors. Use the LF variant when the host provides only 3.3 V.
מומלץ
IoT Edge Sensor Hubs
Edge IoT hubs aggregating sensor data from SPI/I2C peripherals rely on the PIC18LF27J53-I/ML's multi-channel ADC, multiple UART/SPI/I2C buses, and integrated USB for gateway connectivity. The 128 KB Flash accommodates MQTT-over-USB or vendor-specific protocols. Deep-sleep XLP mode extends battery life to years on coin-cell for intermittently-sampled sensors. Pair with an external LoRa/BLE module via UART for wireless uplink.
מומלץ
Audio Control Surfaces & MIDI Controllers
USB MIDI controllers and audio control surfaces benefit from the PIC18LF27J53-I/ML's integrated USB Full-Speed and 128 KB Flash for MIDI class driver implementation. Encoders, buttons, and faders connect to GPIO or via I2C I/O expanders; status LEDs are PWM-driven. The 48 MHz core handles USB 1ms polling interval easily. Choose the LF variant for bus-powered 3.3 V designs, or the F variant for 5 V-bus systems. The exposed pad aids thermal dissipation under heavy LED load.
מומלץ
Automotive Infotainment Accessories
While not AEC-Q100 qualified, the PIC18LF27J53-I/ML powers non-safety automotive accessories such as USB chargers, interior LED controllers, and OBD-II diagnostic dongles. The -40C to +85C industrial range handles cabin environments, and the integrated USB Full-Speed enables direct host connectivity. Use an external automotive-qualified LDO for power conditioning. For AEC-Q100 requirements, consider the PIC18F27J53-I/ML family upgrade path or migrate to a dedicated automotive MCU.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC18LF27J53-I/ML — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC18F27J53-I/ML | PIC18LF27J53T-I/ML | PIC18LF26J53-I/ML | PIC18LF27J13-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN (ML) 6x6 mm | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same | 28-QFN (ML) 6x6 mm - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operating Voltage | 2.0 V to 3.6 V (LF) | 4.2 V to 5.5 V (F) | 2.0 V to 3.6 V (LF) | 2.0 V to 3.6 V (LF) | 2.0 V to 3.6 V (LF) |
| Flash Memory | 128 KB | 128 KB | 128 KB | 64 KB | 128 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Max CPU Speed | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Integrated USB | Yes (USB 2.0 FS device) | Yes (USB 2.0 FS device) | Yes (USB 2.0 FS device) | Yes (USB 2.0 FS device) | Yes (USB 2.0 FS device) |
| ADC | 10-bit, up to 12 channels | 10-bit, up to 12 channels | 10-bit, up to 12 channels | 10-bit, up to 12 channels | 10-bit, up to 12 channels |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
מבדילים עיקריים
- Higher Flash density vs same-package 26J53 sibling (לעומתPIC18LF26J53-I/ML)
- Integrated USB 2.0 Full-Speed vs non-USB K-series sibling (לעומתPIC18LF26K83-I/ML)
- Low-voltage operation down to 2.0 V vs F variant minimum 4.2 V (לעומתPIC18F27J53-I/ML)
הערות תכנון
The 28-pin QFN (ML) package has a center exposed thermal pad (EP) that must be soldered to a copper pad on the PCB for mechanical reliability and thermal relief. Connect EP to the VSS ground plane with multiple thermal vias for best heat dissipation. According to Microchip QFN PCB layout application notes, omitting EP soldering causes severe current-lift under load and may void warranty. Place 100nF decoupling capacitors within 3 mm of every VDD/VSS pair.
USB Full-Speed compliance requires a 90-ohm differential impedance on the D+/D- pair. Route D+ and D- as a matched-length differential pair on the top layer with continuous ground beneath. A 1.5 kohm pull-up on D+ (to 3.3V) signals device connection to the host. For bus-powered designs, ensure VUSB decoupling (100nF + 4.7uF) is placed within 5 mm of the VUSB pin.
Estimated: At 48 MHz with all peripherals active, core current draw is approximately 15-20 mA at 3.3 V. Continuous ADC sampling plus USB Full-Speed traffic may push dissipation to 70-90 mW. With the QFN-28 EP soldered to a 1-square-inch copper pour, theta_JA is around 35-40 C/W, keeping junction rise well below 5 C above ambient. No external heatsink is required for typical 8-bit MCU workloads.
מידע על תאימות
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - use this part for industrial/consumer designs; select an automotive-grade PIC18 K-series variant for AEC-Q100 requirements.
