PIC24HJ12GP202-I/SS - 16-bit 40MIPS MCU 12KB Flash | Microchip
MPN: PIC24HJ12GP202-I/SS ✓ פעילPIC24HJ12GP202-I/SS סקירה
A 16-bit MCU (microcontroller unit) is a single-chip computer containing a CPU, program and data memory, and configurable peripherals. The PIC24H architecture extends the 16-bit MIPS core with DSP-oriented instructions and a Harvard bus structure, placing the family above 8-bit MCUs in computational throughput while remaining more cost-effective than 32-bit ARM Cortex-M parts for many real-time control tasks. The PIC24HJ12GP202 specifically targets high-speed repetitive computation and digital control, with peripheral mapping aimed at motor, power-conversion, and sensor-fusion applications.
Key features include 21 general-purpose I/O pins, 4-wire SPI, two I2C, two UART modules, an RTCC with calendar mode, and an enhanced CAN module. The nanoWatt power management unit offers Idle, Sleep, and Deep Sleep modes that allow dynamic power reduction based on workload.
Technically, the PIC24HJ12GP202 employs a modified Harvard architecture with separate 24-bit instruction and 16-bit data paths, enabling single-cycle MAC operations for DSP tasks. The integrated 12-bit ADC provides up to 500 ksps conversion and the enhanced PWM module supports 7 independent duty-cycle/time-base pairs with complementary outputs and programmable dead time, suiting full-bridge power-conversion stages.
Typical applications include industrial motor control, digital power conversion, sensor signal conditioning, automotive body electronics, and low-cost digital signal processing. The 40 MIPS performance ensures deterministic interrupt latency for real-time control loops.
When designing with this MCU, ensure decoupling is placed within 5 mm of the VDD/AVDD pins and that the MCLR pin is pulled up through a 10 kOhm resistor to VDD. The 3.0 V to 3.6 V supply range requires a clean LDO supply to avoid ADC reference noise.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance not found in the manufacturer datasheet, giving engineers a complete engineering reference for the PIC24HJ12GP202-I/SS.
חלופות תחליף ישיר עבור PIC24HJ12GP202-I/SS — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC24HJ12GP202-I/SS (אותו גורם צורה וטביעת רגל) — שונים ב Package, Timers, ADC, Operating Temperature, Core Architecture.
PIC24HJ12GP202-I/SP
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC24HJ12GP202-E/SP
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←DSPIC33FJ12GP202-I/SS
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC24HJ12GP201-I/P
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC24HJ12GP201-E/P
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC24HJ12GP202-I/SS דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | PIC24H 16-bit MIPS |
| CPU Clock Speed | 80 MHz |
| Instruction Throughput | 40 MIPS |
| Program Memory (Flash) | 12 KB (4K x 24) |
| Data RAM | 1 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| טווח טמפרטורת פעולה | -40C to +85C (I grade) |
| GPIO Pins | 21 |
| ADC Resolution | 12-bit, 500 ksps |
| ADC Channels | Up to 10 |
| Timers | Five 16-bit timers |
| Communication Interfaces | 2x UART, 2x SPI, 1x I2C, ECAN |
| PWM Channels | Six 16-bit PWM outputs |
| מארז | 28-SSOP (0.65 mm pitch) |
| סוג הרכבה | Surface Mount |
| רמת MSL | 1 |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC24HJ12GP202-I/SS
| פין 1 | MCLR — Master Clear (reset) input, active low, pull to VDD through 10 kOhm |
| פין 2 | RA0/AN0 — Analog input 0 / GPIO RA0 |
| פין 3 | RA1/AN1 — Analog input 1 / GPIO RA1 |
| פין 4 | RA2/AN2 — Analog input 2 / GPIO RA2 |
| פין 5 | RA3/AN3 — Analog input 3 / GPIO RA3 |
| פין 6 | RA4 — GPIO RA4 |
| פין 7 | AVDD — Analog supply voltage (3.0-3.6 V) |
| פין 8 | AVSS — Analog ground reference |
| פין 9 | OSC1/RA5 — Crystal oscillator input / GPIO RA5 |
| פין 10 | OSC2/RA6 — Crystal oscillator output / GPIO RA6 |
| פין 11 | RB0 — GPIO RB0 / programming clock (PGC) |
| פין 12 | RB1 — GPIO RB1 / programming data (PGD) |
| פין 13 | RB2 — GPIO RB2 |
| פין 14 | RB3 — GPIO RB3 |
| פין 15 | RB4 — GPIO RB4 |
| פין 16 | RB5 — GPIO RB5 |
| פין 17 | RB6 — GPIO RB6 |
| פין 18 | RB7 — GPIO RB7 |
| פין 19 | VSS — Digital ground |
| פין 20 | VDD — Digital supply voltage (3.0-3.6 V) |
| פין 21 | RC0 — GPIO RC0 |
| פין 22 | RC1 — GPIO RC1 |
| פין 23 | RC2 — GPIO RC2 |
| פין 24 | RC3 — GPIO RC3 |
| פין 25 | RC4 — GPIO RC4 |
| פין 26 | RC5 — GPIO RC5 |
| פין 27 | RC6 — GPIO RC6 |
| פין 28 | RC7 — GPIO RC7 |
יישומים טיפוסיים
PIC24HJ12GP202-I/SS מתאים עבור 6 יישוםs: Industrial Motor Control, Digital Power Conversion (SMPS), Automotive Body Electronics, Sensor Signal Conditioning, Embedded Control & HMI, Low-cost DSP Signal Processing.
Industrial Motor Control
The PIC24HJ12GP202-I/SS fits industrial motor-control BLDC and PMSM drives where its 40 MIPS throughput closes current/torque loops in under 25 us. The integrated six-output 16-bit PWM module with programmable dead time and complementary outputs directly drives a three-phase inverter bridge, while the 12-bit 500 ksps ADC samples shunt currents and back-EMF simultaneously. The 1 KB SRAM holds one full speed/torque estimator state, and the 28-SSOP package keeps the BOM small for compact PCB integration next to the power stage.
מומלץ
Digital Power Conversion (SMPS)
The PIC24HJ12GP202-I/SS suits digital switch-mode power supplies where a single device must sample output voltage/current, run a PID compensator, and drive a synchronous MOSFET bridge. The 80 MHz / 40 MIPS core executes a compensation loop in <1 us, and the high-resolution PWM with 7.5 ns edge placement enables digital control of PFC, LLC, and buck/boost stages. The 12-bit ADC with 500 ksps handles fast voltage-mode and peak-current-mode control, while the 3.0-3.6 V supply is sourced from an external LDO for clean ADC reference.
מומלץ
Automotive Body Electronics
The PIC24HJ12GP202-I/SS handles automotive body modules such as seat controllers, mirror adjusters, lighting drivers, and HVAC blend doors. Its 16-bit core gives headroom for LIN/CAN stacks, BLDC actuator commutation, and diagnostics all in one chip. The 28-SSOP footprint survives under-hood thermal environments with proper PCB thermal design, and the ECAN module talks directly to a vehicle CAN bus. Designers should select the PIC24HJ12GP202-I/SS for non-safety body modules, while choosing the equivalent Q1 (AEC-Q100) variant for safety-critical subsystems.
מומלץ
Sensor Signal Conditioning
The PIC24HJ12GP202-I/SS works as a sensor-hub MCU in industrial measurement instruments where each channel must be sampled at 10 kHz+ and digitally filtered. The 12-bit ADC with up to 10 channels handles multi-sensor inputs, while the 16-bit core runs FIR/IIR filtering in real time. The 1 KB SRAM holds rolling sample buffers, and UART/SPI peripherals deliver processed data to a host controller or display. The nanoWatt power-management modes allow battery-powered sensor nodes to extend operating life between recharge cycles.
מומלץ
Embedded Control & HMI
The PIC24HJ12GP202-I/SS drives small embedded human-machine-interface (HMI) panels with display + keypad + actuator loops. Its UART/SPI peripherals connect to character or graphical LCDs, the 21 GPIO scan a matrix keypad, and the 16-bit timers drive PWM backlight and buzzer control. The 12 KB Flash holds full UI firmware including state machines, debounce, and font tables, while 40 MIPS keeps touch sampling responsive. The 28-SSOP package is well-suited to compact HMI PCBs where every square millimeter matters.
מומלץ
Low-cost DSP Signal Processing
The PIC24HJ12GP202-I/SS targets low-cost DSP tasks such as audio tone decoding, vibration analysis, and current-ripple estimation. While lacking a true DSP engine, its 40 MIPS core with MAC-friendly instructions handles basic FIR filters and Goertzel-style tone decoders in real time. For higher-throughput DSP, the dsPIC33FJ12GP202-I/SS shares the same 28-SSOP footprint and adds a dedicated DSP engine with dual 40-bit accumulators, making it a clean migration path without PCB rework. Combined with the 12-bit ADC, this enables small-form-factor vibration monitors and audio pre-processors.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC24HJ12GP202-I/SS — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC24HJ12GP202-I/SP | PIC24HJ12GP202-E/SP | dsPIC33FJ12GP202-I/SS | PIC24HJ12GP201-I/P | PIC24HJ12GP201-E/P |
|---|---|---|---|---|---|---|
| Package | 28-SSOP | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same | 28-SSOP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24H 16-bit MIPS | PIC24H 16-bit MIPS | PIC24H 16-bit MIPS | dsPIC33F 16-bit with DSP engine | PIC24H 16-bit MIPS | PIC24H 16-bit MIPS |
| CPU Speed | 80 MHz / 40 MIPS | 80 MHz / 40 MIPS | 80 MHz / 40 MIPS | 80 MHz / 40 MIPS | 80 MHz / 40 MIPS | 80 MHz / 40 MIPS |
| Program Flash | 12 KB | 12 KB | 12 KB | 12 KB | 8 KB | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Temperature Grade | -40C to +85C (I grade) | -40C to +85C | -40C to +125C (E grade) | -40C to +85C | -40C to +85C | -40C to +125C |
| DSP Engine | No | No | No | Yes | No | No |
מבדילים עיקריים
- Largest Flash in same 28-SSOP footprint (לעומתPIC24HJ12GP201-I/P)
- Optional DSP upgrade path on same footprint (לעומתdsPIC33FJ12GP202-I/SS)
- Industrial temperature grade optimized for control applications (לעומתPIC24HJ12GP202-E/SP)
הערות תכנון
Decouple AVDD with a 10 uF + 100 nF pair within 3 mm of the AVDD pin, and VDD with a 1 uF + 100 nF pair within 5 mm of the VDD pin. Use a low-noise LDO such as MCP1700 or MIC5235 to keep ADC reference noise below 30 uVrms. A ferrite bead between VDD and AVDD isolates digital switching noise from the analog supply. The MCU draws up to 60 mA active and <10 uA in deep-sleep, so the LDO must source 100 mA peak for transient headroom.
Estimated: at 40 MIPS with 3.3 V supply and active peripherals, the device draws ~50 mA, dissipating 0.165 W in the 28-SSOP package (theta_JA ~80 C/W). The junction rises approximately 13C above ambient at 25C, so the part stays well below the +85C limit. In enclosed designs with limited airflow, ensure copper pour under the exposed die attach pad area is at least 0.5 sq-in to keep junction temperature rise under 20C.
Place the 40 MHz crystal within 5 mm of OSC1/OSC2 with symmetric trace lengths to avoid duty-cycle distortion. Use a guarded ground ring around the crystal traces and a 1 MOhm feedback resistor across the crystal to start oscillation reliably. The MCLR pull-up resistor (typically 10 kOhm) and decoupling capacitor should be placed within 5 mm of pin 1. For noisy environments, add a 100 nF + 10 uF decoupling on the ICSP VPP line as well.
Do not leave unused I/O pins floating - configure them as outputs driving low or enable the internal weak pull-ups. The PIC24HJ12GP202-I/SS has analog-capable pins that can inject cross-talk into the ADC if floating. Use the Peripheral Pin Select (PPS) feature to map functions away from analog pins when those pins are used for ADC inputs. Always run the configuration bits in a known reset state to avoid unintended JTAG enablement or watchdog-lockout conditions on first power-up.
מידע על תאימות
RoHS and lead-free per Microchip product marking. The I-grade part is not AEC-Q100 qualified; select the Q1 (AEC-Q100) automotive suffix variant for automotive applications.
