PIC32MZ1024EFE144T-I/JWX - 200MHz 32-bit MCU, 1MB Flash, TFBGA-144
MPN: PIC32MZ1024EFE144T-I/JWX ✓ פעילPIC32MZ1024EFE144T-I/JWX סקירה
A microcontroller (MCU) is a single-chip computer integrating a CPU core, program and data memory, peripheral set, and I/O. The 32-bit MCU category extends 8-bit and 16-bit predecessors with 32-bit registers and datapaths, enabling high-code-density C/C++ workloads. Within the power/performance hierarchy, PIC32MZ EF sits in the high-performance tier, paired with microcontrollers > 32-bit microcontrollers > microcontrollers > integrated circuits > semiconductors.
Key features of this variant include 1 MB dual-bank Flash with live update support, 256 KB SRAM, a 12-bit 18 Msps ADC with up to 120 channels, six UART, four SPI, five I2C, two CAN 2.0b controllers, a 10/100 Ethernet MAC with RMII/MII interface, Hi-Speed USB 2.0 device/host/OTG, and integrated crypto engine variants across the EF family. The TFBGA-144 package offers a 7x7 mm footprint with 0.5 mm ball pitch, suiting space-constrained industrial and connectivity designs.
Architecture-wise, the device uses a 5-stage MIPS M-Class pipeline with branch prediction and separate Instruction and Data TCM/SRAM paths. The 12-bit ADC provides 18 Msps conversion rate with up to 48 analog inputs (family max 120) and a dedicated 1 Msps 12-bit DAC. Peripherals are routed through eight DMA channels and nine 16/32-bit timers/capture inputs for low-latency deterministic control. The on-chip FPU accelerates DSP and signal-processing workloads in motor-control and audio front-ends.
Typical applications include industrial automation controllers, IoT edge gateways with Ethernet/USB-CAN bridging, graphics HMI with integrated TFT/DRM LCD support, automotive body/comfort ECUs, BLDC/PMSM motor control inverters, and audio DSP processors. The combination of large memory, Ethernet, and USB-OTG makes it suitable for connected embedded products requiring protocol translation.
When designing with this part, place at least 100 nF + 10 uF decoupling on each VDD/VDDIO pair and provide a 12 MHz high-precision crystal with proper load capacitors for the Ethernet PHY reference clock. The TFBGA package requires NSMD pads with 0.4 mm solder-mask openings and via-in-pad with epoxy fill for reliable BGA assembly.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical thermal/PCB design notes that go beyond the manufacturer datasheet to help engineers shorten their selection cycle.
חלופות תחליף ישיר עבור PIC32MZ1024EFE144T-I/JWX — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC32MZ1024EFE144T-I/JWX (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core Architecture, ADC, Operating Temperature, MSL Level.
PIC32MZ1024EFM144T-I/JWX
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1024EFE144T-E/JWX
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1024EFE144T-250I/JWX
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC32MZ2048EFM144T-I/JWX
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1024ECH144T-I/PL
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ0512EFK144T-I/JWX
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC32MZ1024EFE144T-I/JWX דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | MIPS32 M-Class |
| Core/Processor | PIC32MZ EF Family |
| Bit Width | 32-bit Single-Core |
| Maximum CPU Speed | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 256 KB |
| מארז | 144-TFBGA (7x7 mm, 0.5 mm pitch) |
| Operating Voltage Range | 2.1 V to 3.6 V |
| טמפרטורת פעולה | -40C to +85C (Industrial) |
| ADC | 12-bit, 18 Msps |
| ADC Channels | Up to 120 analog inputs |
| DMA Channels | 8 |
| Timers | 9 x 16/32-bit |
| Communication Interfaces | UART, SPI, I2C, CAN 2.0b, USB 2.0 HS OTG, Ethernet 10/100 MAC |
| FPU | Yes (single/double precision) |
| סוג הרכבה | Surface Mount (BGA) |
| סטטוס RoHS | Compliant |
מדריך תצורת פינים של PIC32MZ1024EFE144T-I/JWX 144-tfbga (7x7 mm, 0.5 mm pitch)
תצורת פינים עבור PIC32MZ1024EFE144T-I/JWX (מארזת 144-tfbga (7x7 mm, 0.5 mm pitch)). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור PIC32MZ1024EFE144T-I/JWX.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
PIC32MZ1024EFE144T-I/JWX מתאים עבור 7 יישוםs: Industrial IoT Edge Gateway, BLDC/PMSM Motor Control Inverter, Graphics HMI Controller, Automotive Body/Comfort ECU, Audio DSP Front-End Processor, Medical Patient Monitoring Sensor Hub, Smart Home Connectivity Bridge.
Industrial IoT Edge Gateway
The PIC32MZ1024EFE144T-I/JWX fits industrial IoT edge gateways because it integrates a 10/100 Ethernet MAC, Hi-Speed USB 2.0 device/host/OTG, two CAN 2.0b controllers, and six UART/SPI/I2C ports on a single die. The 200 MHz MIPS32 core with FPU sustains TLS handshakes and JSON/MQTT payload parsing, while 1 MB Flash accommodates full TCP/IP stacks plus application logic and OTA staging. Its industrial -40C to +85C rating suits factory-floor deployment without additional thermal hardening.
מומלץ
BLDC/PMSM Motor Control Inverter
The PIC32MZ1024EFE144T-I/JWX is well suited to BLDC and PMSM motor-control inverters thanks to its 200 MHz MIPS32 core with hardware FPU executing field-oriented control (FOC) loops, nine 16/32-bit timers with PWM and capture, and 12-bit 18 Msps ADC sampling phase currents at 50+ kHz. The 256 KB SRAM holds observer state and D-q axis variables, while 1 MB Flash stores sensorless and sensored algorithm variants. The industrial -40C to +85C rating covers motor-drive ambient conditions.
מומלץ
Graphics HMI Controller
The PIC32MZ1024EFE144T-I/JWX drives cost-effective graphics HMI panels because the MIPS32 core at 200 MHz with integrated LCD controller can render up to WVGA resolutions with 24-bit color, while the 256 KB SRAM holds frame buffers for small displays. The 1 MB Flash allows multilingual UI assets and bitmap storage, and six UART plus USB-OTG enable touch and external connectivity. The TFBGA-144 package fits behind the LCD PCB stack-up, minimizing mechanical depth.
מומלץ
Automotive Body/Comfort ECU
The PIC32MZ1024EFE144T-I/JWX fits body and comfort ECUs (window lifters, mirror controllers, seat modules) thanks to the 12-bit 18 Msps ADC sampling position and current feedback, two CAN 2.0b controllers for body-network gateway duty, and the LIN-capable UART supporting LIN 2.2 slaves. The 200 MHz MIPS core runs AUTOSAR-classic BSW layers, while 1 MB Flash holds application software and diagnostics. The 'E' (extended) temp variant PIC32MZ1024EFE144T-E/JWX in the same family upgrades to 125C for under-hood modules.
מומלץ
Audio DSP Front-End Processor
The PIC32MZ1024EFE144T-I/JWX handles audio DSP front-end tasks (active crossover, room correction, beam-forming) because its MIPS32 core at 200 MHz with single/double-precision FPU delivers roughly 50 MFLOPS for FIR/IIR filtering. The 12-bit 18 Msps ADC captures multi-microphone arrays at 48 kHz, while I2S peripherals and 256 KB SRAM stage audio buffers. The 1 MB Flash holds coefficient tables and presets for up to 8 user profiles.
מומלץ
Medical Patient Monitoring Sensor Hub
The PIC32MZ1024EFE144T-I/JWX serves medical sensor hubs (pulse oximetry, multi-parameter wearables) because the 12-bit 18 Msps ADC digitizes PPG, ECG, and bio-impedance signals at low latency while the MIPS32 core runs DSP-style filtering (FFT, moving average, SpO2 algorithm). The USB-OTG port enables tethered charging and data sync to clinician tablets, and 1 MB Flash stores calibration tables and patient session logs. The industrial -40C to +85C range exceeds home-care environment requirements.
מומלץ
Smart Home Connectivity Bridge
The PIC32MZ1024EFE144T-I/JWX is a strong choice for smart-home bridges because it integrates Ethernet MAC for backbone connectivity, USB-OTG for Wi-Fi/BLE dongles, and multiple UART/SPI/I2C for legacy sensor networks. With 1 MB Flash it stores Matter/Thread/Zigbee protocol stacks plus translation logic, and the 200 MHz core handles concurrent protocol translation. The TFBGA-144 (7x7 mm) footprint allows the bridge to fit inside standard wall-box enclosures.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC32MZ1024EFE144T-I/JWX — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC32MZ1024EFM144T-I/JWX | PIC32MZ1024EFE144T-E/JWX | PIC32MZ1024EFE144T-250I/JWX | PIC32MZ2048EFM144T-I/JWX | PIC32MZ1024ECH144T-I/PL | PIC32MZ0512EFK144T-I/JWX |
|---|---|---|---|---|---|---|---|
| Package | 144-TFBGA (7x7 mm) | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 200 MHz | 200 MHz | 180 MHz | 252 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 1 MB | 512 KB |
| SRAM | 256 KB | 512 KB | 256 KB | 256 KB | 512 KB | 256 KB | 128 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Crypto Engine | No | Yes | No | No | Yes | Yes | No |
| CAN Interface | 2 x CAN 2.0b | 2 x CAN-FD | 2 x CAN 2.0b | 2 x CAN 2.0b | 2 x CAN-FD | 2 x CAN 2.0b | 2 x CAN 2.0b |
מבדילים עיקריים
- Higher 200 MHz industrial-grade CPU versus E-suffix extended-temp variant (לעומתPIC32MZ1024EFE144T-E/JWX)
- 1 MB Flash in a TFBGA-144 (7x7 mm) footprint without crypto overhead (לעומתPIC32MZ1024EFM144T-I/JWX)
- Balanced Flash/RAM ratio for IoT protocol stacks (לעומתPIC32MZ2048EFM144T-I/JWX)
הערות תכנון
Decouple each VDD and VDDIO pin with a 100 nF ceramic capacitor placed as close as possible to the ball (within 2 mm trace length), and add a shared 10 uF bulk capacitor on each power rail. The PIC32MZ EF family datasheet specifies separate analog (VDDA) and digital (VDD) supply domains; VREF+ must be bypassed with 10 uF + 100 nF to achieve the 12-bit ADC's 18 Msps performance without crosstalk.
Estimated: at 200 MHz full-load (Dhrystone benchmark ~120 mA IDD) plus 3.3 V supply, internal dissipation is approximately 0.4 W. The TFBGA-144 7x7 mm package typically shows theta-JA around 35 C/W on a 4-layer JEDEC test board, yielding a 14C junction rise. Below the 85C industrial limit this is acceptable, but stacked-die designs and closed enclosures should add thermal vias under the central ball grid for additional margin.
TFBGA-144 with 0.5 mm pitch requires NSMD pads of 0.30 mm diameter with 0.40 mm solder-mask openings. Use via-in-pad with epoxy fill and cap plating to prevent solder wicking during reflow. Maintain a 1:1 trace-to-pad ratio exiting the BGA, fanning out to inner layers within 1.27 mm of the package edge. Reference the Microchip AN2335 'PCB Design Guidelines for PIC32MZ' for stack-up and routing recommendations.
Do not skip the 12 MHz primary oscillator load capacitors - incorrect values cause USB and Ethernet PHY clock drift that breaks USB certification and Ethernet link-up. Ensure the BOR (brown-out reset) is enabled in configuration bits; without it, voltage transients below 2.0 V can corrupt Flash and cause lock-up. Finally, leave JTAG/trace pins accessible for production programming - the PIC32MZ EF does not support JTAG-less recovery in the field.
מידע על תאימות
RoHS and REACH compliance per Microchip product page. The 'I' suffix indicates industrial temperature grade (not AEC-Q100 automotive qualified); the 'E' suffix PIC32MZ1024EFE144T-E/JWX is the extended-temperature variant. For automotive designs use Microchip's automotive-grade PIC32MZ EF parts explicitly marked AEC-Q100.
