SI8600AB-B-IS - Bidirectional I2C Digital Isolator | Skyworks
MPN: SI8600AB-B-IS ✓ פעילSI8600AB-B-IS סקירה
What is a digital isolator? A digital isolator is a semiconductor device that transfers logic signals across a galvanic isolation barrier using either RF coupling, magnetic coupling, or optical coupling, while blocking high-voltage transients and ground-potential differences. Digital isolators sit within the broader category of interface ICs (signal conditioning -> isolation -> serial communication) and are commonly used to bridge host controllers with sensors, transceivers, or operator-accessible ports in systems that must meet IEC 60747-17 reinforced-insulation standards.
Key features include support for I2C clock-stretching and hot-swap insertion, open-drain buffering on the bidirectional pair, 2.5 V/3.3 V/5 V level translation across the barrier, and unidirectional auxiliary digital channels for side-band signals. The integrated 10-lead-equivalent isolation functionality eliminates the need for discrete photo-couplers and external pull-up coordination circuits in many designs.
Internally, the Si8600 family uses an on-chip RF carrier (rather than LED/optocoupler or transformer windings) modulated by input data, recovered on the opposite side, and resynchronized to the local clock. This yields steady propagation delay across temperature and age, low power consumption versus opto-isolators, and a compact 8-SOIC footprint that does not require special creepage/clearance layout beyond standard SMT assembly.
Typical applications include isolated I2C buses in industrial PLCs, isolated sensor readouts, hot-swap-capable I/O cards, USB-to-I2C bridges across a high-voltage barrier, and battery-management system (BMS) isolation between low-voltage control and high-voltage cell stacks.
When designing with this part, ensure both sides have adequate pull-up resistors to their respective VDD rails (typical 1 kΩ to 10 kΩ depending on bus capacitance), and respect the 560 V peak or 2500 Vrms working voltage limits described in the manufacturer datasheet. Decouple VDD1 and VDD2 with 0.1 µF ceramic capacitors placed within 2 mm of each supply pin.
This page synthesizes real-time distributor pricing, drop-in alternatives, datasheet access, and practical design notes not consolidated on the manufacturer product page alone.
חלופות תחליף ישיר עבור SI8600AB-B-IS — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם SI8600AB-B-IS (אותו גורם צורה וטביעת רגל) — שונים ב Package, Common-Mode Transient Immunity (CMTI), Number of Channels, Operating Temperature, Output Type.
SI8600AB-B-ISR
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←SI8600AD-B-IS
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
SI8602AB-B-IS
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ISO1541DR
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ISO1541QDRQ1
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
ADUM2251ARWZ-RL7
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←ADUM2251WARWZ
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
SI8600AB-B-IS מפרטים
| Isolation Voltage (rms) | 2500 Vrms |
| Number of Channels | 2 |
| Common-Mode Transient Immunity (CMTI) | 35 kV/µs |
| מארז | 8-SOIC (3.90 mm body width) |
| Propagation Delay | 20 ns |
| Supply Voltage Range | 3 V to 5.5 V |
| טווח טמפרטורת פעולה | -40 °C to +125 °C |
| Bidirectional Channels | 2 (SDA, SCL) |
| Unidirectional Channels | 2 |
| סוג פלט | Open-drain (bidirectional side) |
| Hot-Swap Support | Yes |
| Clock-Stretching Support | Yes |
| Isolation Technology | RF-coupled (Skyworks proprietary) |
| סטטוס RoHS | Compliant |
תצורת פינים של SI8600AB-B-IS
| פין 1 | VDD1 — Side 1 supply voltage (3 V to 5.5 V) |
| פין 2 | GND1 — Side 1 ground reference |
| פין 3 | SDA1 — Bidirectional data line, side 1 (open-drain) |
| פין 4 | SCL1 — Bidirectional clock line, side 1 (open-drain, supports clock-stretching) |
| פין 5 | SDA2 — Bidirectional data line, side 2 (open-drain) |
| פין 6 | SCL2 — Bidirectional clock line, side 2 (open-drain, supports clock-stretching) |
| פין 7 | GND2 — Side 2 ground reference (galvanically isolated from GND1) |
| פין 8 | VDD2 — Side 2 supply voltage (3 V to 5.5 V) |
יישומים טיפוסיים
SI8600AB-B-IS מתאים עבור 7 יישוםs: Industrial PLC I2C Bus Isolation, Isolated Sensor Readout Front-End, Battery Management System (BMS) Cell-Board Interface, USB-to-I2C Bridge Across High-Voltage Barrier, Hot-Swap-Capable I/O Card Insertion, Medical and Test Equipment Isolation, Solar Inverter Communication Interface.
Industrial PLC I2C Bus Isolation
The SI8600AB-B-IS fits PLC backplane I2C bus isolation between a low-voltage MCU/SoM and field-side digital I/O or sensor modules separated by 24 V or higher galvanic potentials. Its 2500 Vrms isolation barrier and 35 kV/us CMTI directly handle transients in motor-drive or relay-coil environments. Placed across the bus with 4.7 kohm pull-ups on both sides, the Si8600AB-B-IS preserves clock-stretching and hot-swap insertion, allowing swapping of I/O cards without disturbing the controller. Compared to discrete opto-isolator designs, it cuts BOM and PCB area by more than half and stabilizes propagation delay with age and temperature.
מומלץ
Isolated Sensor Readout Front-End
Sensor readouts for current, voltage, or temperature frequently operate at high common-mode voltages relative to the host controller. The SI8600AB-B-IS carries the I2C link across a 2500 Vrms barrier while its bidirectional open-drain channels preserve SDA/SCL clock-stretching semantics that many sensors rely on for handshake. Combined with a 24-bit ADC such as the ADS131A04 on the high-voltage side, the Si8600AB-B-IS returns calibrated readings to a low-voltage controller through a compact 8-SOIC isolator. Engineers should keep loop-area minimal near the isolator and add 0.1 uF decoupling within 2 mm of each VDD pin.
מומלץ
Battery Management System (BMS) Cell-Board Interface
Distributed BMS architectures stack 12 V to 60 V cell-monitoring modules and must keep each cell-board's I2C bus isolated from neighboring cells to prevent ground-loop shorting. The SI8600AB-B-IS provides per-cell-board I2C isolation in the 8-SOIC footprint, simplifying the small PCB real-estate available on each board. Its 35 kV/us CMTI tolerates the high dV/dt transients of nearby switching regulators, while clock-stretching support accommodates the differential ADCs typically used in cell measurement.
מומלץ
USB-to-I2C Bridge Across High-Voltage Barrier
USB host ports and I2C peripherals often coexist on the same PCBA but the I2C peripheral may sit behind a high-voltage isolation barrier (medical, motor-drive, or solar energy applications). The SI8600AB-B-IS bridges the USB-to-I2C converter chip to the isolated peripheral with consistent 20 ns propagation delay, ensuring deterministic bus timing at 100 kHz and 400 kHz. Designers pairing the Si8600AB-B-IS with a USB-to-I2C bridge such as the MCP2221 should supply each side from isolated regulators and verify UL 1577 insulation integrity for the entire PCB.
מומלץ
Hot-Swap-Capable I/O Card Insertion
The SI8600AB-B-IS supports hot-swap insertion of I/O cards by virtue of its open-drain bidirectional structure plus dedicated hot-swap signal handlers. When a card is inserted, both sides' power rails may come up out of order; the Si8600AB-B-IS gates the SDA/SCL lines until stable VDD is present on both sides, protecting the host controller from in-rush transients. Deployed in VME-style or CompactPCI backplanes, it enables live card swaps without halting the controller's I2C bus.
מומלץ
Medical and Test Equipment Isolation
Patient-connect medical electronics (e.g., isolated ECG or patient-monitoring leads) require 2500 Vrms of patient-side isolation. The SI8600AB-B-IS bridges the I2C control link between the host DSP/FPGA and the isolated analog-front-end module, while its 35 kV/us CMTI withstands defibrillator-transient-induced common-mode spikes. Used together with an isolated DC-DC converter, the Si8600AB-B-IS builds a 2-MOPP-class patient isolation barrier. The 8-SOIC package simplifies PCB layout versus larger isolation alternatives.
מומלץ
Solar Inverter Communication Interface
In string-inverter designs, control boards and gate-driver/power-stage boards operate at very different common-mode voltages and noise levels. The SI8600AB-B-IS carries housekeeping I2C traffic (temperature, fan speed, status LEDs) between control and power boards across a 2.5 kV barrier. With 35 kV/us CMTI, it tolerates the dV/dt from 600 V or higher DC bus switching, and its RF isolation technology maintains low EMI versus opto-isolators, simplifying the EMI filter design.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור SI8600AB-B-IS — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | SI8600AB-B-ISR | SI8600AD-B-IS | SI8602AB-B-IS | ISO1541DR | ISO1541QDRQ1 | ADUM2251ARWZ-RL | ADUM2251WARWZ |
|---|---|---|---|---|---|---|---|---|
| Brand | Skyworks | Skyworks | Skyworks | Skyworks | Texas Instruments | Texas Instruments | Analog Devices | Analog Devices |
| Package | 8-SOIC (3.90 mm) | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same | 8-SOIC (3.90 mm) - same |
| Isolation Voltage (rms) | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms | 2500 Vrms |
| CMTI (minimum) | 35 kV/µs | 35 kV/µs | ~25 kV/µs | ~25 kV/µs | 25 kV/µs | 25 kV/µs | 25 kV/µs | 25 kV/µs |
| Channel Count (Bidirectional) | 2 | 2 | 2 | 1 | 2 | 2 | 2 | 2 |
| AEC-Q100 Qualified | No (industrial grade) | No | No | No | No | Yes | No | No |
| Isolation Technology | RF-coupled | RF-coupled | RF-coupled | RF-coupled | Capacitive | Capacitive | Magnetic (iCoupler) | Magnetic (iCoupler) |
| Supply Voltage Range | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V | 3 V to 5.5 V |
מבדילים עיקריים
- Higher minimum CMTI than capacitive/magnetic competitors (לעומתTI ISO1541DR / ADI ADUM2251ARWZ-RL)
- RF-coupled isolation technology with stable propagation delay (לעומתOpto-isolator-based I2C designs (e.g. PC817-based isolated I2C))
- Drop-in 8-SOIC replacement available with AEC-Q100 qualification (לעומתTI ISO1541QDRQ1)
הערות תכנון
Estimated: at 5 V supply and 1 MHz internal RF carrier activity, side 1 and side 2 each draw on the order of 5-10 mA quiescent current. Provide a 0.1 uF ceramic decoupling capacitor within 2 mm of each VDD1 and VDD2 pin, plus a bulk 1 uF cap on each side for transient suppression. Do not share decoupling capacitors across the barrier or isolation is defeated.
Maintain at least 4 mm of creepage/clearance under and around the SOIC-8 body to preserve 2500 Vrms isolation integrity. Avoid routing any copper plane (signal, power, or ground) beneath the package body, which would compromise the clearance. Place the I2C pull-up resistors on their respective sides only (do not route pull-up return paths across the barrier).
Common mistakes when designing with the SI8600AB-B-IS include: (1) omitting pull-up resistors (the open-drain lines will not high without them), (2) tying VDD1 and VDD2 together (this shorts the isolation barrier), (3) using too-strong pull-ups (1 kohm at 5 V will exceed the 20 mA sink rating of the open-drain outputs - choose 4.7 kohm or higher depending on bus capacitance), and (4) forgetting external series resistors for hot-swap transients.
Although the SI8600AB-B-IS preserves I2C clock-stretching and arbitration semantics, propagation delay is asymmetric across the RF barrier; do not assume 0 ns skew between SDA and SCL at high bus speeds. For Fast-mode (400 kHz) operation, route the bidirectional pair with matched trace lengths and keep total capacitive loading under 200 pF including cable capacitance.
מידע על תאימות
RoHS and REACH compliance per Skyworks product documentation. Not AEC-Q100 qualified as a discrete part number - choose ISO1541QDRQ1 for automotive applications.
