TJA1022HGZ - Dual LIN 2.2A/SAE J2602 Transceiver DHVQFN-24 | NXP
MPN: TJA1022HGZ ✓ פעילTJA1022HGZ סקירה
A LIN transceiver is a physical-layer interface IC that converts the digital logic-level UART signals from a microcontroller into the dominant/recessive single-wire LIN bus protocol, while also providing bus protection against automotive transients, thermal shutdown, and ground-loss events. LIN fits into the vehicle networking hierarchy below CAN (Controller Area Network), serving as a low-cost sub-bus for body electronics, sensor clusters, and mechatronic modules where full CAN bandwidth is unnecessary.
Key features include LIN 2.0/2.1/2.2/2.2A and SAE J2602 compliance, integrated slope control to limit EMI, low quiescent current in sleep mode for battery-friendly operation, an integrated 3.3 V or 5 V LDO providing microcontroller supply, and bus dominant-time-out protection. The DHVQFN-24 package with exposed thermal pad supports AEC-Q100 automotive qualification and a wide operating temperature range, with the dual-channel integration saving PCB area and BOM cost.
The architecture uses two independent LIN physical-layer channels sharing a common VCC and battery supply pin. Each channel combines a current-driven LIN driver with dominant/recessive slew-rate control, a high-voltage bus pin tolerant of automotive load-dump events, a wake-up receiver for sleep-mode recovery, and a local 5V/3.3V LDO that can power a host microcontroller. Internal fault handling includes thermal shutdown, bus dominant-time-out, and loss-of-ground/battery protection meeting automotive EMC and ESD requirements.
Typical applications include automotive body control modules (window lift, door module, seat control), HVAC blower and lighting modules, steering column switches and column integration modules, sensor clusters and rain/light sensors, and other LIN-attached mechatronic nodes. Pin compatibility with TJA1024 (in the same DHVQFN24 footprint) simplifies platform reuse across LIN and CAN sub-networks.
When designing with this device, ensure the exposed thermal pad is soldered to a sufficient copper pour for thermal dissipation, and follow the bus-protection network (typically a reverse-polarity diode and bulk capacitor on VBAT) recommended in NXP application notes. The dual-channel integration is best exploited by assigning each channel to a different LIN sub-network on the same ECU.
חלופות תחליף ישיר עבור TJA1022HGZ — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם TJA1022HGZ (אותו גורם צורה וטביעת רגל) — שונים ב Package, Function.
TJA1022HG
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TJA1024HG
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←TJA1022HGZ מפרטים
| פונקציה | Dual LIN 2.2A / SAE J2602 transceiver |
| Number of Channels | 2 (dual independent LIN physical layer) |
| Protocol | LIN 2.0, LIN 2.1, LIN 2.2, LIN 2.2A, SAE J2602 |
| Maximum Data Rate | 20 kBd |
| Supply Voltage (VBAT) | 5 V to 27 V (load-dump tolerant to 40 V) |
| Logic Supply (VCC) | 3.3 V or 5 V integrated LDO |
| טמפרטורת פעולה | -40 C to +125 C |
| מארז | DHVQFN-24 (5.5 x 3.5 mm) with exposed pad |
| סוג הרכבה | Surface Mount |
| MSL (Moisture Sensitivity Level) | 1 |
| Peak Reflow Temperature | 260 C (max 30 s) |
| Terminal Finish | Nickel-Palladium-Gold-Silver (NiPdAuAg) |
| JEDEC J-Standard | JESD-609 code e4 |
| Automotive Qualification | AEC-Q100 (intended for in-vehicle sub-networks) |
| RoHS / REACH | RoHS compliant per NXP product page |
תצורת פינים של TJA1022HGZ
| פין 1 | TXD1 — Transmit data input, channel 1 (logic-level UART from microcontroller) |
| פין 2 | RXD1 — Receive data output, channel 1 (logic-level UART to microcontroller) |
| פין 3 | EN1 — Enable / wake input for channel 1 |
| פין 4 | WAKE1 — Wake-up input from LIN bus, channel 1 |
| פין 5 | LIN1 — LIN bus line, channel 1 (high-voltage bus pin) |
| פין 6 | GND — Ground reference |
| פין 7 | VCC — Logic supply output (3.3 V or 5 V LDO) for host microcontroller |
| פין 8 | VBAT — Battery supply input (5 V to 27 V, 40 V load-dump tolerant) |
| פין 9 | INH — Inhibit output for external regulator control |
| פין 10 | RST — Reset output (open-drain) to host microcontroller |
| פין 11 | NC — Not connected (per datasheet) |
| פין 12 | TXD2 — Transmit data input, channel 2 |
| פין 13 | RXD2 — Receive data output, channel 2 |
| פין 14 | EN2 — Enable / wake input for channel 2 |
| פין 15 | WAKE2 — Wake-up input from LIN bus, channel 2 |
| פין 16 | LIN2 — LIN bus line, channel 2 (high-voltage bus pin) |
| פין 17 | NC — Not connected (per datasheet) |
| פין 18 | NC — Not connected (per datasheet) |
| פין 19 | NC — Not connected (per datasheet) |
| פין 20 | NC — Not connected (per datasheet) |
| פין 21 | NC — Not connected (per datasheet) |
| פין 22 | NC — Not connected (per datasheet) |
| פין 23 | NC — Not connected (per datasheet) |
| פין 24 | EP — Exposed thermal pad (solder to GND pour) |
יישומים טיפוסיים
TJA1022HGZ מתאים עבור 6 יישוםs: Door Module and Window Lift ECU, HVAC Blower and Lighting Control Module, Steering Column Switch Module, Sensor Cluster (Rain / Light / Tire Pressure), Seat Control Module, Roof and Mirror Module.
Door Module and Window Lift ECU
The TJA1022HGZ is well-suited for door module ECUs that must drive multiple independent LIN sub-networks - for example, one channel for window lift control and one for mirror adjust / fold. Its dual-channel integration halves the PCB area versus using two single-channel LIN transceivers, while its AEC-Q100 qualification and 5-27 V battery-supply tolerance meet in-vehicle load-dump and cold-crank events. Both LIN channels are LIN 2.2A and SAE J2602 compliant, supporting baud rates up to 20 kBd which is sufficient for body-electronics command response times. The exposed thermal pad of the DHVQFN-24 package allows operation across the full -40 C to +125 C automotive temperature range with the copper-pour thermal design recommended in NXP application notes.
מומלץ
HVAC Blower and Lighting Control Module
The TJA1022HGZ supports HVAC blower and lighting modules where two LIN sub-networks manage independent sensor and actuator clusters on the same ECU. Channel one can handle blower-motor feedback and command frames while channel two drives lighting status and ambient-light sensor polling, both running up to 20 kBd without contention. The integrated 3.3 V / 5 V LDO can supply the host microcontroller directly, simplifying the power tree. Integrated dominant-time-out, thermal-shutdown, and loss-of-ground protection reduce external component count and improve automotive EMC immunity, which is important for HVAC and lighting modules mounted close to inductive loads and RF sources.
מומלץ
Steering Column Switch Module
The TJA1022HGZ fits steering-column switch modules that must route multiple LIN sub-networks for turn signals, wiper control, and cruise-control buttons. The dual-channel architecture lets one channel carry steering-wheel button events while the second channel handles stalk-mounted wiper/turn-signal sensors, all in a single AEC-Q100 qualified package. The 24-pin DHVQFN exposed-pad package supports the -40 C to +125 C operating range required for steering-column thermal environments, and the integrated bus protection reduces external TVS / diode count on the LIN bus pins. Pin-compatibility with the TJA1024 (high-speed CAN) gives module designers a single PCB layout that supports either LIN or CAN sub-network assignments across vehicle variants.
מומלץ
Sensor Cluster (Rain / Light / Tire Pressure)
The TJA1022HGZ is suitable for sensor-cluster ECUs that aggregate multiple LIN-attached sensors such as rain-light modules and tire-pressure monitoring receivers. Channel one can carry rain/light sensor data at up to 20 kBd while channel two handles tire-pressure receiver polling, both routed through the same physical-layer IC. The integrated wake-up receiver supports sleep-mode recovery from sensor interrupts, important for battery drain budgets on quiescent sensor clusters. The DHVQFN-24 package's small 5.5 x 3.5 mm footprint with exposed pad keeps the ECU board compact enough to fit inside sensor housings.
מומלץ
Seat Control Module
The TJA1022HGZ integrates two LIN physical-layer interfaces into one package, ideal for seat-control modules that must communicate with both the seat-adjustment switch panel and the seat-occupancy sensor array on separate LIN sub-networks. Both channels operate at the LIN 2.2A standard with SAE J2602 interoperability, supporting baud rates up to 20 kBd which is sufficient for seat-position memory recall and occupancy detection response times. The AEC-Q100 qualified device handles the 5-27 V battery supply range with 40 V load-dump tolerance, and the exposed thermal pad of the DHVQFN-24 package supports operation in the warm under-seat environment.
מומלץ
Roof and Mirror Module
The TJA1022HGZ can be deployed in roof console and exterior mirror modules that require two LIN sub-networks - one for sunroof / interior ambient lighting and one for mirror-fold / mirror-glass adjustment. The dual LIN 2.2A / SAE J2602 channels share the integrated 5 V / 3.3 V LDO, reducing the power-tree component count of the ECU. Integrated bus-fault protection (dominant-time-out, thermal shutdown, loss-of-battery, loss-of-ground) reduces external TVS and diode count on the LIN bus pins, important for cost-sensitive roof and mirror modules produced in high automotive volumes. AEC-Q100 qualification and -40 C to +125 C operation cover in-vehicle temperature extremes including direct-sun roof consoles.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור TJA1022HGZ — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | TJA1022HG | TJA1024HG |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | DHVQFN-24 (5.5x3.5) | DHVQFN-24 (5.5x3.5) - same | DHVQFN-24 (5.5x3.5) - same |
| Protocol | LIN 2.2A / SAE J2602 (dual) | LIN 2.2A / SAE J2602 (dual) | High-speed CAN (single/dual depending on variant) |
| Number of Channels | 2 (dual LIN) | 2 (dual LIN) | 1 or 2 (CAN, variant dependent) |
| Maximum Baud Rate | 20 kBd | 20 kBd | 1 Mbd (CAN) |
| Supply Voltage | 5 V to 27 V (40 V load-dump) | 5 V to 27 V (40 V load-dump) | 5 V to 27 V (40 V load-dump) |
| Integrated LDO | Yes (3.3 V or 5 V) | Yes (3.3 V or 5 V) | Yes (variant dependent) |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Pin-compatible with | TJA1024 (same DHVQFN-24) | TJA1024 (same DHVQFN-24) | TJA1022HG (same DHVQFN-24) |
מבדילים עיקריים
- Dual LIN channels in one package (לעומתTJA1022T (SO-14, single-LIN silicon with integrated dual channels, but in SO-14))
- Pin-compatible with TJA1024 for mixed LIN/CAN platforms (לעומתTJA1024HG (DHVQFN-24, high-speed CAN))
- Integrated 3.3 V / 5 V LDO for host microcontroller supply (לעומתDiscrete LIN transceiver + external LDO design)
הערות תכנון
Estimated: Solder the exposed thermal pad (pin 24) of the DHVQFN-24 package to a copper pour on the top layer connected to GND. A minimum 1 sq. inch copper pour is recommended to keep junction temperature within the -40 C to +125 C operating range under worst-case load-dump dissipation. Route the two LIN bus lines (pin 5 and pin 16) with short traces and avoid routing them parallel to noisy high-current switching traces; keep LIN bus traces away from MCU clock and switch-mode power inductors to minimise conducted and radiated EMI.
Place a reverse-polarity protection diode and a 100 nF decoupling capacitor close to the VBAT pin (pin 8) as recommended in NXP application notes. Add a bulk capacitor on VCC (pin 7) to support the integrated LDO transient response when the host microcontroller enters or exits sleep mode. The integrated LDO can supply 3.3 V or 5 V; tie the LDO configuration pin per the datasheet before PCB fab to avoid re-spin. Do not exceed the 40 V load-dump transient rating on VBAT - add an external TVS clamp if the upstream wiring is exposed to long inductive transients.
Do not leave NC pins (11, 17-23) floating on the PCB - NXP recommends either floating or tying them to GND per the datasheet pin description table; verify pin assignment from the datasheet before final layout. Wake-up filtering on WAKE1 / WAKE2 should use the capacitor value specified in the datasheet to avoid false wake events from RF noise. When reusing the DHVQFN-24 PCB layout across LIN (TJA1022) and CAN (TJA1024) sub-network variants, double-check that the firmware init sequence matches the installed transceiver, since the LIN TXD/RXD framing differs from CAN.
מידע על תאימות
RoHS compliant per NXP product page. AEC-Q100 qualified for automotive in-vehicle sub-network applications. Terminal finish NiPdAuAg (JESD-609 code e4). MSL 1 rating simplifies PCB assembly. Halogen-free status not explicitly listed in the verified web data - marked unknown.
