TJA1100HN - 100BASE-T1 Automotive Ethernet PHY | NXP | QFN-36
MPN: TJA1100HN ✓ פעילTJA1100HN סקירה
An automotive Ethernet PHY (Physical Layer transceiver) is the analog/digital mixed-signal device that sits between an Ethernet MAC (Media Access Controller) and the physical twisted-pair cable, performing line coding (PAM-3 for 100BASE-T1), clock recovery, echo cancellation, and signal equalization. It belongs to the broader product hierarchy: Ethernet transceiver -> network interface IC -> interface IC -> semiconductor. PHY selection directly determines the achievable link speed, cable reach, EMC performance, and power budget of in-vehicle networks, making the TJA1100 family a foundation technology for zonal and domain automotive E/E architectures.
Key features of the TJA1100HN include 100 Mbit/s full-duplex operation over a single UTP pair, integrated PHY with on-chip termination, support for cable lengths of at least 15 m, AEC-Q100 Grade 1 qualification for automotive use, low power consumption with cable-disconnect and deep-sleep power-down modes, MII/RMII/MII-Lite MAC interfaces, and a compact HVQFN-36 footprint designed to fit inside space-constrained ECUs and sensor modules.
The device is qualified in compliance with AEC-Q100 Grade 1, is natively designed for the smallest package footprint, requires minimal external component overhead (no external magnetics for the MDI side in many configurations), and supports hardware and software configuration via MDIO management and strap pins. Participating products are available for a minimum of 10 years per NXP's automotive longevity program.
Typical applications include ADAS sensor links (cameras, radar, lidar), automotive Ethernet backbones between ECUs and zonal controllers, in-vehicle IP camera links, body and chassis domain networks, and OEM infotainment backbones. Designers favor the TJA1100HN for designs requiring proven 100BASE-T1 interoperability and AEC-Q100 reliability.
When designing with this device, ensure adequate PCB layout for the 100BASE-T1 MDI pair with controlled 100-ohm differential impedance, place decoupling close to the supply pins, and follow NXP application notes for EMC-optimized magnetics selection. Operating temperature range and AEC-Q100 Grade 1 qualification must be confirmed against the target ECU environment.
This page synthesizes distributor availability, drop-in alternative cross-references, and practical PHY layout considerations not consolidated in the standalone manufacturer datasheet.
חלופות תחליף ישיר עבור TJA1100HN — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם TJA1100HN (אותו גורם צורה וטביעת רגל) — שונים ב Data Rate, Package, Product Type.
TJA1101HN
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TJA1100HNZ
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←TJA1102HN
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
TJA1100HN מפרטים
| Product Type | Automotive Ethernet PHY Transceiver |
| Ethernet Standard | IEEE 100BASE-T1 |
| Number of Ports | 1 (single port) |
| קצב נתונים | 100 Mbit/s (full-duplex) |
| Cable Interface | Single unshielded twisted pair (UTP) |
| Minimum Cable Reach | 15 m (UTP) |
| MAC Interface | MII / RMII / MII-Lite |
| Management Interface | MDIO / SMI |
| מארז | HVQFN-36 (QFN-36) with exposed thermal pad |
| סוג הרכבה | Surface Mount |
| טמפרטורת פעולה | -40C to +125C (AEC-Q100 Grade 1) |
| AEC-Q100 Qualification | Grade 1 |
| סטטוס RoHS | Compliant |
| Lead-Free | Yes |
| Longevity Commitment | Minimum 10 years (NXP automotive program) |
תצורת פינים של TJA1100HN
| פין 1 | VDDIO — I/O supply voltage |
| פין 2 | VDDA — Analog supply |
| פין 3 | VDDC — Core supply |
| פין 4 | MDI_P — Media-dependent interface positive |
| פין 5 | MDI_N — Media-dependent interface negative |
| פין 6 | RBIAS — Bias resistor |
| פין 7 | RESET_N — Hardware reset (active low) |
| פין 8 | CLK_IN — Reference clock input |
| פין 9 | MDC — Management data clock |
| פין 10 | MDIO — Management data I/O |
| פין 11 | INT_N — Interrupt output (active low) |
| פין 12 | TXD0 — MII transmit data bit 0 |
| פין 13 | TXD1 — MII transmit data bit 1 |
| פין 14 | TXD2 — MII transmit data bit 2 |
| פין 15 | TXD3 — MII transmit data bit 3 |
| פין 16 | TX_EN — MII transmit enable |
| פין 17 | TX_CLK — MII transmit clock |
| פין 18 | RXD0 — MII receive data bit 0 |
| פין 19 | RXD1 — MII receive data bit 1 |
| פין 20 | RXD2 — MII receive data bit 2 |
| פין 21 | RXD3 — MII receive data bit 3 |
| פין 22 | RX_DV — MII receive data valid |
| פין 23 | RX_CLK — MII receive clock |
| פין 24 | RX_ER — MII receive error |
| פין 25 | CRS — Carrier sense |
| פין 26 | COL — Collision detect |
| פין 27 | CONFIG0 — Hardware configuration strap 0 |
| פין 28 | CONFIG1 — Hardware configuration strap 1 |
| פין 29 | CONFIG2 — Hardware configuration strap 2 |
| פין 30 | WAKE_N — Wake input (active low) |
| פין 31 | INH — Inhibit output for power management |
| פין 32 | GPIO — General purpose I/O |
| פין 33 | LED0 — Link/activity LED driver 0 |
| פין 34 | LED1 — Link/activity LED driver 1 |
| פין 35 | VSS — Ground |
| פין 36 | EPAD — Exposed thermal pad (ground) |
יישומים טיפוסיים
TJA1100HN מתאים עבור 6 יישוםs: ADAS Camera Ethernet Links, Automotive Radar/Lidar Sensor Backbones, In-Vehicle Ethernet Backbone (Zonal/Body Domain), Infotainment and Cluster Ethernet, Body Electronics and Chassis Networks, Industrial Ethernet Bridging (Non-Automotive Reuse).
ADAS Camera Ethernet Links
The TJA1100HN delivers 100 Mbit/s full-duplex over a single UTP pair, providing enough bandwidth for compressed automotive surround-view and front-camera streams (typically 4 to 8 Mbps per channel). Its AEC-Q100 Grade 1 qualification and -40C to +125C range let it sit behind windshield-mounted or bumper-mounted camera modules without thermal derating. Unlike LVDS links, 100BASE-T1 over a single twisted pair cuts cable weight by roughly 50 percent and reduces connector pin count, directly lowering wiring-harness cost. Designers place the PHY between the image sensor serializer SoC (MII/RMII) and the cable MDI, with NXP-recommended magnetics on the line side and a 100-ohm differential layout to pass automotive EMC.
מומלץ
Automotive Radar/Lidar Sensor Backbones
Radar and lidar ECUs increasingly use automotive Ethernet for sensor fusion. The TJA1100HN's 100 Mbit/s link carries radar object lists and lidar point clouds between the sensor and the central ADAS domain controller over a single UTP, simplifying harness routing inside bumpers and behind grilles. The HVQFN-36 footprint with exposed thermal pad fits inside small IP67 sensor housings, while AEC-Q100 Grade 1 stress testing validates reliability under wide temperature swings. Compared to CAN-FD, 100BASE-T1 provides roughly 50x more bandwidth, enabling richer sensor data without protocol fragmentation overhead.
מומלץ
In-Vehicle Ethernet Backbone (Zonal/Body Domain)
Zonal and body-domain controllers use 100BASE-T1 as a low-cost backbone between ECUs. The TJA1100HN enables a single twisted pair per link, drastically reducing wiring weight versus traditional multi-wire harnesses and supporting daisy-chained topologies up to at least 15 m. With hardware-strapped MDIO configuration, designers can avoid an external microcontroller for link bring-up, lowering BOM cost. When compared to BroadR-Reach predecessors, the TJA1100HN adds compliance with the ratified IEEE 100BASE-T1 standard and improved EMC margin.
מומלץ
Infotainment and Cluster Ethernet
Head-unit and instrument-cluster domains use 100BASE-T1 to share audio, video, and diagnostic streams. The TJA1100HN's small HVQFN-36 footprint and low power dissipation keep thermal budgets comfortable inside dash-mounted enclosures. Cable-disconnect detection and deep-sleep modes help minimize quiescent draw on parked vehicles. The MII/RMII interface pairs cleanly with NXP i.MX and S32K automotive processors used in cockpit modules.
מומלץ
Body Electronics and Chassis Networks
Body control modules and chassis ECUs increasingly adopt Ethernet for gateway functions, replacing multiple CAN/CAN-FD buses. The TJA1100HN's 100 Mbit/s link provides ample bandwidth for centralized body control, lighting, and chassis data aggregation over a single UTP pair per link. AEC-Q100 Grade 1 qualification, robust ESD tolerance, and NXP's automotive longevity program support high-volume production programs. Compared to legacy CAN-FD at 2 Mbps, the TJA1100HN offers 50x throughput per link.
מומלץ
Industrial Ethernet Bridging (Non-Automotive Reuse)
Although AEC-Q100 qualified, the TJA1100HN also serves industrial designers who need a compact 100 Mbit/s single-pair Ethernet PHY with extended temperature operation. Factory automation nodes, building automation gateways, and remote sensor installations benefit from the part's robust EMC margin and small footprint. Note that designers should verify that AEC-Q100 stress data satisfies any industrial-specific certifications (IEC 61508, etc.) required by their end application.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור TJA1100HN — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | TJA1101HN | TJA1100HNZ | TJA1102HN |
|---|---|---|---|---|
| Package | HVQFN-36 (QFN-36) with EPAD | HVQFN-36 - same | HVQFN-36 - same | HVQFN-36 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Ethernet Standard | IEEE 100BASE-T1 | IEEE 100BASE-T1 + TC10 | IEEE 100BASE-T1 | IEEE 2.5G/5GBASE-T1 |
| Data Rate | 100 Mbit/s | 100 Mbit/s | 100 Mbit/s | 2.5 Gbit/s / 5 Gbit/s |
| Cable Interface | Single UTP | Single UTP | Single UTP | Single UTP (higher speed) |
| AEC-Q100 Grade | Grade 1 | Grade 1 | Grade 1 | Grade 1 |
מבדילים עיקריים
- AEC-Q100 Grade 1 qualified with 10-year longevity commitment (לעומתTJA1102HN)
- Minimal external component count (לעומתTJA1101HN)
- Single-pair cable reach of at least 15 m (לעומתGeneric 100BASE-TX PHY)
הערות תכנון
Route the MDI_P/MDI_N pair as a 100-ohm differential link with controlled impedance; keep pair length matching within 2 mm and avoid splits orstubs. Place the bias resistor and supply decoupling within a few millimeters of the pins. Follow NXP's reference layout in the TJA1100 application note for EMC-compliant magnetics placement and chassis-ground stitching.
Use a ferrite bead or pi-filter on the analog supply (VDDA) to isolate from digital switching noise. Decouple each supply pin with 100 nF X7R plus a bulk 4.7 uF ceramic close to the pin. The exposed thermal pad must be soldered to a continuous ground plane for thermal dissipation; an unsoldered EPAD can raise junction temperature by 20-30 C under full MDI activity.
Do not substitute non-automotive-grade 100BASE-T1 PHYs in AEC-Q100 designs without explicit OEM approval; commercial-grade parts typically fail 125C HTOL stress. Avoid routing MDI traces near noisy DC-DC or CAN-H/L lines to maintain the link's strict EMC margin. Always configure hardware straps (CONFIG0-2) before MDIO software init to avoid link flap on power-up.
מידע על תאימות
AEC-Q100 Grade 1 qualified per NXP TJA1100 product page. RoHS/REACH compliance stated by NXP. Halogen-free status not explicitly confirmed in the verified web data and marked unknown.
