XC6SLX75-L1FG676I - 74,637-Cell Spartan-6 LX FPGA | AMD
MPN: XC6SLX75-L1FG676I ✓ פעילXC6SLX75-L1FG676I סקירה
A field-programmable gate array is a reconfigurable digital semiconductor in which the logic, interconnect, and input/output functions are defined by a bitstream rather than permanently etched during fabrication. Within the device hierarchy, an FPGA is a programmable logic device and a semiconductor. Spartan-6 LX belongs to AMD/Xilinx's Spartan-6 product family, which is intended to balance logic capacity, embedded memory, I/O availability, and cost in compact embedded systems.
The XC6SLX75 provides 74,637 logic cells organized as 5,831 configurable logic blocks and offers 408 I/O. Its 408 I/O provide substantial connectivity for parallel buses, control interfaces, memory interfaces, and general-purpose digital peripherals. A 1 V core voltage supports modern FPGA implementation practices, while the 45 nm CMOS process establishes the device's process technology and helps define its performance and power characteristics.
The 676-ball FBGA package supports dense board routing and is suitable for compact systems in which a large programmable logic resource must coexist with processors, external memory, transceivers, or high-speed interface components. The 27 x 27 mm body and 1 mm pitch require careful PCB layout, power planning, via-in-pad or microvia strategies, and a multilayer board structure capable of supporting hundreds of power, ground, and signal connections.
Typical applications include industrial control systems, data acquisition, communications equipment, embedded processing platforms, video processing, and high-density digital interfaces. The Spartan-6 LX fabric can implement parallel protocols, control logic, state machines, packet processing, and custom accelerators. Systems requiring a large number of user I/O can use the device as the central programmable element rather than relying exclusively on discrete programmable logic.
A primary design consideration is power integrity. Because the 676-ball package contains many supply and ground connections, the power grid must be designed according to the package power and ground assignments rather than distributed mechanically. Decoupling, layer transitions, thermal management, signal-integrity analysis, and exact pin constraints must be checked against the Spartan-6 device documentation before schematic capture or PCB release.
This product overview combines the exact device identity, package characteristics, cell and I/O counts, family relationships, replacement analysis, and practical design guidance needed to evaluate the XC6SLX75-L1FG676I before it is assigned to an industrial FPGA design.
חלופות תחליף ישיר עבור XC6SLX75-L1FG676I — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC6SLX75-L1FG676I (אותו גורם צורה וטביעת רגל) — שונים ב Device Type, Core Supply Voltage, Lead-Free Status, Operating Temperature, Package.
XC6SLX75-L1FGG676I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX75-L1FGG676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX75-L1FG676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC6SLX75-2FG676I
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC6SLX75-2FGG676I
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC6SLX75-L1FG676I דירוגים מרביים ומאפיינים חשמליים
| Device Type | Spartan-6 LX field-programmable gate array (FPGA) |
| Logic Cells | 74,637 cells |
| Configurable Logic Blocks | 5,831 CLBs |
| User I/O | 408 I/O |
| Process Technology | 45 nm CMOS |
| Core Supply Voltage | 1 V |
| מארז | 676-ball FBGA |
| Package Body Size | 27 x 27 mm |
| Ball Pitch | 1 mm |
| Terminal Count | 676 terminals |
| Package Shape | Square |
| סגנון הרכבה | BGA |
| Temperature Grade | Industrial |
| Lead-Free Status | Lead-free |
| Programmability | User-programmable FPGA logic |
מדריך תצורת פינים של XC6SLX75-L1FG676I square
תצורת פינים עבור XC6SLX75-L1FG676I (מארזת square). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC6SLX75-L1FG676I.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC6SLX75-L1FG676I מתאים עבור 6 יישוםs: Industrial Control Systems, Data Acquisition and Instrumentation, Communications and Network Interface, Video and Image Processing, Embedded Processing Platform, Aerospace and Defense Test Equipment.
Industrial Control Systems
The AMD/Xilinx XC6SLX75-L1FG676I fits industrial controllers that combine deterministic machine control with numerous external signals. Its 74,637 logic cells and 408 user I/O can support encoder interfaces, motor-control sequencing, interlock logic, diagnostics, and communication bridges without relying on a separate collection of glue-logic devices. The 45 nm CMOS Spartan-6 LX implementation also fits the Spartan-6 family's role in compact embedded and industrial systems. Engineers should reserve the FBGA's 676 terminals for power distribution and high-speed routing while assigning user I/O according to the exact package pin table.
מומלץ
Data Acquisition and Instrumentation
The XC6SLX75-L1FG676I is suitable for data-acquisition equipment requiring parallel data collection, timing control, and flexible digital preprocessing. Its 408 user I/O can accommodate multi-channel digital inputs, trigger lines, counter inputs, and test interfaces, while 74,637 logic cells can implement acquisition sequencing, filtering, packet assembly, and buffer management. The 1 V core supplies a compact logic fabric, and the 27 x 27 mm FBGA keeps the device size manageable on a multilayer instrument board. Placement should prioritize clean grounding and short paths between the FPGA, converters, and memory interfaces.
מומלץ
Communications and Network Interface
The AMD/Xilinx XC6SLX75-L1FG676I can implement communication line rates, protocol bridges, packet processors, and test equipment where 408 I/O and substantial programmable logic are more valuable than a fixed function. The Spartan-6 LX fabric supports parallel datapaths, framing logic, state machines, FIFOs, and interface-specific control. Designers can pair it with Ethernet PHYs or differential transceiver circuitry while keeping high-speed routing short and controlled. Because the FBGA provides 676 connections, signal-integrity planning should include return-path continuity, layer transitions, and separation between high-speed nets and sensitive control circuitry.
מומלץ
Video and Image Processing
The XC6SLX75-L1FG676I is appropriate for embedded video systems that require parallel pixel input, timing generation, control, and real-time processing in one programmable component. Its 74,637 logic cells can support pixel pipelines, color conversion, deinterlacing, overlay composition, and test-pattern generation, while 408 I/O provide extensive parallel connectivity to image sensors or display controllers. The 1 V core and 45 nm CMOS process suit high-density embedded implementations. The 676-ball FBGA demands careful BGA fan-out and layer planning, particularly when video clocks and high-speed parallel data must reach the device with controlled timing.
מומלץ
Embedded Processing Platform
The AMD/Xilinx XC6SLX75-L1FG676I works well as the programmable fabric around a processor subsystem in embedded equipment. Its logic resources can implement peripheral bridges, boot control, watchdog logic, interrupt aggregation, memory arbitration, and accelerator pipelines, while 408 I/O connect external processors, memories, and control devices. The large FBGA provides enough physical connectivity for these mixed functions without forcing a redesign around a smaller package. Engineering teams should partition deterministic logic into the FPGA, reserve board resources for configuration access, and verify all voltage domains against the Spartan-6 power architecture.
מומלץ
Aerospace and Defense Test Equipment
The XC6SLX75-L1FG676I can support laboratory and ground-support test systems that require extensive programmable logic, industrial-grade ordering, and high I/O density. Its 74,637 logic cells and 408 user I/O are useful for pattern generation, timing control, fault injection, data capture, and communication translation. The -L1 ordering code identifies an industrial-grade variant, making it more appropriate than a commercial-grade ordering code when the system specification calls for an extended temperature range. Qualification, screening, traceability, and the exact operating environment remain separate procurement and engineering requirements.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC6SLX75-L1FG676I — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC6SLX75-L1FGG676I | XC6SLX75-L1FGG676C | XC6SLX75-L1FG676C | XC6SLX75-2FG676I | XC6SLX75-2FGG676I |
|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 | FBGA-676 |
| FPGA Family | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX | Spartan-6 LX |
| Speed Grade | L1 | L1 | L1 | L1 | 2 | 2 |
| Temperature Grade | Industrial | Industrial | Commercial | Commercial | Industrial | Industrial |
מבדילים עיקריים
- Direct industrial-grade ordering option (לעומתXC6SLX75-L1FGG676C)
- Full 408-I/O interface capacity (לעומתXC6SLX75-2FG676I)
- Closest package-preserving family option (לעומתXC6SLX75-L1FGG676I)
- High-density logic and I/O in one 27 x 27 mm package (לעומתXC6SLX100-2FG484C)
הערות תכנון
Design the supply network from the package-specific VCCINT, VCCAUX, and other assigned power balls rather than distributing a generic 1 V rail indiscriminately. Place the required high-frequency capacitors immediately adjacent to their associated supply and ground balls, use short plane connections, and provide separate paths for core and auxiliary supplies wherever the Spartan-6 architecture requires them. Validate the final rail impedances and decoupling arrangement under the intended switching activity, especially for designs using adjacent high-speed I/O.
The 676-ball FBGA requires a multilayer PCB with short BGA escape paths and controlled impedance. Route each signal ball through the minimum practical number of layer transitions, keep clock and high-speed nets away from noisy power regions, and provide via-in-pad or microvia structures when the assembly process and mechanical design permit. Check the official package drawing for ball location and solder-mask or land-pattern conventions before generating the footprint; a generic FBGA footprint can introduce escape-routing and assembly errors.
FPGA power and I/O activity both contribute to junction heating, so thermal design should be based on actual utilization rather than logic-cell count alone. Spread core, auxiliary, and I/O supply connections across the package's assigned balls, use a balanced multilayer power grid, and provide thermal copper beneath and around the device. Use the package thermal data and the design's estimated switching activity to determine whether additional airflow, heat spreading, or board-area changes are necessary.
Do not treat every XC6SLX75 ordering code as interchangeable. The -L1 and -2 portions denote different speed grades, while the final characters can distinguish package and temperature-grade ordering variants. A replacement also requires compatible configuration behavior, supply sequencing, bank constraints, and pin assignments. Before substitution, select the exact device in the FPGA tool, rerun synthesis and implementation, complete static timing analysis, and verify that the generated configuration file targets the production component.
מידע על תאימות
The family comparison identifies the XC6SLX75-L1FG676I as lead-free. No specific RoHS, REACH, halogen-free, or conflict-minerals declaration was established for the exact ordering code.