10M50DCF484I6G vs 10M50DAF484I7G तुलना
विस्तृत दोनों ओर की तुलना 10M50DCF484I6G द्वारा Intel और 10M50DAF484I7G द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | 10M50DCF484I6G | 10M50DAF484I7G |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | MAX 10 FPGA | MAX 10 |
| Logic Elements | 50,000 | — |
| Adaptive Logic Modules (ALMs) | 25,000 | — |
| Embedded Memory (RAM) | 1,638 Kbit | — |
| User Flash | 512 Kbyte (4,096 Kbit) | — |
| Total Embedded Memory | 2,140 Kbit (RAM + UFM) | — |
| 18x18 Multipliers | 144 | — |
| General-Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Hard PCIe Gen2 Controllers | 1 (x1) | — |
| On-chip ADC | 12-bit, 1 Msps SAR, up to 18 channels | — |
| User I/O Pins | 360 | — |
| Supply Voltage - Core | 1.2 V | 1.2 V |
| Supply Voltage - I/O | 1.2 V to 3.3 V | — |
| ऑपरेटिंग जंक्शन तापमान | -40C to +100C (industrial) | — |
| पैकेज | 484-ball FineLine BGA (F484) | 484-ball FBGA (F484) |
| Configuration Memory | On-chip non-volatile (dual image) | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (FBGA) |
| RoHS स्थिति | Compliant | Compliant |
| Logic Elements (LE) | — | 50,000 |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| PLLs | — | 4 |
| Configuration Mode | — | Single-chip (no external boot device required) |
| MSL स्तर | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |