10M50DCF484I6G vs 10M50DAF484I7G Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M50DCF484I6G disebabkan oleh Intel dan 10M50DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 10M50DCF484I6G 10M50DAF484I7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX 10 FPGA MAX 10
Logic Elements 50,000 —
Adaptive Logic Modules (ALMs) 25,000 —
Embedded Memory (RAM) 1,638 Kbit —
User Flash 512 Kbyte (4,096 Kbit) —
Total Embedded Memory 2,140 Kbit (RAM + UFM) —
18x18 Multipliers 144 —
General-Purpose PLLs 4 —
Global Clock Networks 20 —
Hard PCIe Gen2 Controllers 1 (x1) —
On-chip ADC 12-bit, 1 Msps SAR, up to 18 channels —
User I/O Pins 360 —
Supply Voltage - Core 1.2 V 1.2 V
Supply Voltage - I/O 1.2 V to 3.3 V —
Suhu Hubungan Operasi -40C to +100C (industrial) —
Kemasan 484-ball FineLine BGA (F484) 484-ball FBGA (F484)
Configuration Memory On-chip non-volatile (dual image) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (FBGA)
Status RoHS Compliant Compliant
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded User Flash (bits) — 1,677,312 (dual configuration)
User I/O Count — 360
Package Pitch — 1.0 mm
Package Body Size — 23 x 23 mm
Process Technology — TSMC 55 nm
Operating Temperature Grade — Industrial (-40C to +100C)
On-die Configuration Flash — Yes (dual-boot)
Integrated ADC — 12-bit, 1 MSPS, up to 18 channels
DSP Blocks — 144 (18x18 multipliers)
PLLs — 4
Configuration Mode — Single-chip (no external boot device required)
Aras MSL — 3 (per JEDEC J-STD-020)
Lead-free / Halogen-free — Yes / Yes

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