A3P600-1FGG484I vs A3P600-1FGG484 तुलना
विस्तृत दोनों ओर की तुलना A3P600-1FGG484I द्वारा Microchip Technology और A3P600-1FGG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3P600-1FGG484I - 600K Gate Flash FPGA 235 I/O | Microchip
A3P600-1FGG484I ✓ सक्रियMicrochip Technology
A3P600-1FGG484 - 600K Gate ProASIC3 FPGA, 235 I/O | Microchip
A3P600-1FGG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3P600-1FGG484I | A3P600-1FGG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3 | ProASIC3 |
| System Gates | 600000 | 600,000 |
| VersaTiles (D-flip-flops) | 13824 | — |
| User I/Os | 235 | — |
| पैकेज | 484-ball FBGA (FGG484) | 484-ball FBGA (FGG484) |
| Speed Grade | -1 | -1 |
| Core Voltage | 1.5 V | 1.5 V |
| Technology | 130 nm flash process | — |
| Logic Architecture | VersaTile (LUT / D-flip-flop / latch) | — |
| Configuration Memory | On-chip flash (nonvolatile, single chip) | Nonvolatile flash (single chip) |
| System Performance | Up to approx. 231 MHz (per Utmel family comparison) | — |
| I/O Banks | 4 (A3P600 per Microchip migration note) | 4 |
| ऑपरेटिंग तापमान | Industrial (-40C to +100C), I suffix | [DATA_NEEDED: Operating Temperature Range] |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Reprogrammability | Live reprogrammable (in-system) | — |
| Number of Dedicated RAM Blocks | [DATA_NEEDED: embedded memory blocks] | — |
| Max User Flash Memory | [DATA_NEEDED: embedded flash capacity] | — |
| DLL/PLL Resources | [DATA_NEEDED: clock conditioning resources] | — |
| Logic Elements / VersaTiles | — | 13824 |
| User I/O | — | 235 |
| Embedded Memory | — | 110592 |
| Maximum System Frequency | — | 272 MHz |
| Process Technology | — | 130 nm CMOS flash |
| RoHS स्थिति | — | Compliant |
| Design Software | — | Microchip Libero SoC |
| Packaging | — | Tray |