A3P600L-FG484I vs A3P600L-FG484 तुलना
विस्तृत दोनों ओर की तुलना A3P600L-FG484I द्वारा Microchip Technology और A3P600L-FG484 द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3P600L-FG484I - ProASIC3L Flash FPGA 600K Gates | Microchip
A3P600L-FG484I ✓ सक्रियMicrochip Technology
A3P600L-FG484 - ProASIC3L Low Power FPGA 600K Gates | Microchip
A3P600L-FG484 ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3P600L-FG484I | A3P600L-FG484 |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3L | ProASIC3L (Flash FPGAs) |
| System Gates | 600000 | 600000 |
| Logic Cells | 13824 | — |
| User I/O | 235 | — |
| Core Voltage | 1.2 V to 1.5 V | — |
| Technology | 130 nm flash CMOS | CMOS, non-volatile flash based |
| पैकेज | 484-ball FBGA (FG484) | 484-FBGA (23 x 23 mm, 1.0 mm pitch, 2.23 mm height) |
| Package Dimensions | 23 x 23 mm, 1.0 mm ball pitch | — |
| Package Height | 2.23 mm | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| Configuration Memory | Nonvolatile flash, single-chip, Instant On | — |
| Temperature Grade | I (Industrial) | — |
| ऑपरेटिंग तापमान | [DATA_NEEDED: exact operating temperature range] | 0C to +85C (TJ) |
| Supply Voltage - I/O | [DATA_NEEDED: I/O bank voltage range] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM capacity] | — |
| Reprogrammability | Yes, in-system reprogrammable flash fabric | — |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance status] | Non-compliant (per Microchip USA listing) |
| MSL स्तर | [DATA_NEEDED: moisture sensitivity level] | — |
| Logic Cells / CLBs | — | 13824 |
| Total RAM Bits | — | 110592 |
| User I/Os | — | 235 |
| Core Supply Voltage | — | 1.14 V to 1.575 V |
| Max Operating Frequency | — | 350 MHz (family rating) |
| Special Features | — | Flash*Freeze low-power standby technology |
| Configuration | — | Single-chip, on-chip flash (no external boot device) |
| Packaging | — | Tray |
| Manufacturer Lead Time | — | 8 weeks |
| Product Status | — | Active |