A3PE3000L-1FG324I vs A3PE3000L-FGG324I तुलना
विस्तृत दोनों ओर की तुलना A3PE3000L-1FG324I द्वारा Microchip Technology और A3PE3000L-FGG324I द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
A3PE3000L-1FG324I - 3M Gate Low Power Flash FPGA | Microchip
A3PE3000L-1FG324I ✓ सक्रियMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ सक्रियविशेषता तुलना
| पैरामीटर | A3PE3000L-1FG324I | A3PE3000L-FGG324I |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Family | ProASIC3L Low Power Flash FPGA | ProASIC3L (Flash FPGA) |
| System Gates | 3000000 | 3,000,000 |
| Logic Elements | 35K LEs (75264 D-flip-flops equivalent family density) | — |
| User I/O | 221 | 221 |
| Total RAM Bits | 516096 | 516096 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| I/O Voltage | 1.2 V to 1.5 V (family range) | — |
| Speed Grade | -1 | — |
| Process Technology | 130 nm CMOS flash | 130 nm CMOS |
| Configuration Memory | Non-volatile on-chip flash (single chip, secure) | — |
| Low Power Feature | Flash*Freeze technology | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial, I suffix) | -40C to +100C (industrial) |
| पैकेज | 324-ball FBGA (FG324) | 324-BGA FBGA (19x19 mm) |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (SMD) |
| Dynamic Power Reduction | Up to 40% vs ProASIC3 | — |
| Static Power Reduction | Up to 50% vs ProASIC3 | — |
| Max Family Performance | 892.86 MHz class (130 nm ProASIC3EL family) | — |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Packaging | — | Tray |
| Lead Free Status | — | Lead Free |
| RoHS स्थिति | — | RoHS Compliant |
| Number of Package Balls | — | 324 |