ATSAMA5D22C-CUR vs ATSAMA5D225C-D1M-CU तुलना
विस्तृत दोनों ओर की तुलना ATSAMA5D22C-CUR द्वारा Microchip Technology और ATSAMA5D225C-D1M-CU द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
ATSAMA5D22C-CUR - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip
ATSAMA5D22C-CUR ✓ सक्रियMicrochip Technology
ATSAMA5D225C-D1M-CU - 500MHz Cortex-A5 MPU w/ 128Mb DDR2 SiP | Microchip
ATSAMA5D225C-D1M-CU ✓ सक्रियविशेषता तुलना
| पैरामीटर | ATSAMA5D22C-CUR | ATSAMA5D225C-D1M-CU |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | सक्रिय |
| Manufacturer | Microchip Technology | — |
| Series | SAMA5D2 | — |
| Core Architecture | ARM Cortex-A5 (ARMv7-A) | — |
| Core Count | 1 | — |
| डेटा बस चौड़ाई | 32-bit | — |
| Maximum CPU Clock | 500 MHz | 500 MHz |
| L1 Cache | 32 KB I-cache + 32 KB D-cache | — |
| L2 Cache | 128 KB | — |
| External Memory Support | DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC | — |
| पैकेज | 196-TFBGA (11x11 mm, 0.8 mm pitch) | 196-ball TFBGA 11x11 mm, 0.8 mm pitch |
| ऑपरेटिंग तापमान | -40C to +85C (industrial) | -40C to +85C (Industrial, IND TEMP) |
| सप्लाई वोल्टेज | [DATA_NEEDED: VDD_CORE / VDD_IO range] | 1.2 V core (per typical SiP) |
| Backup Mode Current | ~5 uA (with RTC retention) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| MSL स्तर | [DATA_NEEDED: MSL rating] | — |
| RoHS स्थिति | Compliant | Compliant (Green, lead-free) |
| Hardware Cryptography | AES, SHA, TRNG (per datasheet) | — |
| USB | USB 2.0 High-Speed Host + Device | 1x HSIC, 1x USB 2.0 HS Host/Device |
| Core Processor | — | ARM Cortex-A5 |
| Number of Cores | — | 1 Core, 32-Bit |
| Integrated DRAM | — | 128 Mbit DDR2 SDRAM (SiP) |
| ROM / Boot Code | — | 160 KB ROM |
| Graphics Acceleration | — | Yes (LCD controller up to WXGA 1366x768) |
| RAM Controllers | — | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI |
| Ethernet | — | 10/100/1000 GMAC |
| CAN | — | CAN-FD |
| Security | — | Arm TrustZone, secure boot, tamper detection, AES/SHA/TRNG |
| Touch Controller | — | Peripheral Touch Controller (PTC) integrated |
| Audio | — | Embedded audio subsystem (I2S, Class-D amplifier) |