ATSAMR30-XPRO vs ATSAM4CP16C-EK तुलना
विस्तृत दोनों ओर की तुलना ATSAMR30-XPRO द्वारा Microchip Technology और ATSAM4CP16C-EK द्वारा Microchip Technology. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
Microchip Technology
ATSAMR30-XPRO - SAM R30 Xplained Pro Sub-GHz 802.15.4 Eval Kit | Microchip
ATSAMR30-XPRO ✓ सक्रियMicrochip Technology
ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip
ATSAM4CP16C-EK Obsoleteविशेषता तुलना
| पैरामीटर | ATSAMR30-XPRO | ATSAM4CP16C-EK |
|---|---|---|
| ब्रांड | Microchip Technology | Microchip Technology |
| श्रेणी | Development Boards | Development Boards |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Product Type | Wireless evaluation / development kit | MCU 32-Bit Evaluation Board |
| Target SoC | ATSAMR30G18A | — |
| Core Architecture | ARM Cortex-M0+ (32-bit) | — |
| Flash Memory | 256 KB | 1 MB embedded |
| SRAM | 40 KB | 128 KB plus on-chip cache |
| Main CPU Clock | 16 MHz | — |
| Low-Power Crystal | 32.768 kHz | — |
| Radio Standard | IEEE 802.15.4 | — |
| Frequency Bands | 780 MHz (China) / 868 MHz (Europe) - sub-GHz ISM | — |
| Integrated Antenna | PCB trace antenna on-board | — |
| Debug Interface | Embedded debugger (EDBG) over USB | — |
| Virtual COM Port | USB CDC (via EDBG) | — |
| Extension Headers | 2x Xplained Pro EXT (20-pin, 100 mil) | — |
| USB Connector | USB micro-B (5 V input) | — |
| Supported IDEs | Atmel Studio, MPLAB X IDE | — |
| Supported Stacks | MiWi, 6LoWPAN, Thread (via Atmel Studio examples) | — |
| Operating System Support | Win XP / Vista / Win 7 / 8 / 10 / Server 2012 | — |
| RoHS स्थिति | Compliant | [DATA_NEEDED: RoHS Status] |
| Target Device | — | ATSAM4CP16C (SAM4CP series) |
| Core | — | Dual-core 32-bit ARM Cortex-M4 |
| Core Speed | — | 120 MHz per core |
| Crypto Engine | — | Advanced cryptographic engine |
| PLC Modem | — | G3-PLC modem |
| PLC Profiles | — | CENELEC, ARIB, FCC |
| Supported Standards | — | G3-PLC specification |
| Architecture | — | Stacked dies (per distributor data) |
| Series | — | SAM4CP |
| Board Category | — | Embedded MCU, DSP Evaluation Boards |
| Packaging | — | Box |
| ऑपरेटिंग तापमान | — | [DATA_NEEDED: Operating Temperature] |
| Board Dimensions | — | [DATA_NEEDED: Board Dimensions] |