ATSAMR30-XPRO vs ATSAM4CP16C-EK موازنہ
تفصیلی ساتھ ساتھ موازنہ از ATSAMR30-XPRO بذریعہ Microchip Technology اور ATSAM4CP16C-EK بذریعہ Microchip Technology. اہم خصوصیات، برقی پیرامیٹرز، پیکیجنگ، لائف سائیکل اسٹیٹس، قیمتوں اور دستیابی کا موازنہ کریں تاکہ آپ کی ڈیزائن ضروریات کے لیے بہترین کمپوننٹ کا تعین ہو سکے۔
Microchip Technology
ATSAMR30-XPRO - SAM R30 Xplained Pro Sub-GHz 802.15.4 Eval Kit | Microchip
ATSAMR30-XPRO ✓ فعالMicrochip Technology
ATSAM4CP16C-EK - SAM4CP Dual Cortex-M4 Eval Board | Microchip
ATSAM4CP16C-EK Obsoleteخصوصیات کا موازنہ
| پیرامیٹر | ATSAMR30-XPRO | ATSAM4CP16C-EK |
|---|---|---|
| برانڈ | Microchip Technology | Microchip Technology |
| زمرہ | Development Boards | Development Boards |
| لائف سائیکل کی حالت | فعال | Obsolete |
| Product Type | Wireless evaluation / development kit | MCU 32-Bit Evaluation Board |
| Target SoC | ATSAMR30G18A | — |
| Core Architecture | ARM Cortex-M0+ (32-bit) | — |
| Flash Memory | 256 KB | 1 MB embedded |
| SRAM | 40 KB | 128 KB plus on-chip cache |
| Main CPU Clock | 16 MHz | — |
| Low-Power Crystal | 32.768 kHz | — |
| Radio Standard | IEEE 802.15.4 | — |
| Frequency Bands | 780 MHz (China) / 868 MHz (Europe) - sub-GHz ISM | — |
| Integrated Antenna | PCB trace antenna on-board | — |
| Debug Interface | Embedded debugger (EDBG) over USB | — |
| Virtual COM Port | USB CDC (via EDBG) | — |
| Extension Headers | 2x Xplained Pro EXT (20-pin, 100 mil) | — |
| USB Connector | USB micro-B (5 V input) | — |
| Supported IDEs | Atmel Studio, MPLAB X IDE | — |
| Supported Stacks | MiWi, 6LoWPAN, Thread (via Atmel Studio examples) | — |
| Operating System Support | Win XP / Vista / Win 7 / 8 / 10 / Server 2012 | — |
| RoHS اسٹیٹس | Compliant | [DATA_NEEDED: RoHS Status] |
| Target Device | — | ATSAM4CP16C (SAM4CP series) |
| Core | — | Dual-core 32-bit ARM Cortex-M4 |
| Core Speed | — | 120 MHz per core |
| Crypto Engine | — | Advanced cryptographic engine |
| PLC Modem | — | G3-PLC modem |
| PLC Profiles | — | CENELEC, ARIB, FCC |
| Supported Standards | — | G3-PLC specification |
| Architecture | — | Stacked dies (per distributor data) |
| Series | — | SAM4CP |
| Board Category | — | Embedded MCU, DSP Evaluation Boards |
| Packaging | — | Box |
| آپریٹنگ درجہ حرارت | — | [DATA_NEEDED: Operating Temperature] |
| Board Dimensions | — | [DATA_NEEDED: Board Dimensions] |